Deliverables
This plan will detail the dissemination strategy for the project overall, indicating the audiences to be addressed, the type of contents to be covered, and the related means for dissemination. Also, for M7-18 it will detail the concrete measures planned, and for M19-36 the measures envisaged provisonally.
1st Report on ASC processes monitoring and business effectiveness monitoringCovers M1-M9
Report on ASCs CapabilitiesReport on ASCs capabilities will be given, including infrastructure already present at the ASCs institutes, available software design tools, exchange server will run for technical document sharing and various (technical and economic) issues tracking, training courses followed by ASCs representatives and their experience.
Project web siteAn overview of the project is published on the project website for raising public awareness and informing potential users on the available support. Also the consortium partners and their roles will be presented.
2nd Plan for using and disseminating knowledge and resultsThe first plan will be updated in the light of activities of WP4 and steering committee findings. Also, it will detail the concrete measures planned already for M19-36.
1st Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M1-M9
Uniform working protocol for the JePPIX application support centresThe uniform working protocol for the JePPIX application support centres will be elaborated and proposed, including step-by-step procedure to support development of photonic ASICs for external users. This shall be related to feasibility study, choice of technology, assuring technical support with right software tools and know-how, advice on the value chain for possible volume request.
2nd Report on ASC processes monitoring and business effectiveness monitoringCovers M10-M18
2nd Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M10-M18
3rd Report on ASC processes monitoring and business effectiveness monitoringCovers M19-M42
3rd Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M19-M36
Data management planThe data management plan will identify format and ownership for data generated within the project, and identify appropriate material for wider dissemination to a broad audience. Strategies for sharing project findings with other integrated photonics and optics initiatives will be identified.
Project registration systemProject public website and portal for file sharing are delivered. The website will serve as an entry point for SMEs and businesses seeking to upskill within PIC technologies. Additionally this provides an internal resource for the project partners and users.
Includes in particular project presentations for the general public and the targeted users.
3rd Communication KitFocus is on the main project achievements and the expected benefits. The project presentations will be updated as appropriate.
2nd Communication KitFocus is on the offers in place and the other main achievements so far. The project presentations will be updated as appropriate.
Publications
Author(s):
Dolmans SAM, Walrave B, Read S, van Stijn N
Published in:
Technology Transfer Society Annual Conference, 17-19 October 2018, Valencia, Spain, 2018
Publisher:
Technology Transfer Society
Author(s):
Daniele Melati, Andrea Melloni
Published in:
International Trade Fair A&T, Issue Turin 2017, 2017
Publisher:
International Trade Fair A&T
Author(s):
Moritz Baier, Francisco M. Soares, Marko Gruner, Tom Gaertner, Martin Moehrle, Norbert Grote, Martin Schell
Published in:
CSW 2017, Issue CSW 2017, 2017
Publisher:
CSW 2017 Proceedings
Author(s):
M. Baier, F.M. Soares, M. Schell and N. Grote
Published in:
CSW 2017, Issue CSW 2017, 2017
Publisher:
CSW Proceedings
Author(s):
Martijn J. R. Heck
Published in:
Danish Optical Society Annual Meeting, Issue Annual, 2016, Page(s) p. 8 (of 38)
Publisher:
DOPS - Danish Optical Society
Author(s):
Apostolopoulos Dimitris; Bakopoulos Paraskevas
Published in:
PetaCloud International Symposium, Issue 1, 2017
Publisher:
Israel Innovation Authority
DOI:
10.5281/zenodo.835539
Author(s):
Adrian Wonfor, Qixiang Cheng, Richard V. Penty, Ian H. White
Published in:
2016 IEEE Photonics Conference (IPC), 2016, Page(s) 226-227, ISBN 978-1-5090-1906-9
Publisher:
IEEE
DOI:
10.1109/ipcon.2016.7831053
Author(s):
an White , Minsheng Ding , Adrian Wonfor , Q. Cheng , Richard V. Penty
Published in:
IEEE Photonic Networks and Devices 2017, 2017
Publisher:
IEEE
Author(s):
Adrian Wonfor
Published in:
Photonics & Opto-Electronics Packaging Conference, 2016
Publisher:
pOp 2016
Author(s):
Richard V. Penty , Minsheng Ding , Adrian Wonfor , Ian H. White
Published in:
IEEE Photonics in Switching 2017, 2017
Publisher:
IEEE
Author(s):
Pascual Muñoz
Published in:
Optical Fiber Communications Conference and Exhibition (OFC), 2017, 2017, ISBN 978-1-9435-8023-1
Publisher:
Optical Fiber Communications Conference and Exhibition (OFC), 2017
Author(s):
Daniele Melati, Andrea Melloni
Published in:
Societa Italiana Di Elettromagnetismo, Issue 2017, 2017
Publisher:
SIEM
Author(s):
Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams
Published in:
PIC Magazine, Issue Issue 1 - June 2016, 2016
Publisher:
Published by: Angel Business Communications Ltd, 6 Bow Court, Fletchworth Gate, Burnsall Rd, Coventry CV5 6SP
Author(s):
Martijn Heck
Published in:
LinkedIn, Issue 2016, 2016
Publisher:
LinkedIn
Author(s):
Ruben Alemany, Pascual Munoz
Published in:
Secpho Newsletter, Issue 2017, 2017
Publisher:
Secpho Newsletter
Author(s):
Daniele Melati, Andrea Melloni
Published in:
Fotonica 2016, Issue 2016, 2016
Publisher:
Fotonica
Author(s):
Carlos Lee
Published in:
Laser Focus World, Issue August 2016, 2016
Publisher:
Laser Focus World Magazine
Author(s):
Frédéric Grillot
Published in:
2016
Publisher:
LinkedIn
Author(s):
Kevin Schires, Sandra Gomez, Antonin Gallet, Guang-Hua Duan, Frederic Grillot
Published in:
IEEE Journal of Selected Topics in Quantum Electronics, Issue 23/6, 2017, Page(s) 1-9, ISSN 1077-260X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/JSTQE.2017.2732830
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