Resultado final
This plan will detail the dissemination strategy for the project overall, indicating the audiences to be addressed, the type of contents to be covered, and the related means for dissemination. Also, for M7-18 it will detail the concrete measures planned, and for M19-36 the measures envisaged provisonally.
1st Report on ASC processes monitoring and business effectiveness monitoringCovers M1-M9
Report on ASCs CapabilitiesReport on ASCs capabilities will be given, including infrastructure already present at the ASCs institutes, available software design tools, exchange server will run for technical document sharing and various (technical and economic) issues tracking, training courses followed by ASCs representatives and their experience.
Project web siteAn overview of the project is published on the project website for raising public awareness and informing potential users on the available support. Also the consortium partners and their roles will be presented.
2nd Plan for using and disseminating knowledge and resultsThe first plan will be updated in the light of activities of WP4 and steering committee findings. Also, it will detail the concrete measures planned already for M19-36.
1st Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M1-M9
Uniform working protocol for the JePPIX application support centresThe uniform working protocol for the JePPIX application support centres will be elaborated and proposed, including step-by-step procedure to support development of photonic ASICs for external users. This shall be related to feasibility study, choice of technology, assuring technical support with right software tools and know-how, advice on the value chain for possible volume request.
2nd Report on ASC processes monitoring and business effectiveness monitoringCovers M10-M18
2nd Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M10-M18
3rd Report on ASC processes monitoring and business effectiveness monitoringCovers M19-M42
3rd Report on dissemination and scouting activities and their impact in terms of new users and collaborationCovers M19-M36
Data management planThe data management plan will identify format and ownership for data generated within the project, and identify appropriate material for wider dissemination to a broad audience. Strategies for sharing project findings with other integrated photonics and optics initiatives will be identified.
Project registration systemProject public website and portal for file sharing are delivered. The website will serve as an entry point for SMEs and businesses seeking to upskill within PIC technologies. Additionally this provides an internal resource for the project partners and users.
Includes in particular project presentations for the general public and the targeted users.
3rd Communication KitFocus is on the main project achievements and the expected benefits. The project presentations will be updated as appropriate.
2nd Communication KitFocus is on the offers in place and the other main achievements so far. The project presentations will be updated as appropriate.
Publicaciones
Autores:
Dolmans SAM, Walrave B, Read S, van Stijn N
Publicado en:
Technology Transfer Society Annual Conference, 17-19 October 2018, Valencia, Spain, 2018
Editor:
Technology Transfer Society
Autores:
Daniele Melati, Andrea Melloni
Publicado en:
International Trade Fair A&T, Edición Turin 2017, 2017
Editor:
International Trade Fair A&T
Autores:
Moritz Baier, Francisco M. Soares, Marko Gruner, Tom Gaertner, Martin Moehrle, Norbert Grote, Martin Schell
Publicado en:
CSW 2017, Edición CSW 2017, 2017
Editor:
CSW 2017 Proceedings
Autores:
M. Baier, F.M. Soares, M. Schell and N. Grote
Publicado en:
CSW 2017, Edición CSW 2017, 2017
Editor:
CSW Proceedings
Autores:
Martijn J. R. Heck
Publicado en:
Danish Optical Society Annual Meeting, Edición Annual, 2016, Página(s) p. 8 (of 38)
Editor:
DOPS - Danish Optical Society
Autores:
Apostolopoulos Dimitris; Bakopoulos Paraskevas
Publicado en:
PetaCloud International Symposium, Edición 1, 2017
Editor:
Israel Innovation Authority
DOI:
10.5281/zenodo.835539
Autores:
Adrian Wonfor, Qixiang Cheng, Richard V. Penty, Ian H. White
Publicado en:
2016 IEEE Photonics Conference (IPC), 2016, Página(s) 226-227, ISBN 978-1-5090-1906-9
Editor:
IEEE
DOI:
10.1109/ipcon.2016.7831053
Autores:
an White , Minsheng Ding , Adrian Wonfor , Q. Cheng , Richard V. Penty
Publicado en:
IEEE Photonic Networks and Devices 2017, 2017
Editor:
IEEE
Autores:
Adrian Wonfor
Publicado en:
Photonics & Opto-Electronics Packaging Conference, 2016
Editor:
pOp 2016
Autores:
Richard V. Penty , Minsheng Ding , Adrian Wonfor , Ian H. White
Publicado en:
IEEE Photonics in Switching 2017, 2017
Editor:
IEEE
Autores:
Pascual Muñoz
Publicado en:
Optical Fiber Communications Conference and Exhibition (OFC), 2017, 2017, ISBN 978-1-9435-8023-1
Editor:
Optical Fiber Communications Conference and Exhibition (OFC), 2017
Autores:
Daniele Melati, Andrea Melloni
Publicado en:
Societa Italiana Di Elettromagnetismo, Edición 2017, 2017
Editor:
SIEM
Autores:
Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams
Publicado en:
PIC Magazine, Edición Edición 1 - June 2016, 2016
Editor:
Published by: Angel Business Communications Ltd, 6 Bow Court, Fletchworth Gate, Burnsall Rd, Coventry CV5 6SP
Autores:
Martijn Heck
Publicado en:
LinkedIn, Edición 2016, 2016
Editor:
LinkedIn
Autores:
Ruben Alemany, Pascual Munoz
Publicado en:
Secpho Newsletter, Edición 2017, 2017
Editor:
Secpho Newsletter
Autores:
Daniele Melati, Andrea Melloni
Publicado en:
Fotonica 2016, Edición 2016, 2016
Editor:
Fotonica
Autores:
Carlos Lee
Publicado en:
Laser Focus World, Edición August 2016, 2016
Editor:
Laser Focus World Magazine
Autores:
Frédéric Grillot
Publicado en:
2016
Editor:
LinkedIn
Autores:
Kevin Schires, Sandra Gomez, Antonin Gallet, Guang-Hua Duan, Frederic Grillot
Publicado en:
IEEE Journal of Selected Topics in Quantum Electronics, Edición 23/6, 2017, Página(s) 1-9, ISSN 1077-260X
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/JSTQE.2017.2732830
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