Photonic Integrated Circuits Accessible to Everyone

Risultati finali

1st Plan for using and disseminating knowledge and results

This plan will detail the dissemination strategy for the project overall, indicating the audiences to be addressed, the type of contents to be covered, and the related means for dissemination. Also, for M7-18 it will detail the concrete measures planned, and for M19-36 the measures envisaged provisonally.

1st Report on ASC processes monitoring and business effectiveness monitoring

Covers M1-M9

Report on ASCs Capabilities

Report on ASCs capabilities will be given, including infrastructure already present at the ASCs institutes, available software design tools, exchange server will run for technical document sharing and various (technical and economic) issues tracking, training courses followed by ASCs representatives and their experience.

Project web site

An overview of the project is published on the project website for raising public awareness and informing potential users on the available support. Also the consortium partners and their roles will be presented.

2nd Plan for using and disseminating knowledge and results

The first plan will be updated in the light of activities of WP4 and steering committee findings. Also, it will detail the concrete measures planned already for M19-36.

1st Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M1-M9

Uniform working protocol for the JePPIX application support centres

The uniform working protocol for the JePPIX application support centres will be elaborated and proposed, including step-by-step procedure to support development of photonic ASICs for external users. This shall be related to feasibility study, choice of technology, assuring technical support with right software tools and know-how, advice on the value chain for possible volume request.

2nd Report on ASC processes monitoring and business effectiveness monitoring

Covers M10-M18

2nd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M10-M18

3rd Report on ASC processes monitoring and business effectiveness monitoring

Covers M19-M42

3rd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M19-M36

Data management plan

The data management plan will identify format and ownership for data generated within the project, and identify appropriate material for wider dissemination to a broad audience. Strategies for sharing project findings with other integrated photonics and optics initiatives will be identified.

Project registration system

Project public website and portal for file sharing are delivered. The website will serve as an entry point for SMEs and businesses seeking to upskill within PIC technologies. Additionally this provides an internal resource for the project partners and users.

1st Communication Kit

Includes in particular project presentations for the general public and the targeted users.

3rd Communication Kit

Focus is on the main project achievements and the expected benefits. The project presentations will be updated as appropriate.

2nd Communication Kit

Focus is on the offers in place and the other main achievements so far. The project presentations will be updated as appropriate.

Pubblicazioni

How engaging in technology transfer activities influences scientists: Learning to become boundary spanners

Autori: Dolmans SAM, Walrave B, Read S, van Stijn N
Pubblicato in: Technology Transfer Society Annual Conference, 17-19 October 2018, Valencia, Spain, 2018
Editore: Technology Transfer Society

La fotonica come tecnologia abilitante. Opportunita di accesso per le imprese e le universita attraverso il progetto PICs4All

Autori: Daniele Melati, Andrea Melloni
Pubblicato in: International Trade Fair A&T, Numero Turin 2017, 2017
Editore: International Trade Fair A&T

64 Gbit/s Generation from a Fully Integrated Serial 0.25 x 2.0 mm2 Dual-Polarization Electroabsorption Modulator PIC in InP

Autori: Moritz Baier, Francisco M. Soares, Marko Gruner, Tom Gaertner, Martin Moehrle, Norbert Grote, Martin Schell
Pubblicato in: CSW 2017, Numero CSW 2017, 2017
Editore: CSW 2017 Proceedings

TxRx InP PIC Integration Platform on Semi-insulating Substrate (invited)

Autori: M. Baier, F.M. Soares, M. Schell and N. Grote
Pubblicato in: CSW 2017, Numero CSW 2017, 2017
Editore: CSW Proceedings

Photonic integrated circuits: a new eco-system, a new paradigm

Autori: Martijn J. R. Heck
Pubblicato in: Danish Optical Society Annual Meeting, Numero Annual, 2016, Pagina/e p. 8 (of 38)
Editore: DOPS - Danish Optical Society

Photonics innovation accessible to everyone: ACTPHAST and PICS4ALL European projects

Autori: Apostolopoulos Dimitris; Bakopoulos Paraskevas
Pubblicato in: PetaCloud International Symposium, Numero 1, 2017
Editore: Israel Innovation Authority
DOI: 10.5281/zenodo.835539

Integrated optical switches and short pulse generation using a generic integration platform

Autori: Adrian Wonfor, Qixiang Cheng, Richard V. Penty, Ian H. White
Pubblicato in: 2016 IEEE Photonics Conference (IPC), 2016, Pagina/e 226-227, ISBN 978-1-5090-1906-9
Editore: IEEE
DOI: 10.1109/ipcon.2016.7831053

High Port Court Switch Architectures for Data Center Applications

Autori: an White , Minsheng Ding , Adrian Wonfor , Q. Cheng , Richard V. Penty
Pubblicato in: IEEE Photonic Networks and Devices 2017, 2017
Editore: IEEE

European Application Support Centres

Autori: Adrian Wonfor
Pubblicato in: Photonics & Opto-Electronics Packaging Conference, 2016
Editore: pOp 2016

Scaling of Low Energy InP SOA based Switches

Autori: Richard V. Penty , Minsheng Ding , Adrian Wonfor , Ian H. White
Pubblicato in: IEEE Photonics in Switching 2017, 2017
Editore: IEEE

Photonic integration in the palm of your hand: generic technology and multi-project wafers, technical roadblocks, challenges and evolution

Autori: Pascual Muñoz
Pubblicato in: Optical Fiber Communications Conference and Exhibition (OFC), 2017, 2017, ISBN 978-1-9435-8023-1
Editore: Optical Fiber Communications Conference and Exhibition (OFC), 2017

PICs4All project: open-access opportunities for photonic technologies

Autori: Daniele Melati, Andrea Melloni
Pubblicato in: Societa Italiana Di Elettromagnetismo, Numero 2017, 2017
Editore: SIEM

JePPIX: providing open access to photonic integration

Autori: Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams
Pubblicato in: PIC Magazine, Numero Numero 1 - June 2016, 2016
Editore: Published by: Angel Business Communications Ltd, 6 Bow Court, Fletchworth Gate, Burnsall Rd, Coventry CV5 6SP

Photonic technology is ready for the new Bill Gates or Steve Jobs

Autori: Martijn Heck
Pubblicato in: LinkedIn, Numero 2016, 2016
Editore: LinkedIn

Cadena de Valor de la Fotonica Integrada en Espana

Autori: Ruben Alemany, Pascual Munoz
Pubblicato in: Secpho Newsletter, Numero 2017, 2017
Editore: Secpho Newsletter

PICs4All project: ease the access to generic foundry technologies for photonic circuits

Autori: Daniele Melati, Andrea Melloni
Pubblicato in: Fotonica 2016, Numero 2016, 2016
Editore: Fotonica

EPIC launches 'PICs for everyone' resource in Europe

Autori: Carlos Lee
Pubblicato in: Laser Focus World, Numero August 2016, 2016
Editore: Laser Focus World Magazine

Enabling photonics technologies with PICs 4ALL

Autori: Frédéric Grillot
Pubblicato in: 2016
Editore: LinkedIn

Passive Chaos Bandwidth Enhancement Under Dual-Optical Feedback with Hybrid III–V/Si DFB Laser

Autori: Kevin Schires, Sandra Gomez, Antonin Gallet, Guang-Hua Duan, Frederic Grillot
Pubblicato in: IEEE Journal of Selected Topics in Quantum Electronics, Numero 23/6, 2017, Pagina/e 1-9, ISSN 1077-260X
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JSTQE.2017.2732830

Risultati finali

Pubblicazioni

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