Photonic Integrated Circuits Accessible to Everyone

Leistungen

1st Plan for using and disseminating knowledge and results

This plan will detail the dissemination strategy for the project overall, indicating the audiences to be addressed, the type of contents to be covered, and the related means for dissemination. Also, for M7-18 it will detail the concrete measures planned, and for M19-36 the measures envisaged provisonally.

1st Report on ASC processes monitoring and business effectiveness monitoring

Covers M1-M9

Report on ASCs Capabilities

Report on ASCs capabilities will be given, including infrastructure already present at the ASCs institutes, available software design tools, exchange server will run for technical document sharing and various (technical and economic) issues tracking, training courses followed by ASCs representatives and their experience.

Project web site

An overview of the project is published on the project website for raising public awareness and informing potential users on the available support. Also the consortium partners and their roles will be presented.

2nd Plan for using and disseminating knowledge and results

The first plan will be updated in the light of activities of WP4 and steering committee findings. Also, it will detail the concrete measures planned already for M19-36.

1st Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M1-M9

Uniform working protocol for the JePPIX application support centres

The uniform working protocol for the JePPIX application support centres will be elaborated and proposed, including step-by-step procedure to support development of photonic ASICs for external users. This shall be related to feasibility study, choice of technology, assuring technical support with right software tools and know-how, advice on the value chain for possible volume request.

2nd Report on ASC processes monitoring and business effectiveness monitoring

Covers M10-M18

2nd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M10-M18

3rd Report on ASC processes monitoring and business effectiveness monitoring

Covers M19-M42

3rd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M19-M36

Data management plan

The data management plan will identify format and ownership for data generated within the project, and identify appropriate material for wider dissemination to a broad audience. Strategies for sharing project findings with other integrated photonics and optics initiatives will be identified.

Project registration system

Project public website and portal for file sharing are delivered. The website will serve as an entry point for SMEs and businesses seeking to upskill within PIC technologies. Additionally this provides an internal resource for the project partners and users.

1st Communication Kit

Includes in particular project presentations for the general public and the targeted users.

3rd Communication Kit

Focus is on the main project achievements and the expected benefits. The project presentations will be updated as appropriate.

2nd Communication Kit

Focus is on the offers in place and the other main achievements so far. The project presentations will be updated as appropriate.

Veröffentlichungen

How engaging in technology transfer activities influences scientists: Learning to become boundary spanners

Autoren: Dolmans SAM, Walrave B, Read S, van Stijn N
Veröffentlicht in: Technology Transfer Society Annual Conference, 17-19 October 2018, Valencia, Spain, 2018
Herausgeber: Technology Transfer Society

La fotonica come tecnologia abilitante. Opportunita di accesso per le imprese e le universita attraverso il progetto PICs4All

Autoren: Daniele Melati, Andrea Melloni
Veröffentlicht in: International Trade Fair A&T, Ausgabe Turin 2017, 2017
Herausgeber: International Trade Fair A&T

64 Gbit/s Generation from a Fully Integrated Serial 0.25 x 2.0 mm2 Dual-Polarization Electroabsorption Modulator PIC in InP

Autoren: Moritz Baier, Francisco M. Soares, Marko Gruner, Tom Gaertner, Martin Moehrle, Norbert Grote, Martin Schell
Veröffentlicht in: CSW 2017, Ausgabe CSW 2017, 2017
Herausgeber: CSW 2017 Proceedings

TxRx InP PIC Integration Platform on Semi-insulating Substrate (invited)

Autoren: M. Baier, F.M. Soares, M. Schell and N. Grote
Veröffentlicht in: CSW 2017, Ausgabe CSW 2017, 2017
Herausgeber: CSW Proceedings

Photonic integrated circuits: a new eco-system, a new paradigm

Autoren: Martijn J. R. Heck
Veröffentlicht in: Danish Optical Society Annual Meeting, Ausgabe Annual, 2016, Seite(n) p. 8 (of 38)
Herausgeber: DOPS - Danish Optical Society

Photonics innovation accessible to everyone: ACTPHAST and PICS4ALL European projects

Autoren: Apostolopoulos Dimitris; Bakopoulos Paraskevas
Veröffentlicht in: PetaCloud International Symposium, Ausgabe 1, 2017
Herausgeber: Israel Innovation Authority
DOI: 10.5281/zenodo.835539

Integrated optical switches and short pulse generation using a generic integration platform

Autoren: Adrian Wonfor, Qixiang Cheng, Richard V. Penty, Ian H. White
Veröffentlicht in: 2016 IEEE Photonics Conference (IPC), 2016, Seite(n) 226-227, ISBN 978-1-5090-1906-9
Herausgeber: IEEE
DOI: 10.1109/ipcon.2016.7831053

High Port Court Switch Architectures for Data Center Applications

Autoren: an White , Minsheng Ding , Adrian Wonfor , Q. Cheng , Richard V. Penty
Veröffentlicht in: IEEE Photonic Networks and Devices 2017, 2017
Herausgeber: IEEE

European Application Support Centres

Autoren: Adrian Wonfor
Veröffentlicht in: Photonics & Opto-Electronics Packaging Conference, 2016
Herausgeber: pOp 2016

Scaling of Low Energy InP SOA based Switches

Autoren: Richard V. Penty , Minsheng Ding , Adrian Wonfor , Ian H. White
Veröffentlicht in: IEEE Photonics in Switching 2017, 2017
Herausgeber: IEEE

Photonic integration in the palm of your hand: generic technology and multi-project wafers, technical roadblocks, challenges and evolution

Autoren: Pascual Muñoz
Veröffentlicht in: Optical Fiber Communications Conference and Exhibition (OFC), 2017, 2017, ISBN 978-1-9435-8023-1
Herausgeber: Optical Fiber Communications Conference and Exhibition (OFC), 2017

PICs4All project: open-access opportunities for photonic technologies

Autoren: Daniele Melati, Andrea Melloni
Veröffentlicht in: Societa Italiana Di Elettromagnetismo, Ausgabe 2017, 2017
Herausgeber: SIEM

JePPIX: providing open access to photonic integration

Autoren: Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams
Veröffentlicht in: PIC Magazine, Ausgabe Ausgabe 1 - June 2016, 2016
Herausgeber: Published by: Angel Business Communications Ltd, 6 Bow Court, Fletchworth Gate, Burnsall Rd, Coventry CV5 6SP

Photonic technology is ready for the new Bill Gates or Steve Jobs

Autoren: Martijn Heck
Veröffentlicht in: LinkedIn, Ausgabe 2016, 2016
Herausgeber: LinkedIn

Cadena de Valor de la Fotonica Integrada en Espana

Autoren: Ruben Alemany, Pascual Munoz
Veröffentlicht in: Secpho Newsletter, Ausgabe 2017, 2017
Herausgeber: Secpho Newsletter

PICs4All project: ease the access to generic foundry technologies for photonic circuits

Autoren: Daniele Melati, Andrea Melloni
Veröffentlicht in: Fotonica 2016, Ausgabe 2016, 2016
Herausgeber: Fotonica

EPIC launches 'PICs for everyone' resource in Europe

Autoren: Carlos Lee
Veröffentlicht in: Laser Focus World, Ausgabe August 2016, 2016
Herausgeber: Laser Focus World Magazine

Enabling photonics technologies with PICs 4ALL

Autoren: Frédéric Grillot
Veröffentlicht in: 2016
Herausgeber: LinkedIn

Passive Chaos Bandwidth Enhancement Under Dual-Optical Feedback with Hybrid III–V/Si DFB Laser

Autoren: Kevin Schires, Sandra Gomez, Antonin Gallet, Guang-Hua Duan, Frederic Grillot
Veröffentlicht in: IEEE Journal of Selected Topics in Quantum Electronics, Ausgabe 23/6, 2017, Seite(n) 1-9, ISSN 1077-260X
Herausgeber: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JSTQE.2017.2732830

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