Photonic Integrated Circuits Accessible to Everyone

Rezultaty

1st Plan for using and disseminating knowledge and results

This plan will detail the dissemination strategy for the project overall, indicating the audiences to be addressed, the type of contents to be covered, and the related means for dissemination. Also, for M7-18 it will detail the concrete measures planned, and for M19-36 the measures envisaged provisonally.

1st Report on ASC processes monitoring and business effectiveness monitoring

Covers M1-M9

Report on ASCs Capabilities

Report on ASCs capabilities will be given, including infrastructure already present at the ASCs institutes, available software design tools, exchange server will run for technical document sharing and various (technical and economic) issues tracking, training courses followed by ASCs representatives and their experience.

Project web site

An overview of the project is published on the project website for raising public awareness and informing potential users on the available support. Also the consortium partners and their roles will be presented.

2nd Plan for using and disseminating knowledge and results

The first plan will be updated in the light of activities of WP4 and steering committee findings. Also, it will detail the concrete measures planned already for M19-36.

1st Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M1-M9

Uniform working protocol for the JePPIX application support centres

The uniform working protocol for the JePPIX application support centres will be elaborated and proposed, including step-by-step procedure to support development of photonic ASICs for external users. This shall be related to feasibility study, choice of technology, assuring technical support with right software tools and know-how, advice on the value chain for possible volume request.

2nd Report on ASC processes monitoring and business effectiveness monitoring

Covers M10-M18

2nd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M10-M18

3rd Report on ASC processes monitoring and business effectiveness monitoring

Covers M19-M42

3rd Report on dissemination and scouting activities and their impact in terms of new users and collaboration

Covers M19-M36

Data management plan

The data management plan will identify format and ownership for data generated within the project, and identify appropriate material for wider dissemination to a broad audience. Strategies for sharing project findings with other integrated photonics and optics initiatives will be identified.

Project registration system

Project public website and portal for file sharing are delivered. The website will serve as an entry point for SMEs and businesses seeking to upskill within PIC technologies. Additionally this provides an internal resource for the project partners and users.

1st Communication Kit

Includes in particular project presentations for the general public and the targeted users.

3rd Communication Kit

Focus is on the main project achievements and the expected benefits. The project presentations will be updated as appropriate.

2nd Communication Kit

Focus is on the offers in place and the other main achievements so far. The project presentations will be updated as appropriate.

Publikacje

How engaging in technology transfer activities influences scientists: Learning to become boundary spanners

Autorzy: Dolmans SAM, Walrave B, Read S, van Stijn N
Opublikowane w: Technology Transfer Society Annual Conference, 17-19 October 2018, Valencia, Spain, 2018
Wydawca: Technology Transfer Society

La fotonica come tecnologia abilitante. Opportunita di accesso per le imprese e le universita attraverso il progetto PICs4All

Autorzy: Daniele Melati, Andrea Melloni
Opublikowane w: International Trade Fair A&T, Numer Turin 2017, 2017
Wydawca: International Trade Fair A&T

64 Gbit/s Generation from a Fully Integrated Serial 0.25 x 2.0 mm2 Dual-Polarization Electroabsorption Modulator PIC in InP

Autorzy: Moritz Baier, Francisco M. Soares, Marko Gruner, Tom Gaertner, Martin Moehrle, Norbert Grote, Martin Schell
Opublikowane w: CSW 2017, Numer CSW 2017, 2017
Wydawca: CSW 2017 Proceedings

TxRx InP PIC Integration Platform on Semi-insulating Substrate (invited)

Autorzy: M. Baier, F.M. Soares, M. Schell and N. Grote
Opublikowane w: CSW 2017, Numer CSW 2017, 2017
Wydawca: CSW Proceedings

Photonic integrated circuits: a new eco-system, a new paradigm

Autorzy: Martijn J. R. Heck
Opublikowane w: Danish Optical Society Annual Meeting, Numer Annual, 2016, Strona(/y) p. 8 (of 38)
Wydawca: DOPS - Danish Optical Society

Photonics innovation accessible to everyone: ACTPHAST and PICS4ALL European projects

Autorzy: Apostolopoulos Dimitris; Bakopoulos Paraskevas
Opublikowane w: PetaCloud International Symposium, Numer 1, 2017
Wydawca: Israel Innovation Authority
DOI: 10.5281/zenodo.835539

Integrated optical switches and short pulse generation using a generic integration platform

Autorzy: Adrian Wonfor, Qixiang Cheng, Richard V. Penty, Ian H. White
Opublikowane w: 2016 IEEE Photonics Conference (IPC), 2016, Strona(/y) 226-227, ISBN 978-1-5090-1906-9
Wydawca: IEEE
DOI: 10.1109/ipcon.2016.7831053

High Port Court Switch Architectures for Data Center Applications

Autorzy: an White , Minsheng Ding , Adrian Wonfor , Q. Cheng , Richard V. Penty
Opublikowane w: IEEE Photonic Networks and Devices 2017, 2017
Wydawca: IEEE

European Application Support Centres

Autorzy: Adrian Wonfor
Opublikowane w: Photonics & Opto-Electronics Packaging Conference, 2016
Wydawca: pOp 2016

Scaling of Low Energy InP SOA based Switches

Autorzy: Richard V. Penty , Minsheng Ding , Adrian Wonfor , Ian H. White
Opublikowane w: IEEE Photonics in Switching 2017, 2017
Wydawca: IEEE

Photonic integration in the palm of your hand: generic technology and multi-project wafers, technical roadblocks, challenges and evolution

Autorzy: Pascual Muñoz
Opublikowane w: Optical Fiber Communications Conference and Exhibition (OFC), 2017, 2017, ISBN 978-1-9435-8023-1
Wydawca: Optical Fiber Communications Conference and Exhibition (OFC), 2017

PICs4All project: open-access opportunities for photonic technologies

Autorzy: Daniele Melati, Andrea Melloni
Opublikowane w: Societa Italiana Di Elettromagnetismo, Numer 2017, 2017
Wydawca: SIEM

JePPIX: providing open access to photonic integration

Autorzy: Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams
Opublikowane w: PIC Magazine, Numer Numer 1 - June 2016, 2016
Wydawca: Published by: Angel Business Communications Ltd, 6 Bow Court, Fletchworth Gate, Burnsall Rd, Coventry CV5 6SP

Photonic technology is ready for the new Bill Gates or Steve Jobs

Autorzy: Martijn Heck
Opublikowane w: LinkedIn, Numer 2016, 2016
Wydawca: LinkedIn

Cadena de Valor de la Fotonica Integrada en Espana

Autorzy: Ruben Alemany, Pascual Munoz
Opublikowane w: Secpho Newsletter, Numer 2017, 2017
Wydawca: Secpho Newsletter

PICs4All project: ease the access to generic foundry technologies for photonic circuits

Autorzy: Daniele Melati, Andrea Melloni
Opublikowane w: Fotonica 2016, Numer 2016, 2016
Wydawca: Fotonica

EPIC launches 'PICs for everyone' resource in Europe

Autorzy: Carlos Lee
Opublikowane w: Laser Focus World, Numer August 2016, 2016
Wydawca: Laser Focus World Magazine

Enabling photonics technologies with PICs 4ALL

Autorzy: Frédéric Grillot
Opublikowane w: 2016
Wydawca: LinkedIn

Passive Chaos Bandwidth Enhancement Under Dual-Optical Feedback with Hybrid III–V/Si DFB Laser

Autorzy: Kevin Schires, Sandra Gomez, Antonin Gallet, Guang-Hua Duan, Frederic Grillot
Opublikowane w: IEEE Journal of Selected Topics in Quantum Electronics, Numer 23/6, 2017, Strona(/y) 1-9, ISSN 1077-260X
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JSTQE.2017.2732830

Rezultaty

Publikacje

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