Project description
Getting ready for integrating semiconductor lasers into silicon
Integrated photonics, the use of light for applications traditionally addressed through electronics, is becoming the new contender in a wide range of areas including telecommunications. However, photonics technology has failed to match the miniaturisation of electronic components. Furthermore, thermal management of photonic devices at such small scales is critical to prevent premature failure. The EU-funded DATENE project is addressing another integration challenge: overcoming defects of III-V compound materials, which stem from the crystal lattice mismatch with silicon. Researchers will conduct defect analysis and thermal management studies into III-V lasers monolithically integrated on silicon. Project results will create a new basis for understanding data transmission on computer chips via light.
Objective
Photonic integrated circuits (PIC) are becoming a key contender for the next generation of communication. Two main barriers exist for the seamless integration of electronics and photonics, the integration of active photonic components on the silicon chip, and their downsizing towards electronic dimensions.
III-Vs with their tunable direct bandgaps are the materials of choice for integrated lasers on Si. IBM has achieved room-temperature III-V optically pumped microdisk lasers monolithically on Si. Defects in the III-V material when grown on Si is a main factor in reducing the efficiency of optical devices, and can also lead to catastrophic failure of devices. Hence the ability to analyze and preferably control their impact is essential for integrated photonics.
Another equally grand challenge for advanced technologies today is thermal management of photonic devices on Si, at all levels of system integration from the package down to individual devices. Whereas this is true for electronics, thermal effects are even more severe for photonic devices. Although downscaling of photonic components is ultimately limited by diffraction, thermal effects (wavelength shift and self-heating), in practice play a great role.
The present proposal addresses these two great challenges in integrated photonics: a) Defect analysis of III/V nanoscale photonic devices – morphological and device characterization to understand the impact of material defects on device, reliability studies. b) Nanoscale thermal management of active III-V lasers on Si – by a combination of in-situ nanoscale thermal characterization and thermal stress simulation.
To address this, I will apply my extensive experience and skills in thermal characterization and defect analysis which complement the existing competences at IBM, on III-V materials, device fabrication and scanning thermal microscopy.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- natural sciences physical sciences optics microscopy
- natural sciences chemical sciences inorganic chemistry metalloids
- natural sciences physical sciences optics laser physics
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.1.3. - EXCELLENT SCIENCE - Marie Skłodowska-Curie Actions
MAIN PROGRAMME
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H2020-EU.1.3.2. - Nurturing excellence by means of cross-border and cross-sector mobility
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
MSCA-IF-EF-SE - Society and Enterprise panel
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-MSCA-IF-2018
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
8803 RUESCHLIKON
Switzerland
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.