Surface Acoustic Waves Stimulated Brillouin Scattering

Projektinformationen

SAW-SBS

ID Finanzhilfevereinbarung: 101001069

DOI

10.3030/101001069

EK-Unterschriftsdatum 21 Dezember 2020

Startdatum 1 April 2021

Enddatum 31 März 2027

Finanziert unter

• EXCELLENT SCIENCE - European Research Council (ERC)

Gesamtkosten

€ 2 000 000,00

EU-Beitrag

€ 2 000 000,00

Koordiniert durch

TECHNION - ISRAEL INSTITUTE OF TECHNOLOGY
Israel

Periodic Reporting for period 4 - SAW-SBS (Surface Acoustic Waves Stimulated Brillouin Scattering)

Berichtszeitraum: 2024-10-01 bis 2026-03-31

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

The issues addressed in the SAW-SBS project are the physics and application of opto-mechanics: the use of light and sound waves together in a single device. More specifically, the devices in question are silicon circuits: the most significant technological platform of our era. Silicon devices support state of the art electronics, and in recent years they also include the use of light waves. However, the additional dimension of sound waves is still missing.

The introduction of sound waves into silicon circuits for the guiding of light would greatly enhance their capabilities in several important respects. First, the use of light and sound together would enable fundamental research into both wave phenomena and the interactions between them. In addition, sound waves on a chip would promote sensing technologies, signal processing, and communications.

The overall objectives are concepts, calculations, fabricated devices, and experimental demonstrations of how light and sound waves may interact in a single, unified silicon circuit.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

The work performed thus far includes the following:

1. Thorough calculations of the propagation of light and sound waves in silicon devices, and of the interactions among them.
2. Fabrication of devices that enhance, control, and employ the combination of light and sound waves.
3. Construction of an experimental setup for the precise characterization of light and sound waves in silicon devices.
4. Stronger excitation of sound waves in a silicon device by external light, with 100-fold improvement upon previous works.
5. Sources of microwave-frequency signal through silicon devices of light and sound, with lower noise levels than those of previous works.
6. Method for the analysis of thin layers of materials deposited as part of silicon devices.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

Until the end of the project, we expect to demonstrate for the first time an interaction between optical and acoustic waves that propagate together in a waveguide within a silicon chip. That milestone, if achieved, would represent a conceptual breakthrough and address a long-standing challenge of our community. In addition, we anticipate the demonstration of better signal processing and sensing functionalities on a silicon chip through careful control of optical and acoustic waves combined.