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Design and validation of Ultra-Reprogrammable sOCs

Project description

Shrinked, 7-nm computer chips for space applications

The EU-funded DUROC project plans to design innovative programmable system-on-chip (SoC) devices for space applications. The new SoC devices will rely on ARM's new Cortex A73 processors. The chips will be made using 7-nm fin field-effect transistor (FinFET) processes and will be validated on a radiation-hardened demonstrator. The project will offer all necessary technical information that Europe needs to be in a position to develop various components, such as SoC field-programmable gate arrays and application-specific integrated circuits, on a 7-nm FinFET. The latter is the most advanced CMOS technology node for space.

Objective

The DUROC project sets clear and measurable main objectives to reach a TRL 4 from TRL 2 as follows in 2 years:
• Specifiy and design the next generation of ultra-programmable SoC (ULTRA7) taking benefit of leasson learnt from DAHLIA project (TRL 2)
• Introduce the ARM 73 processor for very high performance processing specificly designed for advanced process node
• Validate the SoC on a rad-hard demonstrator in 7nm FinFET technology from TSMC (TRL 4)
• Validate reliability and radiation hardening performance of 7nm FinFET (TRL 4)
• Propose a strategy and development plan up to flight model for the next ultra-reprogrammable SoC (ULTRA7)
• Define the right approach for future SiP use in space applications
At the end of the project, Europe will have all required technical information to be in a position to develop multiple components (SoC FPGA, ASIC etc) on 7nm FinFET which will be the most advanced process node for space. DUROC will bring Europe to an unprecedent leadership position in VLSI electronic for space.
DUROC will be the first critial step to develop the next generation of ultra-reprogrammable SoC after NG-ULTRA. The ULTRA 7 will target the following objectives:
• MPSoC ARM A73 64-bit processor scalability combining ARM R52 real-time control
• More than 35 000 DMIPS (Millions Instructions per Second)
• Radiation hardening reliability meeting space payload and platform applications requirements

Keywords

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Programme(s)

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Topic(s)

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Funding Scheme

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RIA - Research and Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-SPACE-2018-2020

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Coordinator

NANOXPLORE
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 149 440,71
Address
1 avenue de la Cristallerie
92310 Sevres
France

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Ile-de-France Ile-de-France Hauts-de-Seine
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 2 149 440,71

Participants (6)

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