Periodic Reporting for period 1 - CircEl-Paper (Circular Economy Applied To Electronic Printed Circuit Boards Based On Paper)
Berichtszeitraum: 2022-09-01 bis 2023-08-31
CircEl-Paper contributes to the aim to increase the amount of e-waste recycling in the EU by feeding it in the paper recycling process that is well established throughout the EU and accepted by the consumers.
CircEl-Paper focusses on the widely used board technology (Printed Circuit Board PCB) and aims for replacing the fiber-composite core material FR4 by paper technology. Based on recently developed manufacturing processes of circuitry on paper, integration density has to be increased and sound evaluation of separation of used electronic materials in the recycling process has to be carried out.
In order to transfer the PCB technology to circular economy each process step is scrutinized and alternative approaches are developed in order to increase the part of the materials that are recyclable, bio-based, or based on secondary raw materials, or at least harmless for the environment.
Three different use cases in the field of medical application, logistics and consumer electronics, are realized demonstrating the performance of the paper-based PCB.
CircEl-Paper focusses on the widely used board technology (Printed Circuit Board PCB) and aims for replacing the fiber-composite core material FR4 by paper technology. Based on recently developed manufacturing processes of circuitry on paper, integration density has to be increased and sound evaluation of separation of used electronic materials in the recycling process has to be carried out.
In order to transfer the PCB technology to circular economy each process step is scrutinized and alternative approaches are developed in order to increase the part of the materials that are recyclable, bio-based, or based on secondary raw materials, or at least harmless for the environment.
Three different use cases in the field of medical application, logistics and consumer electronics, are realized demonstrating the performance of the paper-based PCB.
In WP1, dealing with passive materials (paper, flame retardants etc), the paper properties concerning the individual processing steps, such as elektroplating, drilling and filling were performed with very promising results. Paper substrates were shared between the respective partners to evaluate the paper. Work for recycable transfer paper has started and the use of benzoaxine as glue were performed and compared to reference glue PU. The use of flame retardants showed that the rate of polymerization needs to be adapted.
In WP 2 (Active materials), the evaluation of supplier revealed a silver ink, which is already used with a share of 87% of recycled silver. With taht high rate, the investigations concerning sustainability of further additives (solvents, binder etc) is started. These basic starting inks are shared between the partners for benchmarking. First tests with base non-toxic metals (Sn, Al, Bi) were started and the metals are partially self-synthesuzed. The evaluation of natural precursors for biobased hybrid polymers as dielectric materials has been finished and the choses substances are now to be functionalzied and integrated. First evaluations of new resistor materials showeed a lower conductivity but less dependency on temperature and a biobased solvent is testet here.
In WP 3 (Processes), the annealing process for inks and pastes on paper will be investigated with respect to IR techniques to reduce thermal load of the paper. Additionally it was achieved to cure (vitrimers) through the paper. First galavanic processes on paper are very promising, however additional seed layers might be needed. CO2 laser drilling inpaper causes ashing and non-controlled bordest, the resolution of about 200 µm can be achieved -in parallel mechanically dilled holes were successfully filled with metal inks.
In WP4 (Hybrid Integration) first discussions about the results and screening of the materials in WP1 and 2 were performed, mainly to get a first idea on how to adapt processes to new material properties, such as antenna design for materials with reduced conductivity (thicker metal lines etc.)
WP5 is dealing with the use cases. Here first demonstrator examples were identified as well as the components needed and the design now can be transferred to paper electronics.
WP6 (LCA) will started later but first discussions on data management for new materials alread started.
In WP 2 (Active materials), the evaluation of supplier revealed a silver ink, which is already used with a share of 87% of recycled silver. With taht high rate, the investigations concerning sustainability of further additives (solvents, binder etc) is started. These basic starting inks are shared between the partners for benchmarking. First tests with base non-toxic metals (Sn, Al, Bi) were started and the metals are partially self-synthesuzed. The evaluation of natural precursors for biobased hybrid polymers as dielectric materials has been finished and the choses substances are now to be functionalzied and integrated. First evaluations of new resistor materials showeed a lower conductivity but less dependency on temperature and a biobased solvent is testet here.
In WP 3 (Processes), the annealing process for inks and pastes on paper will be investigated with respect to IR techniques to reduce thermal load of the paper. Additionally it was achieved to cure (vitrimers) through the paper. First galavanic processes on paper are very promising, however additional seed layers might be needed. CO2 laser drilling inpaper causes ashing and non-controlled bordest, the resolution of about 200 µm can be achieved -in parallel mechanically dilled holes were successfully filled with metal inks.
In WP4 (Hybrid Integration) first discussions about the results and screening of the materials in WP1 and 2 were performed, mainly to get a first idea on how to adapt processes to new material properties, such as antenna design for materials with reduced conductivity (thicker metal lines etc.)
WP5 is dealing with the use cases. Here first demonstrator examples were identified as well as the components needed and the design now can be transferred to paper electronics.
WP6 (LCA) will started later but first discussions on data management for new materials alread started.
Due to the early stage, results beyond the state of the art will be implemenented in the following months.