Entanglement of an array of massive, magnetically levitated superconducting microparticles on a chip

Project Information

SuperQLev

Grant agreement ID: 101087847

DOI

10.3030/101087847

EC signature date 23 March 2023

Start date 1 January 2024

End date 31 December 2028

Funded under

• European Research Council (ERC)

Total cost

€ 2 000 000,00

EU contribution

€ 2 000 000,00

Coordinated by

CHALMERS TEKNISKA HOGSKOLA AB
Sweden

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Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Peer reviewed articles (1)

Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

Author(s): Achintya Paradkar; Paul Nicaise; Karim Dakroury; Fabian Resare; Witlef Wieczorek
Published in: Applied Physics Letters, 2025, ISSN 1077-3118
Publisher: AIP Publishing
DOI: 10.48550/ARXIV.2408.14655