Objective
Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventional computing architectures. To address this formidable challenge, smart architectural approaches that consider co-design of electronics and thermal management, as well as emerging solutions beyond CMOS, are needed. A resistive switching memory cell ReRAM is a promising candidate for such a technology, which offers performance improvements in digital circuits without a need for aggressive device scaling when combined with transistors.
Ultimately, the solution may come from monolithic integration of novel electronics and cooling within the same substrate. In-chip cooling has been recently demonstrated to be promising in GaN power electronics on silicon. However, the multi-step and complicated process flow adopted for fabricating the in-chip heat sink in the state-of-the-art could pose a big challenge for the wide adoption of this new, scientifically and technologically interesting concept.
3D laser lithography is a currently unrealized opportunity to fabricate in-chip microchannels for cooling with substantially simplified fabrication and without a need for cleanroom facilities. Complex 3D structures can be fabricated by this method through a two-step process that includes femtosecond laser irradiation followed by wet chemical etching.
In view of the above mentioned, we target to develop memristive arrays integrated with laser-micro-machined in-chip cooling. This offers an immediate and rapid path to overcome the thermal challenges facing todays computing architectures, and is of relevance to other technologies that suffer from heating during operation. We seek to exploit the highly efficient embedded cooling to pioneer agenda setting advances in addressing the well-known thermal limitations of future logic and memory technologies.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- natural sciences physical sciences thermodynamics
- natural sciences chemical sciences inorganic chemistry metalloids
- natural sciences physical sciences optics laser physics
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.4.1 - Widening participation and spreading excellence
MAIN PROGRAMME
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HORIZON.4.1.5 - Fostering brain circulation of researchers and excellence initiatives
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-TMA-MSCA-PF-EF - HORIZON TMA MSCA Postdoctoral Fellowships - European Fellowships
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-WIDERA-2022-TALENTS-02
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
06800 BILKENT ANKARA
Türkiye
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.