Monolithically Integrated ReRAM and In-Chip Cooling for Emerging Neuromorphic Applications

Informations projet

MIMIC

N° de convention de subvention: 101090310

DOI

10.3030/101090310

Projet clôturé

Date de signature de la CE 1 Septembre 2022

Date de début 1 Septembre 2022

Date de fin 31 Août 2024

Financé au titre de

• Widening participation and spreading excellence

Coût total

Aucune donnée

Contribution de l’UE

€ 132 638,40

Coordonné par

BILKENT UNIVERSITESI VAKIF
Türkiye

Objectif

Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventional computing architectures. To address this formidable challenge, smart architectural approaches that consider co-design of electronics and thermal management, as well as emerging solutions beyond CMOS, are needed. A resistive switching memory cell ReRAM is a promising candidate for such a technology, which offers performance improvements in digital circuits without a need for aggressive device scaling when combined with transistors.
Ultimately, the solution may come from monolithic integration of novel electronics and cooling within the same substrate. In-chip cooling has been recently demonstrated to be promising in GaN power electronics on silicon. However, the multi-step and complicated process flow adopted for fabricating the in-chip heat sink in the state-of-the-art could pose a big challenge for the wide adoption of this new, scientifically and technologically interesting concept.
3D laser lithography is a currently unrealized opportunity to fabricate in-chip microchannels for cooling with substantially simplified fabrication and without a need for cleanroom facilities. Complex 3D structures can be fabricated by this method through a two-step process that includes femtosecond laser irradiation followed by wet chemical etching.
In view of the above mentioned, we target to develop memristive arrays integrated with laser-micro-machined in-chip cooling. This offers an immediate and rapid path to overcome the thermal challenges facing todays computing architectures, and is of relevance to other technologies that suffer from heating during operation. We seek to exploit the highly efficient embedded cooling to pioneer agenda setting advances in addressing the well-known thermal limitations of future logic and memory technologies.

Champ scientifique (EuroSciVoc)

• ingénierie et technologie › génie électrique, génie électronique, génie de l’information › ingénierie électronique › capteurs › capteurs optiques
• sciences naturelles › sciences physiques › thermodynamique
• sciences naturelles › sciences chimiques › chimie inorganique › métalloïde
• sciences naturelles › sciences physiques › optique › physique des lasers

Mots‑clés

• monolithically integrated cooling and electronics
• laser-sculpted in-chip microfluidics
• ReRAM

Programme(s)

• HORIZON.4.1 - Widening participation and spreading excellence PROGRAMME PRINCIPAL
  
• HORIZON.4.1.5 - Fostering brain circulation of researchers and excellence initiatives
  

Thème(s)

• HORIZON-WIDERA-2022-TALENTS-02-01 - Fostering balanced brain circulation – ERA Fellowships
  

Régime de financement

HORIZON-TMA-MSCA-PF-EF - HORIZON TMA MSCA Postdoctoral Fellowships - European Fellowships

Appel à propositions

HORIZON-WIDERA-2022-TALENTS-02

Coordinateur

BILKENT UNIVERSITESI VAKIF

• Contribution nette de l'UE: € 132 638,40
• Adresse: ESKISEHIR YOLU 8 KM ; 06800 BILKENT ANKARA ; Turquie
• Région: Batı Anadolu › Ankara › Ankara
• Type d’activité: Higher or Secondary Education Establishments
• Coût total: Aucune donnée