Monolithically Integrated ReRAM and In-Chip Cooling for Emerging Neuromorphic Applications

Información del proyecto

MIMIC

Identificador del acuerdo de subvención: 101090310

DOI

10.3030/101090310

Proyecto cerrado

Fecha de la firma de la CE 1 Septiembre 2022

Fecha de inicio 1 Septiembre 2022

Fecha de finalización 31 Agosto 2024

Financiado con arreglo a

• Widening participation and spreading excellence

Coste total

Sin datos

Aportación de la UE

€ 132 638,40

Coordinado por

BILKENT UNIVERSITESI VAKIF
Türkiye

Objetivo

Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventional computing architectures. To address this formidable challenge, smart architectural approaches that consider co-design of electronics and thermal management, as well as emerging solutions beyond CMOS, are needed. A resistive switching memory cell ReRAM is a promising candidate for such a technology, which offers performance improvements in digital circuits without a need for aggressive device scaling when combined with transistors.
Ultimately, the solution may come from monolithic integration of novel electronics and cooling within the same substrate. In-chip cooling has been recently demonstrated to be promising in GaN power electronics on silicon. However, the multi-step and complicated process flow adopted for fabricating the in-chip heat sink in the state-of-the-art could pose a big challenge for the wide adoption of this new, scientifically and technologically interesting concept.
3D laser lithography is a currently unrealized opportunity to fabricate in-chip microchannels for cooling with substantially simplified fabrication and without a need for cleanroom facilities. Complex 3D structures can be fabricated by this method through a two-step process that includes femtosecond laser irradiation followed by wet chemical etching.
In view of the above mentioned, we target to develop memristive arrays integrated with laser-micro-machined in-chip cooling. This offers an immediate and rapid path to overcome the thermal challenges facing today’s computing architectures, and is of relevance to other technologies that suffer from heating during operation. We seek to exploit the highly efficient embedded cooling to pioneer agenda setting advances in addressing the well-known thermal limitations of future logic and memory technologies.

Ámbito científico (EuroSciVoc)

• ingeniería y tecnología › ingeniería eléctrica, ingeniería electrónica, ingeniería de la información › ingeniería electrónica › sensores › sensores ópticos
• ciencias naturales › ciencias químicas › química inorgánica › metaloides
• ciencias naturales › ciencias físicas › óptica › física del láser

Palabras clave

• monolithically integrated cooling and electronics
• laser-sculpted in-chip microfluidics
• ReRAM

Programa(s)

• HORIZON.4.1 - Widening participation and spreading excellence PROGRAMA PRINCIPAL
  
• HORIZON.4.1.5 - Fostering brain circulation of researchers and excellence initiatives
  

Tema(s)

• HORIZON-WIDERA-2022-TALENTS-02-01 - Fostering balanced brain circulation – ERA Fellowships
  

Régimen de financiación

HORIZON-TMA-MSCA-PF-EF - HORIZON TMA MSCA Postdoctoral Fellowships - European Fellowships

Convocatoria de propuestas

HORIZON-WIDERA-2022-TALENTS-02

Coordinador

BILKENT UNIVERSITESI VAKIF

• Aportación neta de la UEn: € 132 638,40
• Dirección: ESKISEHIR YOLU 8 KM ; 06800 Bilkent Ankara ; Turquía
• Región: Batı Anadolu › Ankara › Ankara
• Tipo de actividad: Higher or Secondary Education Establishments
• Coste total: Sin datos