CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Publications
Author(s):
Sandor Ress, Gabor Farkas and Marta Rencz
Published in:
Energies 2024, 2024, ISSN 1996-1073
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/en17122931
Author(s):
Jinglin Li, Aditya Shekhar, Willem D. van Driel, Guoqi Zhang
Published in:
IEEE Transactions on Electron Devices, Issue 71, 2024, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/TED.2024.3482252
Author(s):
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Kröckel
Published in:
IEEE Transactions on Power Electronics, Issue 39, 2024, ISSN 0885-8993
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/TPEL.2024.3447909
Author(s):
Zimo Yuan, Jang Kwon Lim, Alex Metreveli, Hithiksha Krishna Murthy, Mietek Bakowski, Anders Hallén
Published in:
Solid State Phenomena, Issue 361, 2024, ISSN 1662-9779
Publisher:
Trans Tech Publications, Ltd.
DOI:
10.4028/p-90Xrjk
Author(s):
Mariam Saeed; Fernando Briz; Juan Manuel Guerrero; Igor Larrazabal; David Ortega; Victor Lopez; Juan Jose Valera
Published in:
IEEE Open Journal of Industry Applications, 2023, ISSN 2644-1241
Publisher:
IEEE
DOI:
10.1109/ojia.2023.3293059
Author(s):
Singh, Bhanu Pratap; Ghahfarokhi, Shahriar Sarmast; Kostov, Konstantin; Nee, Hans-Peter; Norrga, Staffan
Published in:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Publisher:
IEEE
DOI:
10.1109/eurosime60745.2024.10491556
Author(s):
Saad Ahmad, Mariam Saeed, Juan Manuel Guerrero, Iker Muniategui-Aspiazu, Guillermo Nuñez, Igor Larrazabal, Fernando Briz
Published in:
IEEE Open Journal of Industry Applications, Issue 6, 2024, ISSN 2644-1241
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/OJIA.2024.3501072
Author(s):
Hithiksha Krishna Murthy, Jang Kwon Lim, Mietek Bakowski
Published in:
Solid State Phenomena, Issue 361, 2024, ISSN 1662-9779
Publisher:
Trans Tech Publications, Ltd.
DOI:
10.4028/p-HoOFQ0
Author(s):
Wilhelm Söderkvist Vermelin, Madhav Mishra, Mattias P. Eng, Dag Andersson, and Konstantinos Kyprianidis
Published in:
Vol. 15 No. 2 (2024): International Journal of Prognostics and Health Management, 2024, ISSN 2153-2648
Publisher:
International Journal of Prognostics and Health Management
DOI:
10.36001/ijphm.2024.v15i2.3821
Author(s):
Dimitris Georgiadis, Konstantina Karathanasopoulou, Cleopatra Bardaki, Ilias Panagiotopoulos, Ioannis Vondikakis, Thalis Paktitis, George Dimitrakopoulos
Published in:
Sustainability, Issue 16, 2024, ISSN 2071-1050
Publisher:
MDPI AG
DOI:
10.3390/su16124963
Author(s):
Ivars Namatevs, Kaspars Sudars, Arturs Nikulins, Kaspars Ozols
Published in:
Applied Sciences, Issue 15, 2025, ISSN 2076-3417
Publisher:
MDPI AG
DOI:
10.3390/app15020647
Author(s):
Katharina Machtinger, Peter Jonke, Ulrich Boeke
Published in:
2024
Publisher:
VDE
DOI:
10.30420/566262299
Author(s):
Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Marcus Jackson, Bhanu Pratap Singh, Staffan Norrga, Hans-Peter Nee, Mats Leksell
Published in:
2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Publisher:
IEEE
DOI:
10.1109/ECCEEurope62508.2024.10751827
Author(s):
Bhanu Pratap Singh Shahriar Sarmast Ghahfarokhi Konstantin Kostov RISE Research Institutes of Sweden H.-P. Nee KTH Royal Institute of Technology
Published in:
2024
Publisher:
EuroSimE
DOI:
10.1109/EuroSimE60745.2024.10491556
Author(s):
Tabish M. Ahmad, Jurgen Willaert, Przemyslaw Misiewicz, Jean-Paul M. G. Linnartz
Published in:
2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Publisher:
IEEE
DOI:
10.1109/PEMC61721.2024.10726402
Author(s):
Michael Goller Markus Brandner
Published in:
2011
Publisher:
KTH Royal Institute of Technology
DOI:
10.1109/RFID.2011.5764632
Author(s):
P. Seri, D. Demian, A. Reolon, A. Cavallini
Published in:
2024 IEEE 5th International Conference on Dielectrics (ICD), 2024
Publisher:
IEEE
DOI:
10.1109/ICD59037.2024.10613330
Author(s):
P. Seri, D. Demian, A. Reolon, A. Cavallini
Published in:
2024
Publisher:
IEEE
DOI:
10.1109/EIC58847.2024.10579385
Author(s):
Mattias P. Eng, Madhav Mishra, Wilhelm Söderkvist Vermelin, Dag Andersson and Klas Brinkfeldt
Published in:
2024
Publisher:
IEEE
DOI:
10.1109/EuroSimE60745.2024.10491457
Author(s):
Sourabh Singh, Jelle Zeilstra, Aditya Shekhar, Pavol Bauer
Published in:
2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Publisher:
IEEE
DOI:
10.1109/PEMC61721.2024.10726333
Author(s):
Giles Vieyra, Joan Elias; Rodríguez Alonso, Alberto; Hernando Álvarez, Marta María; Sebastián Zúñiga, Francisco Javier; Zelaa, B.; Aguirre J.; Castro, A.; Bermejo, J. M.; Ortega, D.
Published in:
instname:Universidad de Oviedo (UNIOVI), 2023
Author(s):
Marcus Jackson, Enes Ayaz, Shahriar Sarmast Ghahfarokhi, Bhanu Pratap Singh, Hans-Peter Nee, Staffan Norrga, Tomas Jonsson, Jang-Kwon Lim, Konstantin Kostov
Published in:
2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Publisher:
IEEE
DOI:
10.1109/ECCEEurope62508.2024.10751952
Author(s):
Reza Moloudi, Bart Vandevelde, Willem Verleysen, Silke G.C. Cleuren, Lucie Masquelet, Maik Sternberg, Adrian Stelzer, Andreas Burghardt, Przemyslaw Jakub Gromala
Published in:
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2024
Publisher:
IEEE
DOI:
10.1109/THERMINIC62015.2024.10732871
Author(s):
Perla Malagò; Stefano Lumetti; Dominik Holzmann; Michael Ortner; Ali Roshanghias
Published in:
Eurosensors 2023, 2024
Publisher:
MDPI
DOI:
10.3390/proceedings2024097100
Author(s):
Jinglin Li, Sten Vollebregt, Yaqian Zhang, Aditya Shekhar, Alexander May, Willem D. Van Driel, Guoqi Zhang
Published in:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
Publisher:
IEEE
DOI:
10.1109/EuroSimE60745.2024.10491433
Author(s):
Eeli Kerttula
Published in:
2024
Publisher:
Häme University of Applied Sciences
Author(s):
Tapio Leppänen
Published in:
2024
Publisher:
Aalto University
Author(s):
Leppänen, Juuli
Published in:
2023
Publisher:
AALTO University
Author(s):
Radwan, Mostafa
Published in:
Aalto University, 2023
Publisher:
Aalto University
Author(s):
Vauhkonen, Veikka
Published in:
2024
Publisher:
LUT University
Author(s):
Sophia Bastidas, Hannes Allmaier
Published in:
Artificial Intelligence Annual Volume 2024, 2024
Publisher:
IntechOpen
DOI:
10.5772/intechopen.1003822
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