Digitalization of Power Electronic Applications within Key Technology Value Chains

Analytical prediction of the thermal behavior of semiconductor power devices from room temperature I-V measurements

Auteurs: Sandor Ress, Gabor Farkas and Marta Rencz
Publié dans: Energies 2024, 2024, ISSN 1996-1073
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en17122931

A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices

Auteurs: Jinglin Li, Aditya Shekhar, Willem D. van Driel, Guoqi Zhang
Publié dans: IEEE Transactions on Electron Devices, Numéro 71, 2024, ISSN 0018-9383
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TED.2024.3482252

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Auteurs: Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Kröckel
Publié dans: IEEE Transactions on Power Electronics, Numéro 39, 2024, ISSN 0885-8993
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TPEL.2024.3447909

A Data-Driven Approach for Predicting Remaining Useful Life of Semiconductor Devices Based on Machine Learning and Synthetic Data Generation: A Review and Case Study on SiC MOSFETs

Auteurs: Yarens J. Cruz; Fernando Castaño; Alberto Villalonga; Madhav Mishra; Rodolfo E. Haber
Publié dans: IEEE Access, Numéro Vol. 13, 2025, ISSN 2169-3536
Éditeur: IEEE
DOI: 10.1109/ACCESS.2025.3596444

IEEE Access

Auteurs: Saad Ahmad; Mariam Saeed; Juan Manuel Guerrero; Iker Muniategui-Aspiazu; Guillermo Nuñez; Igor Larrazabal; Fernando Briz
Publié dans: IEEE Access, 2025, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/ACCESS.2025.3564406

Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor

Auteurs: Joonas Leppänen, Atte Hoffrén, Tapio Leppänen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto Kröckel
Publié dans: IEEE Transactions on Power Electronics, 2025, ISSN 0885-8993
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TPEL.2025.3621900

Model-Based Risk Assessment of Power Converters: Case Study of On-Board Battery System for Railway

Auteurs: Mariam Saeed; Juan Manuel Guerrero; Victor Lopez; David Ortega; Igor Larrazabal; Juan Jose Valera; Ewald Falke; Fernando Briz
Publié dans: IEEE Open Journal of Industry Applications, 2025, ISSN 2644-1241
Éditeur: IEEE
DOI: 10.1109/OJIA.2025.3564730

Automation and Robotics Pilot Lines in the Context of Industry 5.0

Auteurs: Rubén Alonso; Tomás F. Sánchez; Diego A. Alfaro; Yarens J. Cruz; Alberto Villalonga; Fernando Castaño
Publié dans: Applied Sciences, 2025, ISSN 2076-3417
Éditeur: MDPI
DOI: 10.3390/APP15052510

Single Event Effects in 3.3 kV 4H-SiC MOSFETs due to MeV Ion Impact

Auteurs: Zimo Yuan, Jang Kwon Lim, Alex Metreveli, Hithiksha Krishna Murthy, Mietek Bakowski, Anders Hallén
Publié dans: Solid State Phenomena, Numéro 361, 2024, ISSN 1662-9779
Éditeur: Trans Tech Publications, Ltd.
DOI: 10.4028/p-90Xrjk

Hybrid Signaling-Droop DC-Link Voltage Control for Trains With Multiple Onboard Power Sources

Auteurs: Saad Ahmad, Mariam Saeed, Juan Manuel Guerrero, Iker Muniategui-Aspiazu, Guillermo Nuñez, Igor Larrazabal, Fernando Briz
Publié dans: IEEE Access, Numéro 13, 2025, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/ACCESS.2025.3564406

Onboard Energy Storage Systems for Railway: Present and Trends

Auteurs: Mariam Saeed; Fernando Briz; Juan Manuel Guerrero; Igor Larrazabal; David Ortega; Victor Lopez; Juan Jose Valera
Publié dans: IEEE Open Journal of Industry Applications, 2023, ISSN 2644-1241
Éditeur: IEEE
DOI: 10.1109/ojia.2023.3293059

Long Short-Term Memory Mixture Density Network for Remaining Useful Life Prediction of IGBTs

Auteurs: Yarens J. Cruz, Fernando Castaño, Rodolfo E. Haber
Publié dans: Technologies, Numéro 13, 2025, ISSN 2227-7080
Éditeur: MDPI AG
DOI: 10.3390/TECHNOLOGIES13080321

Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules

Auteurs: Singh, Bhanu Pratap; Ghahfarokhi, Shahriar Sarmast; Kostov, Konstantin; Nee, Hans-Peter; Norrga, Staffan
Publié dans: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Éditeur: IEEE
DOI: 10.1109/eurosime60745.2024.10491556

Priority-Based DC-Link Voltage Control for Railway Traction Chains With Onboard Energy Storage

Auteurs: Saad Ahmad, Mariam Saeed, Juan Manuel Guerrero, Iker Muniategui-Aspiazu, Guillermo Nuñez, Igor Larrazabal, Fernando Briz
Publié dans: IEEE Open Journal of Industry Applications, Numéro 6, 2024, ISSN 2644-1241
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/OJIA.2024.3501072

Investigation of Threshold Voltage Instability and Bipolar Degradation in 3.3 kV Conventional Body Diode and Embedded SBD SiC MOSFET

Auteurs: Hithiksha Krishna Murthy, Jang Kwon Lim, Mietek Bakowski
Publié dans: Solid State Phenomena, Numéro 361, 2024, ISSN 1662-9779
Éditeur: Trans Tech Publications, Ltd.
DOI: 10.4028/p-HoOFQ0

Collaborative Training of Data-Driven Remaining Useful Life Prediction Models Using Federated Learning

Auteurs: Wilhelm Söderkvist Vermelin, Madhav Mishra, Mattias P. Eng, Dag Andersson, and Konstantinos Kyprianidis
Publié dans: Vol. 15 No. 2 (2024): International Journal of Prognostics and Health Management, 2024, ISSN 2153-2648
Éditeur: International Journal of Prognostics and Health Management
DOI: 10.36001/ijphm.2024.v15i2.3821

Performance Analysis of Energy-Efficient Path Planning for Sustainable Transportation

Auteurs: Dimitris Georgiadis, Konstantina Karathanasopoulou, Cleopatra Bardaki, Ilias Panagiotopoulos, Ioannis Vondikakis, Thalis Paktitis, George Dimitrakopoulos
Publié dans: Sustainability, Numéro 16, 2024, ISSN 2071-1050
Éditeur: MDPI AG
DOI: 10.3390/su16124963

Privacy Auditing of Lithium-Ion Battery Ageing Model by Recovering Time-Series Data Using Gradient Inversion Attack in Federated Learning

Auteurs: Kaspars Sudars; Ivars Namatevs; Arturs Nikulins; Kaspars Ozols
Publié dans: Applied Sciences, 2025, ISSN 2076-3417
Éditeur: MDPI
DOI: 10.3390/APP15105704

Privacy Auditing in Differential Private Machine Learning: The Current Trends

Auteurs: Ivars Namatevs, Kaspars Sudars, Arturs Nikulins, Kaspars Ozols
Publié dans: Applied Sciences, Numéro 15, 2025, ISSN 2076-3417
Éditeur: MDPI AG
DOI: 10.3390/app15020647

Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications

Auteurs: Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jürgen Albrecht, Mervi Paulasto-Kröckel
Publié dans: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025, ISSN 2156-3950
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TCPMT.2025.3626444

Parameter Identification for DC-DC Buck Converter Digital Twin Considering Sensor Errors

Auteurs: Parsa Behzad Nazif, Mariam Saeed, Saad Ahmad, Juan Manuel Guerrero, Aitor Rodríguez Mendez, Guillermo Carlos Ozaita Araico, Igor Larrazabal, Fernando Briz
Publié dans: IEEE Journal of Emerging and Selected Topics in Power Electronics, Numéro 13, 2025, ISSN 2168-6777
Éditeur: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/JESTPE.2025.3557520

Online Junction Temperature Measurement of IGBT Power Modules with Chip-Integrated Sensor

Auteurs: Matthias Meißner, Dirk Rudolph, Sebastian Rode, Steffen Bernet
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238661

Comparison of Multi-level Topologies to Reduce the Components Voltage Stresses when Powered from Industrial DC Grids

Auteurs: Katharina Machtinger, Peter Jonke, Ulrich Boeke
Publié dans: 2024
Éditeur: VDE
DOI: 10.30420/566262299

Evaluation of Possible Traction Inverter Topologies for Heavy-Duty Electric Vehicles

Auteurs: Enes Ayaz, Marcus Jackson, Shahriar Sarmast, Bhanu Singh, Staffan Norrga, Hans-Peter Nee
Publié dans: 2024 IEEE 9th Southern Power Electronics Conference (SPEC), 2025
Éditeur: IEEE
DOI: 10.1109/SPEC62217.2024.10893180

Cell - Type Multilevel DC/DC Converter for Green Hydrogen Production

Auteurs: Symeon Fountoukidis, Konstantina Dimitriadou, Nena Apostolidou, Nick Papanikolaou
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238621

Deskewing Method for Double Pulse Test and Loss Calculation in High-Power SiC Modules

Auteurs: Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Marcus Jackson, Bhanu Pratap Singh, Staffan Norrga, Hans-Peter Nee, Mats Leksell
Publié dans: 2024 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCEEurope62508.2024.10751827

Analysis and modeling of voltage unbalance in three level dc/dc converters

Auteurs: Saad Ahmad, Alejandro Fernández, Mariam Saeed, Igor Larrazabal, Fernando Briz
Publié dans: IECON 2025 – 51st Annual Conference of the IEEE Industrial Electronics Society, 2025
Éditeur: IEEE
DOI: 10.1109/IECON58223.2025.11221257

DC Link Control for Trains with Onboard Energy Storage using Voltage Level Signalling

Auteurs: Saad Ahmad, Mariam Saeed, Juan M. Guerrero, Iker Muniategui, Guillermo Nuñez, David Ortega, Fernando Briz
Publié dans: 2024 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCEEUROPE62508.2024.10752013

Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules

Auteurs: Bhanu Pratap Singh Shahriar Sarmast Ghahfarokhi Konstantin Kostov RISE Research Institutes of Sweden H.-P. Nee KTH Royal Institute of Technology
Publié dans: 2024
Éditeur: EuroSimE
DOI: 10.1109/EuroSimE60745.2024.10491556

SiC MOSFET Condition Monitoring Using Compensated ON-State Resistance for Identifying Package Failures

Auteurs: Bhanu Pratap Singh, Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Hans-Peter Nee, Staffan Norrga
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238801

Common-Mode Voltage Reduction in Two-Level Inverters by Introducing Adaptive Carrier-Phase-Shift Method

Auteurs: Enes Ayaz, Shahriar Sarmast, Staffan Norrga, Hans-Peter Nee
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238855

Algorithm for Current Balancing in Parallel Connected Inverters

Auteurs: Veli-Matti Leppänen
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238442

Assessment of Parameter Identification Methods for Digital Twins of Two-Level Bidirectional Converters

Auteurs: Parsa Behzad Nazif, Saad Ahmad, Mariam Saeed, Juan M. Guerrero, David Ortega, Beñat Zelaa, Igor Larrazabal, Fernando Briz
Publié dans: 2024 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCEEUROPE62508.2024.10751896

Physics-Based Deep Learning for Online and Onboard Prediction of Insulation Degradation Under Variable Stress Conditions

Auteurs: P. Seri, A. Trotta, T. Schafberger, C. Reil, A. Cavallini
Publié dans: 2025 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 2025
Éditeur: IEEE
DOI: 10.1109/CEIDP61707.2025.11218381

Verification of Material Models of an Epoxy Mold Compound Used in Power Module

Auteurs: Akshay Vivek Panchwagh, Przemyslaw Jakub Gromala, Sven Rzepka, Bernhard Wunderle
Publié dans: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025
Éditeur: IEEE
DOI: 10.1109/EUROSIME65125.2025.11006604

Mechanical Parameter Identification for Soft Potting Materials Used in Frame-Based Power Modules

Auteurs: Nafız Söyleyen, Markus Hillgärtner, Tatyana Kashko, Jonas Wirries
Publié dans: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025
Éditeur: IEEE
DOI: 10.1109/EUROSIME65125.2025.11006528

High Current Multi-Stage Gate Drive Unit to Control the Maximum dv/dt

Auteurs: Tristan Eberle, Dirk Rudolph, Veli-Matti Leppanen, Steffen Bernet
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238394

A Novel Approach to Ensure Reliable EMI Performance: Identifying and Mitigating EMI Challenges in Fast Switching Power Converters

Auteurs: Tabish M. Ahmad, Jurgen Willaert, Przemyslaw Misiewicz, Jean-Paul M. G. Linnartz
Publié dans: 2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Éditeur: IEEE
DOI: 10.1109/PEMC61721.2024.10726402

Experimental evaluation of RFID gate concepts

Auteurs: Michael Goller Markus Brandner
Publié dans: 2011
Éditeur: KTH Royal Institute of Technology
DOI: 10.1109/RFID.2011.5764632

Preliminary Characterization of Dielectrics for Insulated Metal Substrates (IMS) of Power Modules

Auteurs: P. Seri, D. Demian, A. Reolon, A. Cavallini
Publié dans: 2024 IEEE 5th International Conference on Dielectrics (ICD), 2024
Éditeur: IEEE
DOI: 10.1109/ICD59037.2024.10613330

A more appropriate testing method for the characterization of dielectric systems in power modules (EIC2024)

Auteurs: P. Seri, D. Demian, A. Reolon, A. Cavallini
Publié dans: 2024
Éditeur: IEEE
DOI: 10.1109/EIC58847.2024.10579385

Life Cycle Assessment as an Eco-Design Tool in Power Electronics: A Case Study of 1.2 kV Si IGBT vs SiC MOSFET Modules in Motor Drive Inverter

Auteurs: Mostafa Radwan, Hossein Sadegh Lafmejani, Mervi Paulasto-Kröckel, Joonas Leppänen, Vesa Vuorinen, Marko Hinkkanen
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238612

A Link Between the Lab and the Real World - A Setup for Accelerated Aging of Power Electronics Using Mission Profiles from the Field

Auteurs: Mattias P. Eng, Madhav Mishra, Wilhelm Söderkvist Vermelin, Dag Andersson and Klas Brinkfeldt
Publié dans: 2024
Éditeur: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491457

End of life influencing factors for Dual Active Bridge components in Flow Battery Application

Auteurs: Sourabh Singh, Jelle Zeilstra, Aditya Shekhar, Pavol Bauer
Publié dans: 2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Éditeur: IEEE
DOI: 10.1109/PEMC61721.2024.10726333

Validación experimental de un convertidor resonante aislado para sistemas auxiliares en un tren

Auteurs: Giles Vieyra, Joan Elias; Rodríguez Alonso, Alberto; Hernando Álvarez, Marta María; Sebastián Zúñiga, Francisco Javier; Zelaa, B.; Aguirre J.; Castro, A.; Bermejo, J. M.; Ortega, D.
Publié dans: instname:Universidad de Oviedo (UNIOVI), 2023

Experimental Evaluation of a Gate-Step-Response Method for Device Identification used in Self-Configurable Gate-Drive Units

Auteurs: Marcus Jackson, Enes Ayaz, Shahriar Sarmast Ghahfarokhi, Bhanu Pratap Singh, Hans-Peter Nee, Staffan Norrga, Tomas Jonsson, Jang-Kwon Lim, Konstantin Kostov
Publié dans: 2024 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCEEurope62508.2024.10751952

Coordinated SSCB and Impedance-Based Restoration Scheme for Islanded Microgrids

Auteurs: Symeon Fountoukidis, Ioannis Kanimas, Nick Papanikolaou
Publié dans: 2025 Zhejiang Power Electronics Conference (ZPEC), 2025
Éditeur: IEEE
DOI: 10.1109/ZPEC67225.2025.11213230

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

Auteurs: Reza Moloudi, Bart Vandevelde, Willem Verleysen, Silke G.C. Cleuren, Lucie Masquelet, Maik Sternberg, Adrian Stelzer, Andreas Burghardt, Przemyslaw Jakub Gromala
Publié dans: 2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2024
Éditeur: IEEE
DOI: 10.1109/THERMINIC62015.2024.10732871

Data-Driven Multi-Objective Optimization of SiC Power MOSFETs

Auteurs: Anja K. Brandl, Ivana Kovacevic-Badstübner, Bhagyalakshmi Kakarla, Roland Niemeier, Ulrike Grossner
Publié dans: 2025 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2025
Éditeur: IEEE
DOI: 10.23919/ISPSD62843.2025.11117491

Generalized Analysis of Unregulated Isolated DC-DC Converter for Wide Input Voltage Variations

Auteurs: Joan Giles, Alberto Rodríguez, Aitor Vázquez, Jairo Tuñón, J. M. Bermejo, B. Zelaa, D. Ortega, Igor Larrazabal
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238272

Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules

Auteurs: Perla Malagò; Stefano Lumetti; Dominik Holzmann; Michael Ortner; Ali Roshanghias
Publié dans: Eurosensors 2023, 2024
Éditeur: MDPI
DOI: 10.3390/proceedings2024097100

Experimental validation of an isolated resonant converter for auxiliary systems in a train

Auteurs: J. Giles, A. Rodríguez, M. M. Hernando, J. Sebastián, B. Zelaa, J. Aguirre, A. Castro, J. M. Bermejo, D. Ortega
Publié dans: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe), 2023
Éditeur: IEEE
DOI: 10.23919/EPE23ECCEEUROPE58414.2023.10264614

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Auteurs: Jinglin Li, Sten Vollebregt, Yaqian Zhang, Aditya Shekhar, Alexander May, Willem D. Van Driel, Guoqi Zhang
Publié dans: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
Éditeur: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491433

Stability Analysis Based on a Virtual Twin of SiC Power MOSFET Module

Auteurs: Ivana Kovacevic-Badstuebner, Anja K. Brandl, Michel Nagel, Fernando Aguilar Vega, Bogdan Popescu, Dan Popescu, Ulrike Grossner
Publié dans: 2025 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2025
Éditeur: IEEE
DOI: 10.23919/ISPSD62843.2025.11117274

Cradle-to-Gate Life Cycle Assessment of Si IGBT and SiC MOSFET Power Modules

Auteurs: Mostafa Radwan, Mervi Paulasto-Kröckel, Vesa Vuorinen
Publié dans: 2025 IEEE Conference on Technologies for Sustainability (SusTech), 2025, ISSN 2640-6810
Éditeur: IEEE
DOI: 10.1109/SUSTECH63138.2025.11025776

Enhanced Back-to-Back Power-Hardware-in-the-Loop Test-Bed for Heavy-Duty Traction Inverter

Auteurs: Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Staffan Norrga, Hans-Peter Nee
Publié dans: 2025 Energy Conversion Congress &amp; Expo Europe (ECCE Europe), 2025
Éditeur: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238433

Transient Thermal Measurement With an Integrated Temperature Sensor in a Power Semiconductor Chip

Auteurs: Eeli Kerttula
Publié dans: 2024
Éditeur: Häme University of Applied Sciences

Acoustic Emission-Based Condition Monitoring of Power Semiconductor Modules

Auteurs: Tapio Leppänen
Publié dans: 2024
Éditeur: Aalto University

Impact of semiconductor device selection on resource and energy efficiency of power converters

Auteurs: Leppänen, Juuli
Publié dans: 2023
Éditeur: AALTO University

Life Cycle Assessment of Power Semiconductor Module Manufacturing

Auteurs: Radwan, Mostafa
Publié dans: Aalto University, 2023
Éditeur: Aalto University

Sustainability Assessment of Wide Bandgap Semiconductors in Power Electronics

Auteurs: Umama Saleem
Publié dans: 2025
Éditeur: Aalto University

Product carbon footprint life cycle assessment of Kempower Satellite and Kempower Power Unit

Auteurs: Vauhkonen, Veikka
Publié dans: 2024
Éditeur: LUT University

Thermally Conductive Buried Aluminum Nitride for Next Generation Silicon‐on‐Insulator

Auteurs: Ross Glenn; Matondang Josef; Paulasto-Kröckel Mervi; Tiwary Nikhilendu
Publié dans: Advanced Electronic Materials, 2025
Éditeur: Wiley-VCH GmbH
DOI: 10.1002/AELM.202500175

Friction and Wear in Journal Bearings: Accurate Testing and Simulation with an Outlook on Predictive Maintenance with Machine Learning

Auteurs: Sophia Bastidas, Hannes Allmaier
Publié dans: Artificial Intelligence Annual Volume 2024, 2024
Éditeur: IntechOpen
DOI: 10.5772/intechopen.1003822

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