Digitalization of Power Electronic Applications within Key Technology Value Chains

Información del proyecto

PowerizeD

Identificador del acuerdo de subvención: 101096387

DOI

10.3030/101096387

Proyecto cerrado

Fecha de la firma de la CE 1 Diciembre 2022

Fecha de inicio 1 Enero 2023

Fecha de finalización 31 Diciembre 2025

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 72 752 212,75

Aportación de la UE

€ 18 333 206,73

Coordinado por

INFINEON TECHNOLOGIES AG
Germany

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (1)

D4.6.2 Draft Summary Report on Qualification and Standardization (T4.1.3)

Data Management Plan (2)

D5.5 Updated Data Management Plan (T5.4)
D5.4 Data Management Plan (T5.4)

Websites, patent fillings, videos etc. (1)

D4.1 Project website: PowerizeD web portal establishment and operation (T4.1.1; T4.1.2; T4.2)

Publicaciones

Peer reviewed articles (21)

Analytical prediction of the thermal behavior of semiconductor power devices from room temperature I-V measurements

Autores: Sandor Ress, Gabor Farkas and Marta Rencz
Publicado en: Energies 2024, 2024, ISSN 1996-1073
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en17122931

A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices

Autores: Jinglin Li, Aditya Shekhar, Willem D. van Driel, Guoqi Zhang
Publicado en: IEEE Transactions on Electron Devices, Edición 71, 2024, ISSN 0018-9383
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TED.2024.3482252

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Autores: Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Kröckel
Publicado en: IEEE Transactions on Power Electronics, Edición 39, 2024, ISSN 0885-8993
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TPEL.2024.3447909

A Data-Driven Approach for Predicting Remaining Useful Life of Semiconductor Devices Based on Machine Learning and Synthetic Data Generation: A Review and Case Study on SiC MOSFETs

Autores: Yarens J. Cruz; Fernando Castaño; Alberto Villalonga; Madhav Mishra; Rodolfo E. Haber
Publicado en: IEEE Access, Edición Vol. 13, 2025, ISSN 2169-3536
Editor: IEEE
DOI: 10.1109/ACCESS.2025.3596444

IEEE Access

Autores: Saad Ahmad; Mariam Saeed; Juan Manuel Guerrero; Iker Muniategui-Aspiazu; Guillermo Nuñez; Igor Larrazabal; Fernando Briz
Publicado en: IEEE Access, 2025, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/ACCESS.2025.3564406

Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor

Autores: Joonas Leppänen, Atte Hoffrén, Tapio Leppänen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto Kröckel
Publicado en: IEEE Transactions on Power Electronics, 2025, ISSN 0885-8993
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TPEL.2025.3621900

Model-Based Risk Assessment of Power Converters: Case Study of On-Board Battery System for Railway

Autores: Mariam Saeed; Juan Manuel Guerrero; Victor Lopez; David Ortega; Igor Larrazabal; Juan Jose Valera; Ewald Falke; Fernando Briz
Publicado en: IEEE Open Journal of Industry Applications, 2025, ISSN 2644-1241
Editor: IEEE
DOI: 10.1109/OJIA.2025.3564730

Automation and Robotics Pilot Lines in the Context of Industry 5.0

Autores: Rubén Alonso; Tomás F. Sánchez; Diego A. Alfaro; Yarens J. Cruz; Alberto Villalonga; Fernando Castaño
Publicado en: Applied Sciences, 2025, ISSN 2076-3417
Editor: MDPI
DOI: 10.3390/APP15052510

Single Event Effects in 3.3 kV 4H-SiC MOSFETs due to MeV Ion Impact

Autores: Zimo Yuan, Jang Kwon Lim, Alex Metreveli, Hithiksha Krishna Murthy, Mietek Bakowski, Anders Hallén
Publicado en: Solid State Phenomena, Edición 361, 2024, ISSN 1662-9779
Editor: Trans Tech Publications, Ltd.
DOI: 10.4028/p-90Xrjk

Hybrid Signaling-Droop DC-Link Voltage Control for Trains With Multiple Onboard Power Sources

Autores: Saad Ahmad, Mariam Saeed, Juan Manuel Guerrero, Iker Muniategui-Aspiazu, Guillermo Nuñez, Igor Larrazabal, Fernando Briz
Publicado en: IEEE Access, Edición 13, 2025, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/ACCESS.2025.3564406

Onboard Energy Storage Systems for Railway: Present and Trends

Autores: Mariam Saeed; Fernando Briz; Juan Manuel Guerrero; Igor Larrazabal; David Ortega; Victor Lopez; Juan Jose Valera
Publicado en: IEEE Open Journal of Industry Applications, 2023, ISSN 2644-1241
Editor: IEEE
DOI: 10.1109/ojia.2023.3293059

Long Short-Term Memory Mixture Density Network for Remaining Useful Life Prediction of IGBTs

Autores: Yarens J. Cruz, Fernando Castaño, Rodolfo E. Haber
Publicado en: Technologies, Edición 13, 2025, ISSN 2227-7080
Editor: MDPI AG
DOI: 10.3390/TECHNOLOGIES13080321

Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules

Autores: Singh, Bhanu Pratap; Ghahfarokhi, Shahriar Sarmast; Kostov, Konstantin; Nee, Hans-Peter; Norrga, Staffan
Publicado en: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Editor: IEEE
DOI: 10.1109/eurosime60745.2024.10491556

Priority-Based DC-Link Voltage Control for Railway Traction Chains With Onboard Energy Storage

Autores: Saad Ahmad, Mariam Saeed, Juan Manuel Guerrero, Iker Muniategui-Aspiazu, Guillermo Nuñez, Igor Larrazabal, Fernando Briz
Publicado en: IEEE Open Journal of Industry Applications, Edición 6, 2024, ISSN 2644-1241
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/OJIA.2024.3501072

Investigation of Threshold Voltage Instability and Bipolar Degradation in 3.3 kV Conventional Body Diode and Embedded SBD SiC MOSFET

Autores: Hithiksha Krishna Murthy, Jang Kwon Lim, Mietek Bakowski
Publicado en: Solid State Phenomena, Edición 361, 2024, ISSN 1662-9779
Editor: Trans Tech Publications, Ltd.
DOI: 10.4028/p-HoOFQ0

Collaborative Training of Data-Driven Remaining Useful Life Prediction Models Using Federated Learning

Autores: Wilhelm Söderkvist Vermelin, Madhav Mishra, Mattias P. Eng, Dag Andersson, and Konstantinos Kyprianidis
Publicado en: Vol. 15 No. 2 (2024): International Journal of Prognostics and Health Management, 2024, ISSN 2153-2648
Editor: International Journal of Prognostics and Health Management
DOI: 10.36001/ijphm.2024.v15i2.3821

Performance Analysis of Energy-Efficient Path Planning for Sustainable Transportation

Autores: Dimitris Georgiadis, Konstantina Karathanasopoulou, Cleopatra Bardaki, Ilias Panagiotopoulos, Ioannis Vondikakis, Thalis Paktitis, George Dimitrakopoulos
Publicado en: Sustainability, Edición 16, 2024, ISSN 2071-1050
Editor: MDPI AG
DOI: 10.3390/su16124963

Privacy Auditing of Lithium-Ion Battery Ageing Model by Recovering Time-Series Data Using Gradient Inversion Attack in Federated Learning

Autores: Kaspars Sudars; Ivars Namatevs; Arturs Nikulins; Kaspars Ozols
Publicado en: Applied Sciences, 2025, ISSN 2076-3417
Editor: MDPI
DOI: 10.3390/APP15105704

Privacy Auditing in Differential Private Machine Learning: The Current Trends

Autores: Ivars Namatevs, Kaspars Sudars, Arturs Nikulins, Kaspars Ozols
Publicado en: Applied Sciences, Edición 15, 2025, ISSN 2076-3417
Editor: MDPI AG
DOI: 10.3390/app15020647

Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications

Autores: Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jürgen Albrecht, Mervi Paulasto-Kröckel
Publicado en: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025, ISSN 2156-3950
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/TCPMT.2025.3626444

Parameter Identification for DC-DC Buck Converter Digital Twin Considering Sensor Errors

Autores: Parsa Behzad Nazif, Mariam Saeed, Saad Ahmad, Juan Manuel Guerrero, Aitor Rodríguez Mendez, Guillermo Carlos Ozaita Araico, Igor Larrazabal, Fernando Briz
Publicado en: IEEE Journal of Emerging and Selected Topics in Power Electronics, Edición 13, 2025, ISSN 2168-6777
Editor: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/JESTPE.2025.3557520

Conference proceedings (35)

Online Junction Temperature Measurement of IGBT Power Modules with Chip-Integrated Sensor

Autores: Matthias Meißner, Dirk Rudolph, Sebastian Rode, Steffen Bernet
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238661

Comparison of Multi-level Topologies to Reduce the Components Voltage Stresses when Powered from Industrial DC Grids

Autores: Katharina Machtinger, Peter Jonke, Ulrich Boeke
Publicado en: 2024
Editor: VDE
DOI: 10.30420/566262299

Evaluation of Possible Traction Inverter Topologies for Heavy-Duty Electric Vehicles

Autores: Enes Ayaz, Marcus Jackson, Shahriar Sarmast, Bhanu Singh, Staffan Norrga, Hans-Peter Nee
Publicado en: 2024 IEEE 9th Southern Power Electronics Conference (SPEC), 2025
Editor: IEEE
DOI: 10.1109/SPEC62217.2024.10893180

Cell - Type Multilevel DC/DC Converter for Green Hydrogen Production

Autores: Symeon Fountoukidis, Konstantina Dimitriadou, Nena Apostolidou, Nick Papanikolaou
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238621

Deskewing Method for Double Pulse Test and Loss Calculation in High-Power SiC Modules

Autores: Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Marcus Jackson, Bhanu Pratap Singh, Staffan Norrga, Hans-Peter Nee, Mats Leksell
Publicado en: 2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCEEurope62508.2024.10751827

Analysis and modeling of voltage unbalance in three level dc/dc converters

Autores: Saad Ahmad, Alejandro Fernández, Mariam Saeed, Igor Larrazabal, Fernando Briz
Publicado en: IECON 2025 – 51st Annual Conference of the IEEE Industrial Electronics Society, 2025
Editor: IEEE
DOI: 10.1109/IECON58223.2025.11221257

DC Link Control for Trains with Onboard Energy Storage using Voltage Level Signalling

Autores: Saad Ahmad, Mariam Saeed, Juan M. Guerrero, Iker Muniategui, Guillermo Nuñez, David Ortega, Fernando Briz
Publicado en: 2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCEEUROPE62508.2024.10752013

Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules

Autores: Bhanu Pratap Singh Shahriar Sarmast Ghahfarokhi Konstantin Kostov RISE Research Institutes of Sweden H.-P. Nee KTH Royal Institute of Technology
Publicado en: 2024
Editor: EuroSimE
DOI: 10.1109/EuroSimE60745.2024.10491556

SiC MOSFET Condition Monitoring Using Compensated ON-State Resistance for Identifying Package Failures

Autores: Bhanu Pratap Singh, Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Hans-Peter Nee, Staffan Norrga
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238801

Common-Mode Voltage Reduction in Two-Level Inverters by Introducing Adaptive Carrier-Phase-Shift Method

Autores: Enes Ayaz, Shahriar Sarmast, Staffan Norrga, Hans-Peter Nee
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238855

Algorithm for Current Balancing in Parallel Connected Inverters

Autores: Veli-Matti Leppänen
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238442

Assessment of Parameter Identification Methods for Digital Twins of Two-Level Bidirectional Converters

Autores: Parsa Behzad Nazif, Saad Ahmad, Mariam Saeed, Juan M. Guerrero, David Ortega, Beñat Zelaa, Igor Larrazabal, Fernando Briz
Publicado en: 2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCEEUROPE62508.2024.10751896

Physics-Based Deep Learning for Online and Onboard Prediction of Insulation Degradation Under Variable Stress Conditions

Autores: P. Seri, A. Trotta, T. Schafberger, C. Reil, A. Cavallini
Publicado en: 2025 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 2025
Editor: IEEE
DOI: 10.1109/CEIDP61707.2025.11218381

Verification of Material Models of an Epoxy Mold Compound Used in Power Module

Autores: Akshay Vivek Panchwagh, Przemyslaw Jakub Gromala, Sven Rzepka, Bernhard Wunderle
Publicado en: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025
Editor: IEEE
DOI: 10.1109/EUROSIME65125.2025.11006604

Mechanical Parameter Identification for Soft Potting Materials Used in Frame-Based Power Modules

Autores: Nafız Söyleyen, Markus Hillgärtner, Tatyana Kashko, Jonas Wirries
Publicado en: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025
Editor: IEEE
DOI: 10.1109/EUROSIME65125.2025.11006528

High Current Multi-Stage Gate Drive Unit to Control the Maximum dv/dt

Autores: Tristan Eberle, Dirk Rudolph, Veli-Matti Leppanen, Steffen Bernet
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238394

A Novel Approach to Ensure Reliable EMI Performance: Identifying and Mitigating EMI Challenges in Fast Switching Power Converters

Autores: Tabish M. Ahmad, Jurgen Willaert, Przemyslaw Misiewicz, Jean-Paul M. G. Linnartz
Publicado en: 2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Editor: IEEE
DOI: 10.1109/PEMC61721.2024.10726402

Experimental evaluation of RFID gate concepts

Autores: Michael Goller Markus Brandner
Publicado en: 2011
Editor: KTH Royal Institute of Technology
DOI: 10.1109/RFID.2011.5764632

Preliminary Characterization of Dielectrics for Insulated Metal Substrates (IMS) of Power Modules

Autores: P. Seri, D. Demian, A. Reolon, A. Cavallini
Publicado en: 2024 IEEE 5th International Conference on Dielectrics (ICD), 2024
Editor: IEEE
DOI: 10.1109/ICD59037.2024.10613330

A more appropriate testing method for the characterization of dielectric systems in power modules (EIC2024)

Autores: P. Seri, D. Demian, A. Reolon, A. Cavallini
Publicado en: 2024
Editor: IEEE
DOI: 10.1109/EIC58847.2024.10579385

Life Cycle Assessment as an Eco-Design Tool in Power Electronics: A Case Study of 1.2 kV Si IGBT vs SiC MOSFET Modules in Motor Drive Inverter

Autores: Mostafa Radwan, Hossein Sadegh Lafmejani, Mervi Paulasto-Kröckel, Joonas Leppänen, Vesa Vuorinen, Marko Hinkkanen
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238612

A Link Between the Lab and the Real World - A Setup for Accelerated Aging of Power Electronics Using Mission Profiles from the Field

Autores: Mattias P. Eng, Madhav Mishra, Wilhelm Söderkvist Vermelin, Dag Andersson and Klas Brinkfeldt
Publicado en: 2024
Editor: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491457

End of life influencing factors for Dual Active Bridge components in Flow Battery Application

Autores: Sourabh Singh, Jelle Zeilstra, Aditya Shekhar, Pavol Bauer
Publicado en: 2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC), 2024
Editor: IEEE
DOI: 10.1109/PEMC61721.2024.10726333

Validación experimental de un convertidor resonante aislado para sistemas auxiliares en un tren

Autores: Giles Vieyra, Joan Elias; Rodríguez Alonso, Alberto; Hernando Álvarez, Marta María; Sebastián Zúñiga, Francisco Javier; Zelaa, B.; Aguirre J.; Castro, A.; Bermejo, J. M.; Ortega, D.
Publicado en: instname:Universidad de Oviedo (UNIOVI), 2023

Experimental Evaluation of a Gate-Step-Response Method for Device Identification used in Self-Configurable Gate-Drive Units

Autores: Marcus Jackson, Enes Ayaz, Shahriar Sarmast Ghahfarokhi, Bhanu Pratap Singh, Hans-Peter Nee, Staffan Norrga, Tomas Jonsson, Jang-Kwon Lim, Konstantin Kostov
Publicado en: 2024 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCEEurope62508.2024.10751952

Coordinated SSCB and Impedance-Based Restoration Scheme for Islanded Microgrids

Autores: Symeon Fountoukidis, Ioannis Kanimas, Nick Papanikolaou
Publicado en: 2025 Zhejiang Power Electronics Conference (ZPEC), 2025
Editor: IEEE
DOI: 10.1109/ZPEC67225.2025.11213230

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

Autores: Reza Moloudi, Bart Vandevelde, Willem Verleysen, Silke G.C. Cleuren, Lucie Masquelet, Maik Sternberg, Adrian Stelzer, Andreas Burghardt, Przemyslaw Jakub Gromala
Publicado en: 2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2024
Editor: IEEE
DOI: 10.1109/THERMINIC62015.2024.10732871

Data-Driven Multi-Objective Optimization of SiC Power MOSFETs

Autores: Anja K. Brandl, Ivana Kovacevic-Badstübner, Bhagyalakshmi Kakarla, Roland Niemeier, Ulrike Grossner
Publicado en: 2025 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2025
Editor: IEEE
DOI: 10.23919/ISPSD62843.2025.11117491

Generalized Analysis of Unregulated Isolated DC-DC Converter for Wide Input Voltage Variations

Autores: Joan Giles, Alberto Rodríguez, Aitor Vázquez, Jairo Tuñón, J. M. Bermejo, B. Zelaa, D. Ortega, Igor Larrazabal
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238272

Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules

Autores: Perla Malagò; Stefano Lumetti; Dominik Holzmann; Michael Ortner; Ali Roshanghias
Publicado en: Eurosensors 2023, 2024
Editor: MDPI
DOI: 10.3390/proceedings2024097100

Experimental validation of an isolated resonant converter for auxiliary systems in a train

Autores: J. Giles, A. Rodríguez, M. M. Hernando, J. Sebastián, B. Zelaa, J. Aguirre, A. Castro, J. M. Bermejo, D. Ortega
Publicado en: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe), 2023
Editor: IEEE
DOI: 10.23919/EPE23ECCEEUROPE58414.2023.10264614

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Autores: Jinglin Li, Sten Vollebregt, Yaqian Zhang, Aditya Shekhar, Alexander May, Willem D. Van Driel, Guoqi Zhang
Publicado en: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
Editor: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491433

Stability Analysis Based on a Virtual Twin of SiC Power MOSFET Module

Autores: Ivana Kovacevic-Badstuebner, Anja K. Brandl, Michel Nagel, Fernando Aguilar Vega, Bogdan Popescu, Dan Popescu, Ulrike Grossner
Publicado en: 2025 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2025
Editor: IEEE
DOI: 10.23919/ISPSD62843.2025.11117274

Cradle-to-Gate Life Cycle Assessment of Si IGBT and SiC MOSFET Power Modules

Autores: Mostafa Radwan, Mervi Paulasto-Kröckel, Vesa Vuorinen
Publicado en: 2025 IEEE Conference on Technologies for Sustainability (SusTech), 2025, ISSN 2640-6810
Editor: IEEE
DOI: 10.1109/SUSTECH63138.2025.11025776

Enhanced Back-to-Back Power-Hardware-in-the-Loop Test-Bed for Heavy-Duty Traction Inverter

Autores: Shahriar Sarmast Ghahfarokhi, Enes Ayaz, Staffan Norrga, Hans-Peter Nee
Publicado en: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), 2025
Editor: IEEE
DOI: 10.1109/ECCE-EUROPE62795.2025.11238433

Thesis and dissertations (6)

Transient Thermal Measurement With an Integrated Temperature Sensor in a Power Semiconductor Chip

Autores: Eeli Kerttula
Publicado en: 2024
Editor: Häme University of Applied Sciences

Acoustic Emission-Based Condition Monitoring of Power Semiconductor Modules

Autores: Tapio Leppänen
Publicado en: 2024
Editor: Aalto University

Impact of semiconductor device selection on resource and energy efficiency of power converters

Autores: Leppänen, Juuli
Publicado en: 2023
Editor: AALTO University

Life Cycle Assessment of Power Semiconductor Module Manufacturing

Autores: Radwan, Mostafa
Publicado en: Aalto University, 2023
Editor: Aalto University

Sustainability Assessment of Wide Bandgap Semiconductors in Power Electronics

Autores: Umama Saleem
Publicado en: 2025
Editor: Aalto University

Product carbon footprint life cycle assessment of Kempower Satellite and Kempower Power Unit

Autores: Vauhkonen, Veikka
Publicado en: 2024
Editor: LUT University

Monographic books (1)

Thermally Conductive Buried Aluminum Nitride for Next Generation Silicon‐on‐Insulator

Autores: Ross Glenn; Matondang Josef; Paulasto-Kröckel Mervi; Tiwary Nikhilendu
Publicado en: Advanced Electronic Materials, 2025
Editor: Wiley-VCH GmbH
DOI: 10.1002/AELM.202500175

Book chapters (1)

Friction and Wear in Journal Bearings: Accurate Testing and Simulation with an Outlook on Predictive Maintenance with Machine Learning

Autores: Sophia Bastidas, Hannes Allmaier
Publicado en: Artificial Intelligence Annual Volume 2024, 2024
Editor: IntechOpen
DOI: 10.5772/intechopen.1003822