TERahertz ReconfigurAble METAsurfaces for ultra-high rate wireless communications

Time-Domain Channel Estimation for Extremely Large MIMO THz Communications with Beam Squint

Autori: George C. Alexandropoulos; Yonina C. Eldar; Aryan Kaushik; Evangelos Vlachos
Pubblicato in: IEEE Open Journal of the Communications Society, 2023
Editore: IEEE
DOI: 10.36227/techrxiv.24310423.v1

Holographic MIMO Communications: Theoretical Foundations, Enabling Technologies, and Future Directions

Autori: Gong, Tierui and Gavriilidis, Panagiotis and Ji, Ran and Huang, Chongwen and Alexandropoulos, George C. and Wei, Li and Zhang, Zhaoyang and Debbah, Mérouane and Poor, H. Vincent and Yuen, Chau
Pubblicato in: IEEE Communications Surveys & Tutorials, 2023, ISSN 1553-877X
Editore: IEEE
DOI: 10.1109/COMST.2023.3309529

Max-Min SINR Analysis of STAR-RIS Assisted Massive MIMO Systems with Hardware Impairments

Autori: A. Papazafeiropoulos, P. Kourtessis and S. Chatzinotas
Pubblicato in: IEEE Transactions on Wireless Communications, 2023, ISSN 1558-2248
Editore: IEEE
DOI: 10.1109/TWC.2023.3316707

Full-Duplex Wireless for 6G: Progress Brings New Opportunities and Challenges

Autori: B. Smida, A. Sabharwal, G. Fodor, G. C. Alexandropoulos, H. A. Suraweera and C. -B. Chae
Pubblicato in: IEEE Journal on Selected Areas in Communications, 2023, ISSN 1558-0008
Editore: IEEE
DOI: 10.48550/arxiv.2304.08789

Tri-Polarized Holographic MIMO Surfaces for Near-Field Communications: Channel Modeling and Precoding Design

Autori: L. Wei, C. Huang, G.C. Alexandropoulos, Z. Yang, J. Yang, EI Wei, Z. Zhang, M. Debbah, C Yuen
Pubblicato in: IEEE Transactions on Wireless Communications, 2023, ISSN 1558-2248
Editore: IEEE
DOI: 10.1109/TWC.2023.3266298

Perspective: Zinc-Tin Oxide based Memristors for Sustainable and Flexible In-memory computing edge devices

Autori: Carlos Silva, Jonas Deuermeier, Weidong Zhang, Emanuel Carlos, Pedro Barquinha, Rodrigo Martins, Asal Kiazadeh
Pubblicato in: Advanced Electronic Materials, 2023, ISSN 2199-160X
Editore: Wiley
DOI: 10.1002/aelm.202300286

Stacked Intelligent Metasurfaces for Efficient Holographic MIMO Communications in 6G

Autori: J. An, C. Xu, DWK Ng, G.C. Alexandropoulos, C. Huang, C. Yuen, L. Hanzo
Pubblicato in: IEEE Journal on Selected Areas in Communications, 2023, ISSN 1558-0008
Editore: IEEE
DOI: 10.48550/arxiv.2305.08079

RIS-Enabled and Access-Point-Free Simultaneous Radio Localization and Mapping

Autori: Kim H, Chen H, Keskin MF, Ge Y, Keykhosravi K, Alexandropoulos GC, Kim S, Wymeersch H.
Pubblicato in: IEEE Transactions on Wireless Communications, 2023, ISSN 1558-2248
Editore: IEEE
DOI: 10.1109/TWC.2023.3307455

Full Duplex Holographic MIMO for Near-Field Integrated Sensing and Communications

Autori: I. Gavras, M. A. Islam, B. Smida and G. C. Alexandropoulos
Pubblicato in: European Signal Processing Conference (EUSIPCO), 2023, ISSN 2076-1465
Editore: IEEE
DOI: 10.23919/EUSIPCO58844.2023.10289894

On the Requirements on Reflective Intelligent Surfaces in THz NLOS Backhaul Links

Autori: Thomas Kürner, Bo Kum Jung, Christoph Herold
Pubblicato in: XXXVth URSI General Assembly and Scientific Symposium, 2023
Editore: IEEE
DOI: 10.46620/URSIGASS.2023.2288.FKNW9115

Full-Duplex-Enabled Joint Communications and Sensing with Reconfigurable Intelligent Surfaces

Autori: C. K. Sheemar, G. C. Alexandropoulos, D. Slock, J. Querol and S. Chatzinotas
Pubblicato in: European Signal Processing Conference (EUSIPCO), 2023, ISSN 2076-1465
Editore: IEEE
DOI: 10.48550/arxiv.2306.10865

Channel Modeling and Multi-User Precoding for Tri-Polarized Holographic MIMO Communications

Autori: L. Wei, C. Huang, G.C. Alexandropoulos, Z. Yang, J. Yang, EI Wei, M. Debbah, C. Yuen
Pubblicato in: IEEE International Conference on Communications, 2023, ISSN 1938-1883
Editore: IEEE
DOI: 10.48550/arxiv.2302.05337

Near-field Focusing with Transmitarrays: Impact of Phase Quantization

Autori: M. Defives, R. Sauleau, M. Arrebola and A. Clemente
Pubblicato in: International Conference on Electromagnetics in Advanced Applications, 2023, ISSN 2766-2284
Editore: IEEE
DOI: 10.1109/ICEAA57318.2023.10297664

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