Exploring the nanoscale mechanisms of Ni-P system to examine the suitability as joining material for high temperature applications.
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Autori:
Bhattacharya, R., P. Rajashekar, M. Ek, and F. Lenrick.
Pubblicato in:
14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding, Numero 399, 2025
Editore:
DVS Media GmbH
DOI:
10.53192/LOET20250212
Examining Phosphorus Effects on Base Materials: A Microstructural Perspective.
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Autori:
Yondu, Z. I., Stergiopoulou, X., Lenrick, F
Pubblicato in:
14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding, Numero 399, 2025
Editore:
DVS Media GmbH
DOI:
10.53192/LOET20250336
Dephosphorization of copper phosphide to copper.
(si apre in una nuova finestra)
Autori:
Rajashekar, P., R. Bhattacharya, M. Ek, and F. Lenrick
Pubblicato in:
14th International Conference on Brazing, High Temperature Brazing and Diffusion Bonding, Numero 399, 2025
Editore:
DVS Media GmbH
DOI:
10.53192/LOET20250340