Scalable Hardware for Large-Scale Quantum Computing

Projektinformationen

SCALLOP

ID Finanzhilfevereinbarung: 101136793

DOI

10.3030/101136793

EK-Unterschriftsdatum 7 September 2023

Startdatum 1 September 2023

Enddatum 31 August 2026

Finanziert unter

• The European Innovation Council (EIC)

Gesamtkosten

€ 2 499 998,75

EU-Beitrag

€ 2 499 998,75

Koordiniert durch

SEMIQON TECHNOLOGIES OY
Finland

Periodic Reporting for period 1 - SCALLOP (Scalable Hardware for Large-Scale Quantum Computing)

Berichtszeitraum: 2023-09-01 bis 2024-08-31

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

Computational power is a critical driver of innovation. The ability to quickly and accurately process large amounts of data and solve complex problems has enabled new breakthroughs in fields ranging from finance and healthcare to material science and engineering. However, traditional computing paradigms are reaching their limits. The limitations of classical computing can be overcome by quantum computing. Quantum computers excel at optimization tasks such as solving complex logistical problems; one day, they may be able to accurately model viruses and drugs, as well as come up with climate solutions .

To realize this potential, large-scale and fault-tolerant quantum computers with millions of qubits are required, which is currently not possible due to hardware and scalability limitations of currently available solutions. We overcome these challenges by incorporating a commercial-ready, scalable silicon technology for quantum processing units, where integrated cryo-CMOS multiplexer is utilized for efficient and precise control of high-quality silicon spin qubits, paving the way to accommodate millions of qubits.

The final demonstrator system built in the SCALLOP project will be a significant step forward in the development of microsystems for implementing silicon spin qubits, as well as progress toward a scalable, fault-tolerant quantum computer requiring millions of qubits.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

During the first phase of the SCALLOP project we predominantly took the following actions and completed the following tasks:
- Outlined the specifications of the full-stack demonstrator
- Designed the fabrication process step for manufacturing the quantum chips.
- Completed the first fabrication run of the chips and characterization both at room and cryogenic temperatures
- Learnings from the first fabrication run was incorporated in the second fabrication run which is currently ongoing.
- Design for the final, integrated chip that is to be incorporated with the readout electronics is currently being developed.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

As part of the project we developed a cryogenic CMOS transistor technology that showed beyond state of the art performance. The efficient switching characteristics of this new CMOS technology enable ultra-low power cryogenic CMOS for control and interfacing of quantum processors and other quantum systems (https://arxiv.org/pdf/2410.01077).