Project description
Multi-functional and sustainable in-mould electronics
The demand for advanced electronic products in industrial, automotive and sensing applications is increasing the use of in-mould electronics, which integrate circuits and sensors into 3D moulded objects. However, challenges persist, especially with overmoulding processes, which currently only achieve an 85 % yield, which is too low for cost-effective production. The use of multi-material compounds complicates recycling efforts. Moreover, capacitive sensors often fail to function with gloves or provide haptic feedback, diminishing user experience. To address these issues, the EU-funded MULTIMOLD project aims to develop a manufacturing process for in-mould electronics using robust, weather-resistant materials that provide inherent recyclability by design. By integrating multimodal sensors, haptic feedback and power supply onto multi-functional surfaces MULTIMOLD expects to deliver products with enhanced performance and sustainability.
Objective
Film insert molding and in-mold decoration are standard processes in injection molding allowing to generate 3D shaped objects with seamlessly integrated graphics and high freedom in design. With the emerging functional printing of circuits and sensors, the field of in-mold electronics has extremely expanded covering several applications (i.e. Human Machine Interface in automotive and industries, condition monitoring and sensors in energy generation field, healthcare, etc.).
The entire manufacturing process for in-mold electronics includes several sub-processes, most of which have a high yield of ~ 99%. However, the yield for overmolding, which is crucial for the production of complex products, is 85% at best, resulting in an overall yield that is far too low and requires high tooling and process optimization costs. Since nowadays in-mold electronic products are multi-material compounds that are difficult to recycle they do not meet the requirements of European society and policy on sustainability and circularity. The currently used capacitive sensors are not usable with cold fingers or gloves and do not provide haptic feedback, thus leading to an unsatisfactory user experience. Moreover, the direct lightning by LEDs placed in the vicinity of capacitive sensors generates a substantial heat inside the injection-molded part, leading to low durability and bad user experience in the Human Machine Interface.
To overcome these limitations the objective of the MULTIMOLD project is to develop the next generation manufacturing process for products with complex geometries based on in-mold electronics with a robust, weather-resistant material concept that provides inherent recyclability by design. The MULTIMOLD complex products will combine advanced electronic functionality, multimodal sensors, haptic feedback, and power supply with micro- and nanostructured functional surfaces that may be light guiding, anti-bacterial, anti-icing, easy-to-clean and have appealing textures.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
- natural sciences mathematics pure mathematics geometry
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.2.4 - Digital, Industry and Space
MAIN PROGRAMME
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HORIZON.2.4.1 - Manufacturing Technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-IA - HORIZON Innovation Actions
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-CL4-2023-TWIN-TRANSITION-01
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
8010 GRAZ
Austria
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.