Advanced Research on Cryogenic Technologies for Innovative Computing

Project Information

ARCTIC

Grant agreement ID: 101139908

DOI 10.3030/101139908

EC signature date 11 June 2024

Start date 1 April 2024

End date 31 March 2027

Funded under

• Digital, Industry and Space

Total cost € 34 604 389,70

EU contribution € 11 267 698,98

Coordinated by

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Peer reviewed articles (6)

A Physical TCAD Mobility Model of Amorphous In-Ga-Zn-O (a-IGZO) Devices with Spatially Varying Mobility Edges, Band-Tails, and Enhanced Low-Temperature Convergence

Author(s): Mischa Thesberg, Franz Schanovsky, Ying Zhao, Markus Karner, Jose Maria Gonzalez-Medina, Zlatan Stanojevi, Adrian Chasin, Gerhard Rzepa
Published in: Micromachines, Issue 15, 2024, ISSN 2072-666X
Publisher: MDPI AG
DOI: 10.3390/mi15070829

Harnessing ferroic ordering in thin film devices for analog memory and neuromorphic computing applications down to deep cryogenic temperatures

Author(s): Sayani Majumdar
Published in: Frontiers in Nanotechnology, 2024, ISSN 2673-3013
Publisher: Frontiers
DOI: 10.3389/FNANO.2024.1371386

Understanding fatigue and recovery mechanisms in Hf_0.5Zr_0.5O₂ capacitors for designing high endurance ferroelectric memory and neuromorphic hardware

Author(s): Xinye Li; Padma Srivari; Ella Paasio; Sayani Majumdar
Published in: Nanoscale, 2025, ISSN 2040-3372
Publisher: Royal Society of Chemistry
DOI: 10.1039/D4NR04861J

Can ferroelectric tunnel junction be a game changer as eNVM and in neuromorphic hardware?

Author(s): Sayani Majumdar
Published in: APL Machine Learning, Issue 3, 2025, ISSN 2770-9019
Publisher: AIP Publishing
DOI: 10.1063/5.0252822

Understanding the Transistor Behavior of Electron-Spin Qubits Above Cryogenic Temperatures

Author(s): Francesco Lorenzelli, Clement Godfrin, Michele Stucchi, Alexander Grill, Ruoyu Li, Danny Wan, Kristiaan De Greve, Erik Jan Marinissen, Georges Gielen
Published in: IEEE Electron Device Letters, Issue 45, 2024, ISSN 1558-0563
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/LED.2024.3463009

A Physics‐Based Compact Model for Ferroelectric Capacitors Operating Down to Deep Cryogenic Temperatures for Applications in Analog Memory and Neuromorphic Architectures

Author(s): Ella Paasio, Rikhard Ranta, Sayani Majumdar
Published in: Advanced Electronic Materials, 2025, ISSN 2199-160X
Publisher: Wiley
DOI: 10.1002/AELM.202400840

Conference proceedings (2)

Next Generation of Thermo-Compression Bonding Equipment

Author(s): Jonathan Abdilla, Martin Kainz, Benedikt Pressl, Mario Fraubaum, Chris Scanlan
Published in: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), 2025
Publisher: IEEE
DOI: 10.1109/EPTC62800.2024.10909759

An Experimentally Validated TCAD Variability Study of the Relative Performance of In-Ga-Zn-O and Poly-Si-Channel Ferroelectric VNANDs

Author(s): M. Thesberg, Z. Stanojevi, F. Schanovsky, J.M. Gonzalez-Medina, G. Rzepa, F. Mitterbauer, O. Baumgartner, M. Karner
Published in: 2024 IEEE International Electron Devices Meeting (IEDM), 2024, ISSN 2156-017X
Publisher: IEEE
DOI: 10.1109/IEDM50854.2024.10873461