Mycelium-based substrate for sustainable flexible PCBs

Projektinformationen

MycoSub

ID Finanzhilfevereinbarung: 101157752

DOI

10.3030/101157752

Projekt abgeschlossen

EK-Unterschriftsdatum 24 Januar 2024

Startdatum 1 Februar 2024

Enddatum 31 Juli 2025

Finanziert unter

• European Research Council (ERC)

Gesamtkosten

Keine Daten

EU-Beitrag

€ 150 000,00

Koordiniert durch

UNIVERSITAT LINZ
Austria

Periodic Reporting for period 1 - MycoSub (Mycelium-based substrate for sustainable flexible PCBs)

Berichtszeitraum: 2024-02-01 bis 2025-07-31

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

The overall objective of the MycoSub project was to advance the development of mycelium-based substrates from TRL 4 to TRL 7 in direct cooperation with leading industrial partners. This effort addressed all aspects relevant for industrial implementation: (i) developing approaches to render substrate production scalable, (ii) characterizing the material according to industry standards in order to facilitate the acquisition of relevant certificates, (iii) establishing scalable industrial processes for converting the substrates into circuit boards analogous to conventional non-degradable flexible PCBs, (iv) developing more sustainable additive manufacturing techniques such as screen printing or direct ink writing (DIW), and (v) assembling fully populated demonstrator boards using each of the proposed technological routes.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

In this project we developed efficient and scalable methods for fabricating mycelium substrates for flexible PCBs, with improvements in both the growth phase and post-processing. We also investigated functionalization procedures, including those commonly used in industrial processing, to demonstrate the potential of mycelium materials for commercial applications.
Through advances in solid-state fermentation, we can now reliably produce homogeneous sheets of pure mycelium with minimal manual intervention. The optimized post-processing methods enhance electrical and mechanical properties such as resistivity, tensile strength, and surface quality. In addition, we successfully fabricated demonstrators, including NFC tags and sensors, which confirm the feasibility of using mycelium substrates in electronic products.
As a complementary approach, we introduced liquid-state fermentation as an alternative route for producing mycelium sheets. This method requires less growth volume and yields thinner, even more homogeneous sheets of pure mycelium material, further broadening the processing options available.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

Mycelium-based materials have the potential to advance sustainable solutions across various industrial sectors, including packaging, construction, and leather substitutes. In electronics, the demand for sustainable and degradable materials is particularly high to address issues of pollution and health hazards. Within this project, we demonstrated that mycelium substrates can serve as alternatives to conventional flexible materials such as polyimide in flexible electronics.

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