European pilot line for beyond 2nm leading edge System-on-Chip leadership

Información del proyecto

NanoIC

Identificador del acuerdo de subvención: 101183277

DOI

10.3030/101183277

Fecha de la firma de la CE 10 Diciembre 2024

Fecha de inicio 1 Enero 2024

Fecha de finalización 31 Diciembre 2028

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 551 778 479,00

Aportación de la UE

€ 448 006 739,89

Coordinado por

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Publicaciones

Conference proceedings (43)

Half-Height Double-Row CFET Standard Cells for Area Optimized Placement in A7 CMOS Node

Autores: Kukner, Halil; Lin, Ji-Yung; Yang, Sheng; Verschueren, Lynn; Boemmels, Juergen; Farokhnejad, Anita; Van de Put, Maarten; Zografos, Odysseas; Horiguchi, Naoto; Hellings, Geert; Garcia Bardon, Marie; Ryckaert, Julien
Publicado en: 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2025, ISSN 1558-2434
Editor: IEEE
DOI: 10.5281/ZENODO.18449699

mCFET inner spacer cavity etch: process development and challenges

Autores: Pallavi Puttarame Gowda, Steven Demuynck, Mohamed Saib, Ann Feyen, Ali Abdelgawad, Naveen Reddy, Alina Arslanova, Alexis Franquet, Rita Tilmann, XiuMei Xu, Beatriz Escorcia Ramirez, Camila Toledo de Carvalho Cavalcante, Andy Peng, Dmitry Batuk, Reda Boufa
Publicado en: Proc. SPIE 13429, Advanced Etch Technology and Process Integration for Nanopatterning XIV, Edición 134290D , 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3055311

Alternative EUV multilayer mirror mask for reduced mask 3D effects evaluated at NA0.33

Autores: Tatiana Kovalevich, Nick Pellens, Guillaume Libeert, Lieve Van Look, Andreas Frommhold, Vicky Philipsen, Tsukasa Abe, Yukihiro Fujimura, Izumi Hotei, Mei Ebisawa, Masataka Yamaji, Shosuke Tomizuka, Shingo Yoshikawa
Publicado en: Proc. SPIE 13687, Photomask Technology 2025, Edición 1368711, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3071379

Performance Improvement in Sub-2nm Node Nanosheet-FETs Through Optimization of Spacer Interface and Dopant Activation

Autores: Pondini, Andrea; Eyben, Pierre; Arimura, Hiroaki; Matagne, Philippe; Chiarella, Thomas; Ganguly, Jishnu; Porret, Clement; Rosseel, Erik; Mertens, Hans; Mitard, Jerome; Verhulst, Anne
Publicado en: 2025 IEEE European Solid-State Electronics Research Conference (ESSERC), 2025, ISSN 2643-1319
Editor: IEEE
DOI: 10.1109/ESSERC66193.2025.11213994

Tuning, modelling, and verifying effects of intermixing on EUV multilayer mirror performance via a combined simulation and experimental approach

Autores: Kevin M. Dorney, Eva Nerke, Katrina Rook, Antonio Checco, Vitaly Krasnov, Ankit Nalin Mehta, Andrea Impagnatiello, Ulrich Klostermann, Andy Dawes, Ulrich Welling, Wolfgang Hoppe, Meng Lee, Vicky Philipsen
Publicado en: Proc. SPIE 13687, Photomask Technology 2025, Edición 136870Z, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3071890

Novel Low Temperature SiO2 Formation Process by Oxygen and Hydrogen Radicals for Core and I/O RMG Stacks: Achieving the Ultimate NBTI Reliability with a Charge-Free IL

Autores: J. Franco, H. Arimura, J. P. Bastos, V. Afanas’ev, J.-F. de Marneffe, M.-S. Kim, B. Kaczer, N. Horiguchi
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.1109/IEDM50572.2025.11353598

Understanding the impact of the EUV photon absorption distribution in a patterned EUV resist and its lithographic performance

Autores: Danilo De Simone, Vicky Philipsen, Alessandro Vaglio Pret, Anatoly Burov
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 136860D, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3072194

Depth-of-focus enhancement in high-numerical aperture EUV lithography by source and mask optimization

Autores: Guillaume Libeert, Joern-Holger Franke, Sofia Leitao, Natalia Davydova, Praniesh Ayyanar Ramachandran, Susan Sherin Kadeparambil Varghese, Vicky Philipsen
Publicado en: Proc. SPIE 13687, Photomask Technology 2025, Edición 136870P, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3072478

Energy-efficient EUV lithography using PFAS-free, light-curable underlayers for advanced nodes

Autores: Seonggil Heo, Jelle Vandereyken, Min Seong Jeong, Elke Caron, Wesley Zanders, Seungjoo Baek, Andreia Santos, Douglas J. Guerrero, Veerle Van Driessche, Masahiko Harumoto
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 136860P, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3072177

Hybrid Channel monolithic-CFET with Si (110) pMOS and (100) nMOS

Autores: A. Vandooren, S. Iacovo, V. Brissonneau, T. Chiarella, C. Cullen, D. Casey, G. Rengo, R. Khazaka, P. Eyben, V. S. Kumar Channam, J. Ganguly, K. Stiers, C. Sheng, C. Cavalcante, M. Hosseini, D. Batuk, A. Peng, X. Zhou, R. Sarkar, A. Veloso, A. Mingardi, S. K. Sarkar, R. Kumar Saroj, R. Chukka, V. Georgieva, R. Loo, C. Porret, T. Dursap, A. Akula, S. Choudhury, E. Dupuy, A. Peter, N. Jourdan, K. Vandersmissen, D. Montero, E. Vrancken, F. Sebaai, P. Puttarame Gowda, J.-G. Lai, B. T. Chan, A. Sepulveda Marquez, R. Langer, S. Brems, I. Gyo Koo, E. Altamirano Sanchez, K. Devriendt, J. Mitard, L.P.B. Lima, S. Subramanian, N. Horiguchi, S. Demuynck, S. Biesemans
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.1109/IEDM50572.2025.11353866

Thermal conductivity of underlayers for EUV lithography and its effect on sensitivity of metal oxide resist

Autores: Roberto Fallica, Danilo De Simone, Patrick E. Hopkins, Andrew Jones, John Gaskins
Publicado en: Proc. SPIE 13424, Optical and EUV Nanolithography XXXVIII, Edición 1342416 , 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051713

Patterning optimization for single exposure BLP and SNLP DRAM layers with 0.33NA and 0.55NA EUV lithography

Autores: Van Tuong Pham, Victor Blanco, Jeonghoon Lee, Werner Gillijns, Soobin Hwang, Ardavan Niroomand, Sara Paolillo, Annaelle Demaude, Won Chan Lee, Yannick Feurprier, Kathleen Nafus, Nobuyuki Fukui, Nayoung Bae, Yuhei Kuwahara, Peter De Schepper, Dhruv Tyagi,
Publicado en: Proc. SPIE 13428, Advances in Patterning Materials and Processes XLII, Edición 1365507, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051494

e-beam Metrology for High-NA: Revisiting the imec Protocol

Autores: Gian Francesco Lorusso, Alain Moussa, Sahel Habashieh, Dieter Van Den Heuvel, Diziana Vangoidsenhoven, Mihir Gupta, Hyo Seon Suh, Ying-Lin Chen, Danilo De Simone, Chris Mack, Wei Sun, Masaki Sugie, Philippe Foubert, Miki Isawa, Anne-Laure Charley
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134260L , 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3052366

BEFORCE: An advanced, versatile platform for unravelling and quantifying EUV photoresist chemistry during exposure, processing, and interaction with the environment

Autores: Ivan Pollentier, Kevin Dorney, Lorenzo Piatti, Fabian Holzmeier, Hyo Seon Suh
Publicado en: Proc. SPIE 13428, Advances in Patterning Materials and Processes XLII, Edición 134282G, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051268

3D metrology and inspection to enable the rise of stacked transistors, wafers and chips

Autores: J. Bogdanowicz, A.-L. Charley, P. Leray, R. G. Liu
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 1342604, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3052399

IGZO Based eDRAM: Bitcell and Array Optimization Enabling Denser Last Level Caches

Autores: Sharma, Arvind Kumar; Oh, Hyungrock; Verschueren, Lynn; Subhechha, Subhali; rassoul, Nouredine; Garcia Bardon, Marie; Belmonte, Attilio; Kar, Gouri Sankar; Hellings, Geert; Biswas, Dwaipayan; Garcia Redondo, Fernando
Publicado en: 2025 IEEE European Solid-State Electronics Research Conference (ESSERC), 2025, ISSN 2643-1319
Editor: IEEE
DOI: 10.5281/ZENODO.18392702

Defectivity-aware EUV process window characterization for monolithic complementary FET HAR and 3D patterning

Autores: Hongcheon Yang, Min-Soo Kim, Xiuju Zhou, Christophe Beral, Anne-Laure Charley, Balakumar Baskaran, Kaushik Sah, Loemba Bouckou, Luca Barbisan, Ganesha Durbha, Nikil Paithankar, Zhijin Chen, Roel Gronheid
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 136860S, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3071887

Optimization toward Non-Zero Offset Stability in Overlay Control: Trends and Prospects

Autores: Nadav Gutman, Bart Baudemprez, Hongcheon Yang, Christophe Beral, Anne-Laure Charley, Loemba Bouckou, Roel Gronheid, Yaniv Weiss, Sofia Napso, Linoy Nagar-shaul, Chufan Zhang, Dana Klein, Yuval Lamhot, Yuval Lubashevsky, Renan Milo, Efi Megged
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134260I, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051073

Multi-node scaling potential of monolithic CFET

Autores: Yang, Sheng; Verschueren, Lynn; Boemmels, Juergen; Kukner, Halil; Lin, Ji-Yung; Bufler, Fabian; Sankatali, V.; Farokhnejad, Anita; Van de Put, Maarten; Hellings, Geert
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.5281/ZENODO.18451566

Inline X-ray metrology for Complementary Field-Effect Transistors (CFET)

Autores: J. Bogdanowicz, A. Mingardi, V. Brissonneau, R. Loo, Y. Shimura, A. Akula, P. P. Gowda, D. Zhou, N. Horiguchi, S. Biesemans, M. Kuhn, S. Murakami, Y. Ito, A. Higuchi, P. Leray, A.-L. Charley
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134261G, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3050810

First Demonstration of Field Free Switching Perpendicular SOT-MRAM 4kb Array Using Z-Spin

Autores: Gama Monteiro Junior, Maxwel; Kumar, Ankit; Kateel, Vaishnavi; Vermeulen, Bob; Coester, Birte; Chatterjee, Jyotirmoy; Talmelli, Giacomo; Palomino, Alvaro; Urrestarazu-Larrañaga, Joseba; Van Beek, Simon; Wostyn, Kurt; Rao, Siddharth; NGUYEN, Van Dai; Kar, Gouri Sankar
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.5281/ZENODO.18451467

Impact of MOR anomalies on lithography and OPC: challenges and solutions

Autores: Pervaiz Kareem, Werner Gillijns, Kevin Dorney
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 1368609, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3071885

Hexagonal Contact Holes patterning at 32 nm pitch: influence of the stack and of the etching process on AEI performances

Autores: S. Paolillo, D. Van Den Heuvel, P. Bezard, C. Beral, B. Chowrira, A. Demaude, R. Vallat, L. Souriau, A. Moussa, M. Beggiato, P. Foubert
Publicado en: Proc. SPIE 13429, Advanced Etch Technology and Process Integration for Nanopatterning XIV, Edición 13429, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3052173

Energy-efficient optical crosslinking system and PFAS-free underlayers in ArFi lithography: key enablers for sustainable semiconductor technologies and systems

Autores: Min Seong Jeong, Seonggil Heo, Jelle Vandereyken, Elke Caron, Wesley Zanders, Seungjoo Baek, Andreia Santos, Douglas J. Guerrero, and Masahiko Harumoto
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 1368621, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3073131

High NA EUV defectivity inspection: overview and challenges

Autores: C. Beral, D. Van Den Heuvel, M. Beggiato, B. Chowrira, S. Paolillo, A. Moussa, P. Foubert, D. Cerbu, A. Demaude, P. Leray, A. L. Charley
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134261H, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051293

Unraveling the role of environment on the lithographic performance of metal oxide resists: key role of oxygen during post-exposure bake

Autores: Ivan Pollentier, Fabian Holzmeier, Hyo Seon Suh, Kevin Dorney
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 1368616, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3072102

3.5T CFET Block-Level DTCO for Superior PPA in A7 Node by Split Power, hDR Cells, Optimized Pins and BEOL

Autores: Lin, Ji-Yung; Kukner, Halil; Yang, Sheng; Verschueren, Lien; Boemmels, Juergen; Dell'Atti, Francesco; Farokhnejad, Anita; Van de Put, Maarten; Zografos, Odysseas; Horiguchi, Naoto; Garcia Bardon, Marie; Hellings, Geert; Ryckaert, Julien
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.5281/ZENODO.18451341

Moore's Law meets High-NA EUV: Random via patterning for next-generation nodes

Autores: B. Chowrira, V. M. Blanco Carballo, M. Dusa, L. E. Tan, H. Vats, W. Gillijns, S. Decoster, A. Niroomand, V. D. Rutigliani, S. Halder, M. Sangghaleh, D. Tyagi, A. Kamali, M. Newman, M. Demand, Y. Wako, A. Negreira, R. Clark, K. Nafus, M. O'Toole, J. Hsia
Publicado en: Proc. SPIE 13424, Optical and EUV Nanolithography XXXVIII, Edición 1342412, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3050453

Dry etch challenges for patterning middle-of-line (MOL) dual damascene contact trench and via in monolithic CFET (complementary FET)

Autores: T. Sarkar, A. Vandooren, K. Stiers, C. Sheng, V. Vega Gonzalez, H. Jenkins, M. Demand, P. Wang, F. Lazzarino, S. Demuynck, N. Horiguchi, S. Biesemans
Publicado en: Proc. SPIE 13429, Advanced Etch Technology and Process Integration for Nanopatterning XIV, Edición 134290A, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3052052

Extending the Gate-All-Around (GAA) Era to the A10 Node: Outer Wall Forksheet Enabling Full Channel Strain and Superior Gate Control

Autores: Lynn Verschueren; Geert Eneman; Sheng Yang; Jürgen Bömmels; Philippe Matagne; Katty Beltrán Cahueñas, Arvind Sharma, Dawit Abdi, Hans Mertens, Gioele Mirabelli, Geert Hellings
Publicado en: 2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2025, ISSN 2158-9682
Editor: IEEE
DOI: 10.23919/VLSITECHNOLOGYANDCIR65189.2025.11075021

Stitching at high-NA EUV: a first experimental study

Autores: Vincent Wiaux, Natalia Davydova, Nick Pellens, Ataklti Weldeslassie, Jad Haddad, Tatiana Kovalevich, Vito Daniele Rutigliani, Marcus Newman, Mahtab Sangghaleh, Dhruv Tyagi, Airat Galiullin, Jeremy Chen, Adam Lyons, Frank Timmermans, Cyrus Tabery
Publicado en: Proc. SPIE 13686, International Conference on Extreme Ultraviolet Lithography 2025, Edición 1368606, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3073385

Via to line-end contact failures: the role of stochastics

Autores: Balakumar Baskaran, Dorin Cerbu, Matteo Beggiato, Victor Blanco, Gian Lorusso, Danilo De Simone, Michael E. Adel, Chris A. Mack
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134260N, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3050970

Stochastic-Aware Compact OPC Model Validation for Reducing Failure Probability

Autores: Renyang Meng, Xuelong Shi, Joost Bekaert, Werner Gillijns, Ryoung-han Kim
Publicado en: Proc. SPIE 13655, Photomask Japan 2025: XXXI Symposium on Photomask and Next-Generation Lithography Mask Technology, Edición 134280T, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3072074

Critical in-line OCD metrology for CFET manufacturing

Autores: Hyukyun Kwon, Joey Hung, Adam M. Urbanowicz, Ronen Urenski, Igor Turovets, Avron Ger, Szu-Wei Tseng, Mohamed Saib, Janusz Bogdanowicz, Stephanie Melhem, Daisy Zhou, Yong Kong Siew, Debashish Basu, Anne-Laure Charley, Jason Reifsnider, Naoto Horiguchi, Philippe Leray
Publicado en: Metrology, Inspection, and Process Control XXXIX, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051718

Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift

Autores: Tang, Tiffany; Guerrero, Alice; Cuypers, Dieter H.; Macours, Maarten; VAQUILAR, ALDRIN; Bex, Pieter; Kennes, Koen; Phommahaxay, Alain; Beyer, Gerald; Beyne, Eric
Publicado en: 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), 2025, ISSN 2377-5726
Editor: IEEE
DOI: 10.5281/ZENODO.18394580

Atomic Force Microscopy: From research lab to High-Volume Manufacturing

Autores: A. Moussa, A.-L. Charley, P. Leray
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134260X, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051414

First Systematic Characterization of Floating Body Effects in GAA Nanosheet 3D DRAM Access Transistors

Autores: Garbin, Daniele; Eneman, Geert; Ritzenthaler, Romain; Rassoul, Nouredine; Eyben, Pierre; Canga, Eren; Matsubayashi, Daisuke; Fantini, Andrea; O'Sullivan, Barry; Labbate, L.A.; Loyo Prado, Jana; Loo, Roger; Devulder, Wouter; Dupuy, Emmanuel; Peissker, Tobias; Pacco, Antoine; RAUT, HEMANT; Milenin, Alexey; Wouters, Lennaert; Vrancken, Evi; Beggiato, Matteo; Rosseel, Erik; Kar, Gouri Sankar; Belmonte, Attilio
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.5281/ZENODO.18449577

Fundamental Understanding of Exposure and Process Chemistry for Enhanced Lithography and Stability of Metal Oxide Resists

Autores: Dorney, Kevin M.; Pollentier, Ivan; Holzmeier, Fabian; Fallica, Roberto; Chen, Ying-Lin; Piatti, Lorenzo; Singh, Dhirendra; Galleni, Laura; Van Setten, Michiel J.; Suh, Hyo Seon; De Simone, Danilo; Pourtois, Geoffrey; Van der Heide, Paul; Petersen, John
Publicado en: Proc. SPIE 13428, Advances in Patterning Materials and Processes XLII, Edición 134281C, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051260

Impact of Mechanical Stress on IGZO TFTs: Enhancing PBTI Degradation

Autores: Vishwakarma, Kavita; Lee, Kookjin; Kruv, Anastasiia; Chasin, Adrian; van Setten, Michiel J.; Pashartis, Christopher; Orkut Okudur, Oguzhan; Gonzalez, Mario; Rassoul, Nouredine; Belmonte, Attilio; Kaczer, Ben
Publicado en: 2025 IEEE International Reliability Physics Symposium (IRPS), 2025, ISSN 1938-1891
Editor: IEEE
DOI: 10.48550/ARXIV.2506.15193

Junction-engineered Scaled High-performance GAA Nanosheet FETs with Ultra-low Temperature (< 350 °C) SiGe: B Source/Drain

Autores: R. Sarkar, D. Casey, A. Dutta, P. Eyben, A. Pondini, H. Mertens, T. Dursap, C. Porret, A. Veloso, J. Ganguly, R. Duflou, C. Cullen, P.A. Rathi, M-S. Kim, R. Khazaka, J. Mitard, L. P. B. Lima, S. Biesemans, N. Horiguchi
Publicado en: 2025 IEEE International Electron Devices Meeting (IEDM), 2026, ISSN 2156-017X
Editor: IEEE
DOI: 10.1109/IEDM50572.2025.11353791

Using Programmed defect vehicle to understand printability of defect/2D structures and characterize it through EUV process impact

Autores: Bojja Aditya Reddy, Balakumar Baskaran, Mohamed Saib, Joern-Holger Franke, Christophe Beral, Murat Pak, Sandip Halder, Mircea Dusa
Publicado en: Proc. SPIE 13426, Metrology, Inspection, and Process Control XXXIX, Edición 134261X, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3052510

Shifter Materials and Stack Explorations for $V_{t}$ Fine-Tunable Dual Dipole Multi-$V_{t}$ Gate Stacks Compatible with Low Thermal Budget CFET

Autores: Arimura, Hiroaki; Lukose, Leo; Ganguly, Jishnu; Franco, Jacopo; Mertens, Hans; Stiers, Jimmy; Lai, J. G.; Nalin Mehta, Ankit; Bejide, M.; Kim, Min-Soo; Horiguchi, Naoto
Publicado en: 2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2025, ISSN 2158-9682
Editor: IEEE
DOI: 10.5281/ZENODO.18448440

Resolution improvement and dose reduction in logic and memory applications from low NA to high NA

Autores: Shubhankar Das, Victor Blanco, Van Tuong Pham, Shruti Jambaldinni, Anuja De Silva, Joern-Holger Franke, Marcus Newman, Ali Haider, Matt Gallagher, Jeonghoon Lee, Kaushik Sah, Zhijin Chen, Bobo Cheng, Chenwei Gong, Vidya Ramanathan, Andrew Cross, Werner Gi
Publicado en: Proc. SPIE 13424, Optical and EUV Nanolithography XXXVIII, Edición 1342413, 2025, ISSN 1996-756X
Editor: SPIE
DOI: 10.1117/12.3051512

Peer reviewed articles (16)

Carrier Mapping in Sub‐2nm Node Nanosheet Transistors with Scanning Spreading Resistance Microscopy

Autores: Andrea Pondini, Pierre Eyben, Lennaert Wouters, Albert Minj, Thomas Hantschel, Philippe Matagne, Jérôme Mitard, Anne Verhulst
Publicado en: Small Methods, 2026, ISSN 1520-8559
Editor: Wiley
DOI: 10.1002/SMTD.202502279

2 μm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singulation

Autores: Lin, Ye; Bex, Pieter; Suhard, Samuel; Zhang, Boyao; Ulu Okudur, Fulya; Diaz De Zerio, Amaia; Reddy, Naveen K; Altamirano-Sanchez, Efrain; Li, Yanan; Jourdain, Anne; Beyer, Gerald; Beyne, Eric
Publicado en: 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), 2025, ISSN 2377-5726
Editor: IEEE
DOI: 10.5281/ZENODO.18403972

Low Temperature Site‐Specific Pulsed Laser Annealing of MoS ₂

Autores: Nazar Farid, Aashi Gupta, Pavlina Metaxa, A Arifutzzaman, Hariprasad Kuduvan, Rahil Haria, Michele Conroy, Ian Campbell, Ageeth A Bol, James Connolly, Jun Lin, Ian Povey, Ray Duffy, Gerard M O'Connor
Publicado en: Small, 2026, ISSN 1613-6810
Editor: Wiley
DOI: 10.1002/SMLL.202510617

Journal of Materials Science: Materials in Electronics

Autores: Dekkers, Hendrik; Dialameh, Masoud; Agati, Marta; van Setten, Michiel J.; Belmonte, Attilio
Publicado en: Journal of Materials Science: Materials in Electronics, 2025, ISSN 0957-4522
Editor: Springer Nature
DOI: 10.5281/ZENODO.18428147

Smart Diagnostics for 3D CFET: A Machine Learning Approach to Failure Analysis

Autores: Mitard, Jerome; Koçak, Hüsnü Murat; Chiarella, Thomas; Sheng, Cassie (Jiazhen); Demuyck, Steven; Horiguchi, Naoto
Publicado en: 2025 IEEE 37th International Conference on Microelectronic Test Structures (ICMTS), 2025, ISSN 2158-1029
Editor: IEEE
DOI: 10.5281/ZENODO.18405295

Dielectric Breakdown Analysis on Bottom and Top-Gated IGZO-TFT

Autores: Van Beek, Simon; Chasin, Adrian; Subhechha, Subhali; Dekkers, Hendrik; Rassoul, Nouredine; Wan, Yiqun; Tang, Hongwei; Bastos, Joao; Belmonte, Attilio; Kar, Gouri Sankar
Publicado en: 2025 IEEE International Reliability Physics Symposium (IRPS), 2025, ISSN 1938-1891
Editor: IEEE
DOI: 10.5281/ZENODO.18401224

Deposition of spinel IGZO thin films with increased indium contents on textured GZO templates

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