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Extreme Ultraviolet Scatterometry for Semiconductor Inspection and Nanoscale Metrology (EUVISION)

Objective

Modern nanolithography patterns have features well below 20 nm, yet wafer metrology still struggles to provide non-invasive, at-resolution measurements of critical dimensions, sidewall profiles, overlay and edge-placement errors across increasingly three-dimensional stacks. This proposal (EUVISION) tackles that gap with soft X-ray/extreme-ultraviolet (XUV) scatterometry driven by table-top high-harmonic generation (HHG). Short wavelengths provide the needed penetration and sensitivity; HHG delivers bright, broadband radiation and long coherence lengths for spectral and phase-sensitive metrology in a compact setup.

The objectives are: (1) develop higher-order XUV scatterometry beyond the 0th order to access spatially encoded information and enable true 3D profile reconstruction; (2) build and validate an inversion framework that combines rigorous electromagnetic modeling (RCWA) with optimization and physics-informed machine learning for robust parameter retrieval; (3) demonstrate process-compatible, at-resolution metrology on industry-relevant resist structures produced under controlled EUV exposure conditions; and (4) extend the method to atomically thin materials (graphene and transition-metal dichalcogenides), where single-defect perturbations can strongly degrade device performance, requiring metrology on few- to monolayer systems.

The approach integrates broadband HHG illumination, collection of multiple diffraction orders, and quantitative inversion against reference data (CD-SEM, AFM, TEM) to establish accuracy and repeatability. Sample integrity and practical tool integration are assessed throughout to ensure relevance for semiconductor manufacturing. EUVISION will deliver a validated route to fast, non-invasive, 3D wafer metrology at the device scale today, and a platform ready for future nodes that incorporate 2D materials.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Funding Scheme

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HORIZON-ERC-POC - HORIZON ERC Proof of Concept Grants

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) ERC-2026-POC

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Host institution

STICHTING NEDERLANDSE WETENSCHAPPELIJK ONDERZOEK INSTITUTEN
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 150 000,00
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data

Beneficiaries (1)