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Content archived on 2024-05-29

Scatterometry Overlay Control Technology in the integrated circuit industry for the 32nm technology node and beyond

Objective

The overlay control budget for the 32nm technology node will be approximately 10nm according to the ITRS. The overlay metrology budget is typically 1/10 of the overlay control budget resulting in overlay metrology performance requirements of 1nm. Theoretical considerations show that overlay technology based on scatterometry has inherent advantages, which will allow it to achieve this strict requirement and go beyond it.

We have demonstrated a breakthrough scatterometry overlay technology in preliminary proof-of-concept experiments. The results of these studies are promising, and at this early stage position scatterometry as one of the leading contenders for the overlay technology for the 32nm node and beyond. We propose to carry out a thorough and detailed research program with the goal of transforming the promising concept into a well-developed technology, which meets the most strict overlay control requirements of the future.

The anticipated outcome of the project is an optimal methodology for a scatterometry overlay tool design, target design and algorithms, which allow overlay control with a significantly improved Total Measurement Uncertainty (TMU) and reduced systematic bias with respect to device structures, on layers fabricated with the most advanced processes and materials.

We will achieve this through extensive research in target design including the design and fabrication of a dedicated reticle. Extensive measurements of selected targets will be carried out on both RandD and production wafers. The project will also involve a substantial amount of simulations of the lithography process and of the scatterometry signal.

The success of the project will be ensured through a very close collaboration of the leading overlay metrology company worldwide with leading European research institution and semiconductor manufacturer. This consortium will augment the European leadership in the microelectronics industry.

Fields of science (EuroSciVoc)

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Topic(s)

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Call for proposal

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Funding Scheme

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STREP - Specific Targeted Research Project

Coordinator

KLA-TENCOR CORPORATION (ISRAEL)
EU contribution
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Address
4 HATIKSHORET ST.
23100 MIGDAL HAEMEK
Israel

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (3)

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