High density integration by embedding chips for reduced size modules and electronic systems

Project Information

HERMES

Grant agreement ID: 224611

Project closed

Start date 1 May 2008

End date 29 February 2012

Funded under

• Specific Programme "Cooperation": Information and communication technologies

Total cost € 14 384 215,00

EU contribution € 8 349 999,00

Coordinated by

AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Austria