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Dry Develop Optical Lithography for ULSI

Objective

The work covered by the DRYDEL project aimed to develop a deep-UV sensitive photoresist and the associated processing, with the objective of extending the DESIRE (Diffusion-Enhanced Silylating Resist) process down to the 0.3 micron range. The DESIRE process is a single-layer resist system based on surface imaging resulting from selective silylation and anisotropic dry development.
The work covered by the dry develop optical lithography (DRYDEL) project aimed to develop a deep ultraviolet (UV) sensitive photoresist and the associated processing, with the objective of extending the diffusion enhanced silylating resist (DESIRE) process down to the 0.3 micron range. The DESIRE process is a single layer resist system based on surface imaging resulting from selective silylation and and anisotropic dry development. The work was distributed over 4 work packages. In the first, the resist materials were developed. Variations of the various components of the resist (photoactive compound, resin composition and solvents) have been investigated. This has led to an optimization of the i-line version of the resist (for exposure at 365 nm) and to the fabrication of first samples of the deep UV version (for exposure at 248 nm).
In the second work package resist processing, such as silylation, dry development and pattern transfer, has been studied. Besides an optimization of each processing step, some more fundamental studies were carried out on silylation kinetics and swelling behaviour. Several new pieces of equipment were evaluated for silylation and dry development (including magnetically enhanced reactors and electron cyclotron resonance (ECR). Using the optimized resist materials and processes, lithographic resolution down to 0.25 micron (lines/spaces) has been demonstrated with perfect line width control over highly reflective topography (on deep-UV stepper, lambda = 248 nm, numerical operture (NA) = 0.42). The process was demonstrated in the third work package. A final work package showed the feasibility of the DESIRE process for application in gallium arsenide processing. The lift off capabilities of the process were demonstrated by the fabrication of appropriate test circuits.

Coordinator

Interuniversitair Mikroelektronica Centrum
Address
Kapeldreef 75
3030 Heverlee
Belgium

Participants (6)

Commissariat à l'Energie Atomique (CEA)
France
Address
Centre D'études De Grenoble 17 Avenue Des Martyrs
38041 Grenoble
FARRAN TECHNOLOGY
Ireland
Address
Ballincollig
Cork
GEC Plessey Semiconductors plc
United Kingdom
Address
Caswell
NN12 8EQ Towcester
NEDERLANDSE PHILIPS BEDRIJVEN BV
Netherlands
Address
Prof. Holstlaan, 4
5656 AA Eindhoven
Siemens AG
Germany
Address
Balanstraße 73
81541 München
UCB ELECTRONICS SA
Belgium
Address
Avenue Louise, 326
1050 Bruxelles