The major objective of this project is the realization of the brand new Patent pending Embedded Micro Connector Injection Process (EMCI-Process) technology, developed by the company ITC INTERCIRCUIT, Munich, for the benefit of the printed circuit board manufacturing industry, with a special consideration of environmental and cost cutting factors. The EMCI-Process together with Printed Circuit Boards (PCBs), of 100 f-lm microvias, would be used to establish a robust and reliable fine-pitch technology in combination with a traditional PCB printed wire pattern process sequence. The EMCI boards would be developed so that they would then be compatible with fine pitch naked dice for flip-chip or wire bonding and would have an enhanced rout ability for dense area array packages (f-lBGAs -micro Ball Grid Arrays, CSPs -Chip Scale Packages), insuring compatibility with SMD technology The developed connecter pins (metal or eventually glass fiber) would meet the conditions of their use. Micro component inclusion in contact pins would be studied, together with injection methods for all pin types, into and under the surface of the PCB's, creating the possibility of a 3-D circuit board space. The developing of necessary machines and tools needed for the EMCI-process, the accelerator, the injector firing the pins into the board, considering aspects such as production testing, and reaching the aim of reducing the chemical use during the PCB production. The creation of suitable EMCI processed boards for use as core multi-layer boards for sequential build-up. Also during the R&D stages the creation of a new printed circuit layout design system by adapting established CAD systems, determining special EDA designs. Building a functional demonstrator to validate the research work. Meeting the requirements which facilitate the cooperation together and involvement with other SME's, and universities from different European countries, in pan European research activities...
Meccanismo di finanziamentoCOOPERATIVE -