Skip to main content
European Commission logo
italiano italiano
CORDIS - Risultati della ricerca dell’UE
CORDIS
CORDIS Web 30th anniversary CORDIS Web 30th anniversary
Contenuto archiviato il 2024-06-18

Thermoplastically deformable circuits for embedded randomly shaped electronics

Descrizione del progetto


Heterogeneous Integration and take-up of of Key Enabling Technologies for Components and Systems

The overall aim of the TERASEL project is the development, the industrial implementation and the application in a wide range of domains of large area, cost-effective, randomly shaped electronics and sensor circuit technologies. More specifically the TERASEL objectives are the following :
• To develop a basic technology platform for rigid large-area randomly shaped electronic circuits. Key common features of the technologies in this platform are :
1. Electronic circuit fabrication and component assembly on flat substrates, compatible with existing equipment.2. Application and embedding of the flat circuits in thermoplastically deformable polymers.3. Development of high pressure, low temperature thermoforming technologies to deform the polymer embedded flat circuit into its random final functional shape.
• To set up a complete multi-competence industrial production chain for such circuits. Indeed, the goal is to achieve mature, near-to-production industrial processes for manufacturing randomly shaped circuits.
• To apply the developed technologies in a number of functional demonstrators close to products: a TV set with ambient illumination, a free-form man-machine interface, an intelligent car interior component, a 2.5D lighting device, a household appliance.
This novel technology can be developed successfully only thanks to the synergy and intensive co-operation between partners of the 2 industry sectors involved in TERASEL: the electronics circuit fabrication and assembly industry on one hand, and the polymer processing industry on the other. 6 SME's and 5 large industrial partners are complemented with 4 research institutes, thus forming a well-balanced consortium, fully capable of achieving the ambitious TERASEL goals. The merging of polymer and electronics industry competences will lead to a whole new range of products for a wide range of application domains.

Campo scientifico

Programma(i)

Argomento(i)

Invito a presentare proposte

FP7-ICT-2013-10
Vedi altri progetti per questo bando

Meccanismo di finanziamento

CP - Collaborative project (generic)

Coordinatore

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Contributo UE
€ 717 438,00
Indirizzo
KAPELDREEF 75
3001 Leuven
Belgio

Mostra sulla mappa
Regione
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Tipo di attività
Research Organisations
Contatto amministrativo
Christine Van Houtven (Mrs.)
Collegamenti
Costo totale
Nessun dato

Partecipanti (15)

Condividi questa pagina

Scarica

Ultimo aggiornamento: 22 Aprile 2017

Il mio fascicolo

Permalink: https://cordis.europa.eu/project/id/611439/it

European Union, 2024