Skip to main content
European Commission logo
Deutsch Deutsch
CORDIS - Forschungsergebnisse der EU
CORDIS
CORDIS Web 30th anniversary CORDIS Web 30th anniversary
Inhalt archiviert am 2024-06-18

Excellence in Speed and Reliability for More Than Moore Technologies

Ziel

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe. eRamp will fully support these targets, in line with the KET-(Key Enabling Technologies) strategy, by strengthening Europe’s leadership in power semiconductors by addressing (a) methodology research and (b) product research. Clear focus is put on fast and reliable product behaviour by rapid learning in European pilot line environments. In addition, eRamp will enable the realization of innovative More-than-Moore devices by development of innovative process and manufacturing chains. Research will focus on enhanced, next generation, More-than-Moore semiconductor product ramp ups, dedicated to energy efficient power, MEMS and 3D based applications. Power technologies based on 300mm wafer diameter will be enforced by combining with advanced assembly technologies. Doing so, eRAMP will foster exploitation for the running projects EPT300 and EPPL.
eRamp aims to set an innovative step forward to strengthen Europe’s leading position in More-than-Moore semiconductor technologies and More-than-Moore manufacturing capabilities with an sharp application focus to energy efficient electronic solutions. Fast time-to-market and further improved reliability of More-than-Moore semiconductor products will significantly strengthen the strong position of European electronic industry.
The results of eRamp will directly strengthen the competitiveness of several production sites of More than Moore semiconductors in Europe. Novel assembly and packaging technologies will allow optimum use of such devices. Thus, it is one of the essential pillars for the bridge from research to large scale production

Wissenschaftliches Gebiet (EuroSciVoc)

CORDIS klassifiziert Projekte mit EuroSciVoc, einer mehrsprachigen Taxonomie der Wissenschaftsbereiche, durch einen halbautomatischen Prozess, der auf Verfahren der Verarbeitung natürlicher Sprache beruht.

Sie müssen sich anmelden oder registrieren, um diese Funktion zu nutzen

Programm/Programme

Thema/Themen

Aufforderung zur Vorschlagseinreichung

ENIAC-2013-2
Andere Projekte für diesen Aufruf anzeigen

Finanzierungsplan

JTI-CP-ENIAC - Joint Technology Initiatives - Collaborative Project (ENIAC)

Koordinator

INFINEON TECHNOLOGIES DRESDEN GMBH& CO KG
EU-Beitrag
€ 1 353 600,00
Adresse
KONIGSBRUCKER STRASSE 180
01099 Dresden
Deutschland

Auf der Karte ansehen
Region
Sachsen Dresden Dresden, Kreisfreie Stadt
Aktivitätstyp
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Gesamtkosten
Keine Daten

Beteiligte (25)

Diese Seite teilen

Herunterladen

Letzte Aktualisierung: 12 April 2016

Mein Booklet

Permalink: https://cordis.europa.eu/project/id/621270/de

European Union, 2025