European Commission logo
polski polski
CORDIS - Wyniki badań wspieranych przez UE
CORDIS
Zawartość zarchiwizowana w dniu 2024-06-18

Excellence in Speed and Reliability for More Than Moore Technologies

Cel

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe. eRamp will fully support these targets, in line with the KET-(Key Enabling Technologies) strategy, by strengthening Europe’s leadership in power semiconductors by addressing (a) methodology research and (b) product research. Clear focus is put on fast and reliable product behaviour by rapid learning in European pilot line environments. In addition, eRamp will enable the realization of innovative More-than-Moore devices by development of innovative process and manufacturing chains. Research will focus on enhanced, next generation, More-than-Moore semiconductor product ramp ups, dedicated to energy efficient power, MEMS and 3D based applications. Power technologies based on 300mm wafer diameter will be enforced by combining with advanced assembly technologies. Doing so, eRAMP will foster exploitation for the running projects EPT300 and EPPL.
eRamp aims to set an innovative step forward to strengthen Europe’s leading position in More-than-Moore semiconductor technologies and More-than-Moore manufacturing capabilities with an sharp application focus to energy efficient electronic solutions. Fast time-to-market and further improved reliability of More-than-Moore semiconductor products will significantly strengthen the strong position of European electronic industry.
The results of eRamp will directly strengthen the competitiveness of several production sites of More than Moore semiconductors in Europe. Novel assembly and packaging technologies will allow optimum use of such devices. Thus, it is one of the essential pillars for the bridge from research to large scale production

Dziedzina nauki

Program(-y)

Temat(-y)

Zaproszenie do składania wniosków

ENIAC-2013-2
Zobacz inne projekty w ramach tego zaproszenia

System finansowania

JTI-CP-ENIAC - Joint Technology Initiatives - Collaborative Project (ENIAC)

Koordynator

INFINEON TECHNOLOGIES DRESDEN GMBH& CO KG
Wkład UE
€ 1 353 600,00
Adres
KONIGSBRUCKER STRASSE 180
01099 Dresden
Niemcy

Zobacz na mapie
Region
Sachsen Dresden Dresden, Kreisfreie Stadt
Rodzaj działalności
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny
Linki
Koszt całkowity
Brak danych

Uczestnicy (25)

Udostępnij tę stronę

Pobierz

Ostatnia aktualizacja: 12 Kwietnia 2016

Moja broszura

Permalink: https://cordis.europa.eu/project/id/621270/pl

European Union, 2024