Integrated, Intelligent modular power electronic converter

Project Information

I2MPECT

Grant agreement ID: 636170

DOI 10.3030/636170

Project closed

EC signature date 22 April 2015

Start date 1 May 2015

End date 30 April 2018

Funded under

• SOCIETAL CHALLENGES - Smart, Green And Integrated Transport

Total cost € 7 180 892,51

EU contribution € 6 734 626,26

Coordinated by

SIEMENS AKTIENGESELLSCHAFT
Germany

Deliverables

Documents, reports (1)

Dissemination assessment and standardization benefit

Conference (paper and posters) , work shop , project presentation assessment. Evaluation of the benefits of research outputs and standardization helping to reduce certification cost.

Demonstrators, pilots, prototypes (1)

Power module prototype

Delivery of converter prototypes

Publications

Conference proceedings (7)

Discussion sur le suivi de l’état de santé des modules de puissance constitués de MOSFET en carbure de silicium

Author(s): Hologne , Malorie; Bevilacqua , Pascal; Barrière , Antoine; Allard , Bruno; Jay , Jacques; Clerc , Guy; Razik , Hubert
Published in: JCGE 2017 (Jeunes Chercheurs en Génie Électrique), Issue 1, 2017
Publisher: NAE

Weight and Efficiency Analysis of Switched Circuit Topologies for Modular Power Electronics in MEA

Author(s): C. Gammeter, F. Krismer, J. W. Kola
Published in: Proceedings IECON conference 2016, Issue 1, 2016, Page(s) 3640-3647
Publisher: IEEE

Experimental investigation of a confined flat two-phase thermosyphon for electronics cooling

Author(s): Marine Narcy, Stéphane Lips, Valérie Sartre
Published in: 9th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics, 2017, 2017
Publisher: NA

Définition d’un critère d’utilité appliqué aux diffuseurs thermiques diphasiques pour le refroidissement de composants électroniques

Author(s): Marine Narcy, Stéphane Lips, Valérie Sartre
Published in: Congrès de la Société Française de Thermique, 2017, Issue 2017, 2017
Publisher: Société Française de Thermique, 2017

An experimental approach to the health-monitoring of a silicon carbide MOSFET-based power module

Author(s): Malorie Hologne, Pascal Bevilacqua, Bruno Allard, Guy Clerc, Hervé Morel, Hubert Razik, Antoine Barrière, Vinaykumar Karode, Navien Devadass
Published in: Proc. of the IEEE International Electric Machines and Drives Conference, Issue 2017, 2017, ISBN 978-1-5090-4281-4
Publisher: IEEE

Parasitic Extraction Procedures for SiC Power Modules

Author(s): Ivana Kovacevic-Badstübner, Roger Stark, Mattia Guacci, Johann W. Kolar, Ulrike Grossner
Published in: Proceedings CIPS conference 2018 (Conference on Integrated Power Electronics Systems), 2018
Publisher: VDE

Poster and short presentation dialog session: I2MPECT: an ambitious EU-founded pro-ject for SiC module relia-bility analysis

Author(s): Bruno Allard, INSA-Lyon
Published in: Conference on Integrated Power Systems, CIPS 2016, Issue N/A, 2016, Page(s) N/A
Publisher: CIPS

Peer reviewed articles (4)

How to include frequency dependent complex permeability Into SPICE models to improve EMI filters design?

Author(s): Fabien Sixdenier, Ousseynou Yade, Christian Martin, Arnaud Bréard, Christian Vollaire
Published in: AIP Advances, Issue 8/5, 2018, Page(s) 056604, ISSN 2158-3226
Publisher: American Institute of Physics Inc.
DOI: 10.1063/1.5004630

Real-time Measurement of Temperature Sensitive Electrical Parameters in SiC Power MOSFETs

Author(s): Griffo, A.; Wang, J.; Colombage, K.; Kamel, T.
Published in: IEEE Transactions on Industrial Electronics, Issue 2, 2018, Page(s) 2663 - 2671, ISSN 0278-0046
Publisher: Institute of Electrical and Electronics Engineers

Experimental investigation of a confined flat two-phase thermosyphon for electronics cooling

Author(s): Marine Narcy, Stéphane Lips, Valérie Sartre
Published in: Experimental Thermal and Fluid Science, Issue Vol. 96, 2018, Page(s) 516-529, ISSN 0894-1777
Publisher: Elsevier BV

Analysis and Design of a 1200 V All-SiC Planar Interconnection Power Module for Next Generation More Electrical Aircraft Power Electronic Building Blocks

Author(s): Mattia Guacci
Published in: CPSS Transactions on Power Electronics and Applications, Issue 2/4, 2017, Page(s) 320-330, ISSN 2475-742X
Publisher: China Power Supply Society
DOI: 10.24295/CPSSTPEA.2017.00029

Other (4)

Powering the future of aviation

Author(s): Karl Weidner, Oliver Raab
Published in: EU-Research Journal, Issue Winter 2016, Page(s) 46-47
Publisher: EU Research

Layout Modelling of Inverter for EMC Analysis

Author(s): Ousseynou Yade, Christian Martin, Christian Vollaire, Arnaud Bréard, Marwan Ali, Régis Meuret, Hervé Morel
Published in: More Electrical Aircraft (MEA), Issue NA, 2017
Publisher: Authors

Modèle thermique réduit appliqué à une carte électronique de puissance

Author(s): Hazem Ben Aissia, Jacques Jay, Ronnie Knikker, Shihe Xin
Published in: 2017
Publisher: SFT (Société Française de thermique)

Press release Dynex

Author(s): Bob Lockwood, Steve Jones
Published in: 2015
Publisher: Dynex

Intellectual Property Rights

Patent (1)

Dispositif de diffusion thermique

Application/Publication number: FR 1750129
Date: 2017-02-24
Applicant(s): INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYON