Integrated, Intelligent modular power electronic converter

Informazioni relative al progetto

I2MPECT

ID dell’accordo di sovvenzione: 636170

DOI 10.3030/636170

Progetto chiuso

Data della firma CE 22 Aprile 2015

Data di avvio 1 Maggio 2015

Data di completamento 30 Aprile 2018

Finanziato da

• SOCIETAL CHALLENGES - Smart, Green And Integrated Transport

Costo totale € 7 180 892,51

Contributo UE € 6 734 626,26

Coordinato da

SIEMENS AKTIENGESELLSCHAFT
Germany

Risultati finali

Documents, reports (1)

Dissemination assessment and standardization benefit

Conference (paper and posters) , work shop , project presentation assessment. Evaluation of the benefits of research outputs and standardization helping to reduce certification cost.

Demonstrators, pilots, prototypes (1)

Power module prototype

Delivery of converter prototypes

Pubblicazioni

Conference proceedings (7)

Discussion sur le suivi de l’état de santé des modules de puissance constitués de MOSFET en carbure de silicium

Autori: Hologne , Malorie; Bevilacqua , Pascal; Barrière , Antoine; Allard , Bruno; Jay , Jacques; Clerc , Guy; Razik , Hubert
Pubblicato in: JCGE 2017 (Jeunes Chercheurs en Génie Électrique), Numero 1, 2017
Editore: NAE

Weight and Efficiency Analysis of Switched Circuit Topologies for Modular Power Electronics in MEA

Autori: C. Gammeter, F. Krismer, J. W. Kola
Pubblicato in: Proceedings IECON conference 2016, Numero 1, 2016, Pagina/e 3640-3647
Editore: IEEE

Experimental investigation of a confined flat two-phase thermosyphon for electronics cooling

Autori: Marine Narcy, Stéphane Lips, Valérie Sartre
Pubblicato in: 9th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics, 2017, 2017
Editore: NA

Définition d’un critère d’utilité appliqué aux diffuseurs thermiques diphasiques pour le refroidissement de composants électroniques

Autori: Marine Narcy, Stéphane Lips, Valérie Sartre
Pubblicato in: Congrès de la Société Française de Thermique, 2017, Numero 2017, 2017
Editore: Société Française de Thermique, 2017

An experimental approach to the health-monitoring of a silicon carbide MOSFET-based power module

Autori: Malorie Hologne, Pascal Bevilacqua, Bruno Allard, Guy Clerc, Hervé Morel, Hubert Razik, Antoine Barrière, Vinaykumar Karode, Navien Devadass
Pubblicato in: Proc. of the IEEE International Electric Machines and Drives Conference, Numero 2017, 2017, ISBN 978-1-5090-4281-4
Editore: IEEE

Parasitic Extraction Procedures for SiC Power Modules

Autori: Ivana Kovacevic-Badstübner, Roger Stark, Mattia Guacci, Johann W. Kolar, Ulrike Grossner
Pubblicato in: Proceedings CIPS conference 2018 (Conference on Integrated Power Electronics Systems), 2018
Editore: VDE

Poster and short presentation dialog session: I2MPECT: an ambitious EU-founded pro-ject for SiC module relia-bility analysis

Autori: Bruno Allard, INSA-Lyon
Pubblicato in: Conference on Integrated Power Systems, CIPS 2016, Numero N/A, 2016, Pagina/e N/A
Editore: CIPS

Peer reviewed articles (4)

How to include frequency dependent complex permeability Into SPICE models to improve EMI filters design?

Autori: Fabien Sixdenier, Ousseynou Yade, Christian Martin, Arnaud Bréard, Christian Vollaire
Pubblicato in: AIP Advances, Numero 8/5, 2018, Pagina/e 056604, ISSN 2158-3226
Editore: American Institute of Physics Inc.
DOI: 10.1063/1.5004630

Real-time Measurement of Temperature Sensitive Electrical Parameters in SiC Power MOSFETs

Autori: Griffo, A.; Wang, J.; Colombage, K.; Kamel, T.
Pubblicato in: IEEE Transactions on Industrial Electronics, Numero 2, 2018, Pagina/e 2663 - 2671, ISSN 0278-0046
Editore: Institute of Electrical and Electronics Engineers

Experimental investigation of a confined flat two-phase thermosyphon for electronics cooling

Autori: Marine Narcy, Stéphane Lips, Valérie Sartre
Pubblicato in: Experimental Thermal and Fluid Science, Numero Vol. 96, 2018, Pagina/e 516-529, ISSN 0894-1777
Editore: Elsevier BV

Analysis and Design of a 1200 V All-SiC Planar Interconnection Power Module for Next Generation More Electrical Aircraft Power Electronic Building Blocks

Autori: Mattia Guacci
Pubblicato in: CPSS Transactions on Power Electronics and Applications, Numero 2/4, 2017, Pagina/e 320-330, ISSN 2475-742X
Editore: China Power Supply Society
DOI: 10.24295/CPSSTPEA.2017.00029

Other (4)

Powering the future of aviation

Autori: Karl Weidner, Oliver Raab
Pubblicato in: EU-Research Journal, Numero Winter 2016, Pagina/e 46-47
Editore: EU Research

Layout Modelling of Inverter for EMC Analysis

Autori: Ousseynou Yade, Christian Martin, Christian Vollaire, Arnaud Bréard, Marwan Ali, Régis Meuret, Hervé Morel
Pubblicato in: More Electrical Aircraft (MEA), Numero NA, 2017
Editore: Authors

Modèle thermique réduit appliqué à une carte électronique de puissance

Autori: Hazem Ben Aissia, Jacques Jay, Ronnie Knikker, Shihe Xin
Pubblicato in: 2017
Editore: SFT (Société Française de thermique)

Press release Dynex

Autori: Bob Lockwood, Steve Jones
Pubblicato in: 2015
Editore: Dynex

Diritti di proprietà intellettuale

Patent (1)

Dispositif de diffusion thermique

Numero candidatura/pubblicazione: FR 1750129
Data: 2017-02-24
Candidato/i: INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYON