Objective
Smart systems technologies are evolving towards ever increasing functionality and miniaturisation through the heterogeneous integration of separate components. The ideal integration requires precision placement of multiple types of devices on a substrate to allow their inter-connection. We propose to solve this integration challenge through an exciting new technique called micro-Transfer-Printing (TP) where the essential materials or devices, with thicknesses of a few microns, are separated from their native substrates and are transferred in parallel to the new platform according to the desired positioning while achieving micron-scale placement accuracy. Sequential application of the process enables different components of different functionality to be manipulated in a highly flexible and programmable way making best use of the materials. The TOP HIT project will aggressively develop and validate the TP technology by integrating electronics and photonics components for the magnetic and communication industries. These serve as examples for the broad capability of the technology which is compatible with low-cost manufacturing.
We will develop ‘On Head Microelectronics’ for data storage smart systems through the embedded integration of custom electronic circuits directly into the magnetic read-head. We will demonstrate TP as a scalable method for the integration of compound semiconductor based elements (lasers, detectors) with silicon photonics platforms demonstrating both a compact receiver circuit and a transceiver.
The partners in the TOP HIT consortium include international companies with extensive manufacturing capabilities, an SME, and two research institutes. The output of this project will help establish TP as a mainstream technology for heterogeneous integration, enabling manufacturing to be carried out in Europe through sales of equipment and through foundry services.
New more efficient smart products will emerge from the research carried out here.
Fields of science
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural sciencesphysical scienceselectromagnetism and electronicsmicroelectronics
- natural scienceschemical sciencesinorganic chemistrymetalloids
- natural sciencesphysical sciencesopticslaser physics
Programme(s)
- H2020-EU.2.1.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT) Main Programme
- H2020-EU.2.1.1.1. - A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems
Funding Scheme
RIA - Research and Innovation actionCoordinator
T12 YN60 Cork
Ireland
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Participants (6)
2 Dublin
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BT48 0BF Londonderry
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3001 Heverlee
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9052 Gent
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
99097 Erfurt
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IP5 3RE Ipswich, Suffolk
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.