Publications
Author(s):
B. Kazemi Esfeh, V. Kilchytska, B. Parvais, N. Planes, M. Haond, D. Flandre, J.-P. Raskin
Published in:
2017 47th European Solid-State Device Research Conference (ESSDERC), 2017, Page(s) 148-151, ISBN 978-1-5090-5978-2
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2017.8066613
Author(s):
V. Kilchytska, B. Kazemi Esfeh, C. Gimeno, B. Parvais, N. Planes, M. Haond, J.-P. Raskin, D. Flandre
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 128-131, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962581
Author(s):
B. Kazemi Esfeh, V. Kilchytska, B. Parvais, N. Planes, M. Haond, D. Flandre, J.-P. Raskin
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 228-230, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962569
Author(s):
A. Idrissi-El Oudrhiri, S. Martinie, J-C. Barbe, O. Rozeau, C. Le Royer, M-A. Jaud, J. Lacord, N. Bernier, L. Grenouillet, P. Rivallin, J. Pelloux-Prayer, M. Casse, M. Mouis
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 206-209, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292295
Author(s):
Yoann Blancquaert, Nivea Figueiro, Thibault Labbaye, Francisco Sanchez, Stephane Heraud, Roy Koret, Matthew Sendelbach, Ralf Michel, Shay Wolfling, Stephane Rey, Laurent Pain
Published in:
Metrology, Inspection, and Process Control for Microlithography XXXI, 2017, Page(s) 101451F
Publisher:
SPIE
DOI:
10.1117/12.2261389
Author(s):
A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, C. Plantier, N. Rambal, J.-P. Pedini, S. Kerdiles, P. Besson, J.-M. Hartmann, D. Marseilhan, B. Mathieu, R. Berthelon, M. Casse, F. Andrieu, D. Rouchon, O. Weber, F. Boeuf, M. Haond, A. Claverie, M. Vinet
Published in:
2016 IEEE Symposium on VLSI Technology, 2016, Page(s) 1-2, ISBN 978-1-5090-0638-0
Publisher:
IEEE
DOI:
10.1109/VLSIT.2016.7573406
Author(s):
David Cooper, Nicolas Bernier, Jean-Luc Rouviere
Published in:
2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), 2015, Page(s) 777-780, ISBN 978-1-4673-8156-7
Publisher:
IEEE
DOI:
10.1109/NANO.2015.7388725
Author(s):
S. Barraud, V. Lapras, M.P. Samson, L. Gaben, L. Grenouillet, V. Maffini-Alvaro, Y. Morand, J. Daranlot, N. Rambal, B. Previtalli, S. Reboh, C. Tabone, R. Coquand, E. Augendre, O. Rozeau, J. M. Hartmann, C. Vizioz, C. Arvet, P. Pimenta-Barros, N. Posseme, V. Loup, C. Comboroure, C. Euvrard, V. Balan, I. Tinti, G. Audoit, N. Bernier, D. Cooper, Z. Saghi, F. Allain, A. Toffoli, O. Faynot, M. Vinet
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 17.6.1-17.6.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838441
Author(s):
R. Berthelon, F. Andrieu, P. Perreau, E. Baylac, A. Pofelski, E. Josse, D. Dutartre, A. Claverie, M. Haond
Published in:
2016 46th European Solid-State Device Research Conference (ESSDERC), 2016, Page(s) 127-130, ISBN 978-1-5090-2969-3
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2016.7599604
Author(s):
R. Berthelon, F. Andrieu, E. Josse, R. Bingert, O. Weber, E. Serret, A. Aurand, S. Delmedico, V. Farys, C. Bernicot, E. Bechet, E. Bernard, T. Poiroux, D. Rideau, P. Scheer, E. Baylac, P. Perreau, M.A. Jaud, J. Lacord, E. Petitprez, A. Pofelski, S. Ortolland, P. Sardin, D. Dutartre, A. Claverie, M. Vinet, J.C. Marin, M. Haond
Published in:
2016 IEEE Symposium on VLSI Technology, 2016, Page(s) 1-2, ISBN 978-1-5090-0638-0
Publisher:
IEEE
DOI:
10.1109/VLSIT.2016.7573425
Author(s):
R. Berthelon, F. Andrieu, P. Perreau, D. Cooper, F. Roze, O. Gourhant, P. Rivallin, N. Bernier, A. Cros, C. Ndiaye, E. Baylac, E. Souchier, D. Dutartre, A. Claverie, O. Weber, E. Josse, M. Vinet, M. Haond
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 17.7.1-17.7.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838442
Author(s):
R. Berthelon, F. Andrieu, S. Ortolland, R. Nicolas, T. Poiroux, E. Baylac, D. Dutartre, E. Josse, A. Claverie, M. Haond
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 88-91, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440059
Author(s):
R. Berthelon, F. Andrieu, B. Mathieu, D. Dutartre, C. Le Royer, M. Vinet, A. Claverie
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 91-94, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962609
Author(s):
R. Berthelon, F. Andneu, F. Triozon, M. Casse, L. Bourdet, G. Ghibaudo, D. Rideau, Y. M. Niquet, S. Barraud, P. Nguyen, C. Le Royer, J. Lacord, C. Tabone, O. Rozeau, D. Dutartre, A. Claverie, E. Josse, F. Arnaud, M. Vinet
Published in:
2017 Symposium on VLSI Technology, 2017, Page(s) T224-T225, ISBN 978-4-86348-605-8
Publisher:
IEEE
DOI:
10.23919/VLSIT.2017.7998180
Author(s):
M. Karner, Z. Stanojevic, O. Baumgartner, HW. Karner, C. Kernstock, H. Demel, F. Mitterbauer
Published in:
2016 IEEE Silicon Nanoelectronics Workshop (SNW), 2016, Page(s) 208-209, ISBN 978-1-5090-0726-4
Publisher:
IEEE
DOI:
10.1109/SNW.2016.7578054
Author(s):
Z. Stanojevic, M. Karner, O. Baumgartner, H. W. Karner, C. Kernstock, H. Demel, F. Mitterbauer
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 65-67, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605149
Author(s):
M. Karner, O. Baumgartner, Z. Stanojevic, F. Schanovsky, G. Strof, C. Kernstock, H. W. Karner, G. Rzepa, T. Grasset
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 30.7.1-30.7.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838516
Author(s):
Z. Stanojevic, O. Baumgartner, M. Karner, C. Kernstock, H. W. Karner, H. Demel, G. Strof, F. Mitterbauer
Published in:
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2017, Page(s) 245-248, ISBN 978-4-86348-610-2
Publisher:
IEEE
DOI:
10.23919/SISPAD.2017.8085310
Author(s):
HW. Karner, C. Kernstock, Z. Stanojevic, O. Baumgartner, F. Schanovsky, M. Karner, D. Helms, R. Eilers, M. Metzdorf
Published in:
2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2017, Page(s) 1-2, ISBN 978-1-5090-5805-1
Publisher:
IEEE
DOI:
10.1109/VLSI-TSA.2017.7942453
Author(s):
R. Carter, J. Mazurier, L. Pirro, J-U. Sachse, P. Baars, J. Faul, C. Grass, G. Grasshoff, P. Javorka, T. Kammler, A. Preusse, S. Nielsen, T. Heller, J. Schmidt, H. Niebojewski, P-Y. Chou, E. Smith, E. Erben, C. Metze, C. Bao, Y. Andee, I. Aydin, S. Morvan, J. Bernard, E. Bourjot, T. Feudel, D. Harame, R. Nelluri, H.-J. Thees, L. M-Meskamp, J. Kluth, R. Mulfinger, M. Rashed, R. Taylor, C. Weintraub
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 2.2.1-2.2.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838029
Author(s):
Licinius Benea, Maryline Bawedin, Cecile Delacour, Sorin Cristoloveanu, Irina Ionica
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 19-22, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962590
Author(s):
F. Cacho, A. Cros, X. Federspiel, V. Huard, C. Roma
Published in:
2016 IEEE International Reliability Physics Symposium (IRPS), 2016, Page(s) 7C-1-1-7C-1-6, ISBN 978-1-4673-9137-5
Publisher:
IEEE
DOI:
10.1109/IRPS.2016.7574581
Author(s):
A. Bonnevialle, S. Reboh, C. Le Royer, Y. Morand, J.-M. Hartmann, D. Rouchon, J.-M. Pedini, C. Tabone, N. Rambal, A. Payet, C. Plantier, F. Boeuf, M. Haond, A. Claverie, M. Vinet
Published in:
2016
Publisher:
E-MRS 2016 (European Material Research Society)
Author(s):
A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, J.-M. Pédini, A. Roule, D. Marseilhan, P. Besson, D. Rouchon, N. Bernier, C. Tabone, C. Plantier, M. Vinet,
Published in:
2015
Publisher:
2015 International Conference on Solid State Devices and Materials (SSDM)
Author(s):
L. Gaben, S. Barraud, P. Pimenta-Barros, Y. Morand, J. Pradelles, M.-P. Samson, B. Previtali, P. Besson, F. Allain, S. Monfray, F. Boeuf, T. Skotnicki, F. Balestra3 and M. Vine
Published in:
2015
Publisher:
2015 International Conference on Solid State Devices and Materials (SSDM)
Author(s):
A DURAND, M KAUFLING, D LE-CUNFF, D ROUCHON, P GERGAUD
Published in:
2016
Publisher:
XTOP 2016 - 13th Biennial Conference on High-Resolution X-Ray Diffraction and Imaging
Author(s):
F. Andrieu, R. Berthelon, R. Boumchedda, G. Tricaud, L. Brunet, P. Batude, B. Mathieu, E. Avelar, A. Ayres de Sousa, G. Cibrario, O. Rozeau, J. Lacord, O. Billoint, C. Fenouillet-Béranger, S. Guissi, D. Fried, P. Morin, J.P. Noel, B. Giraud, S. Thuries, F. Arnaud, M. Vinet
Published in:
2017
Publisher:
Electron Devices Meeting (IEDM), 2017 IEEE International
Author(s):
W. Schwarzenbach, F. Allibert, C. Figuet, C. Girard and C. Maleville
Published in:
2016
Publisher:
ETCMOS Conference, 2016 (Emerging Technologies Communications Microsystems Optoelectronics)
Author(s):
B.-Y. Nguyen, M.Sadaka, G.Gaudin, W. Schwarzenbach, K.Boudelle,C.Figuet and C.Maleville
Published in:
2016
Publisher:
CS ManTech Conference, 2016 (Compound Semiconductor Manufacturing Technology)
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu and C. Mazure
Published in:
2015
Publisher:
VLSI-TSA Conference 2015 - International Symposium on VL Technology, Systems and Applications
Author(s):
Nguyen, S. Barraud, L. Hutin, C. Tabone, F. Glowacki, J.-M. Hartmann, M.-P. Samson†, L. Ecarnot, B.-Y. Nguyen¤, C. Maleville, C. Mazuré, O. Faynot, M. Vinet
Published in:
2015
Publisher:
IWNA Conference 2015
Author(s):
J. Widieza, F. Mazena, J-M. Hartmanna, Y. Bogumilowicza, E. Augendrea, C. Veytizoub, S. Solliera, M. Martinc, M-C. Rourea, V. Loupa, C. Euvrada, A. Seignarda, T. Baronc, R. Ciproc, F. Bassanic, A-M. Papona, C. Guedja, I. Huyetb, M. Rivoirea, P. Bessona, C. Figuetb, W. Schwarzenbachb, D. Delpratb and T. Signamarcheixa
Published in:
2015
Publisher:
ECS Chicago 2015 (Electrochemical Society Chicago Meeting)
Author(s):
J. Kunkel
Published in:
2015
Publisher:
SOITEC
Author(s):
C.Maleville
Published in:
2016
Publisher:
The annual SOI Silicon Valle
Author(s):
C.Maleville
Published in:
2017
Publisher:
FD-SOI ForumShanghai 2017, FD-SOI Design Tutorial, SOI Workshop & Tutorial
Author(s):
N. Kernevez
Published in:
2015
Publisher:
Semicon Europa
Author(s):
T. Piliszczuk
Published in:
2015
Publisher:
Semicon Europa
Author(s):
C. Landesberger et al.
Published in:
2018
Publisher:
12th Smart Systems Integration Conference, 2018
Author(s):
T. Lim et al.
Published in:
2017
Publisher:
Proc. of 2017 Asia Pacific Microwave Conference (APMC)
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu, C. Mazure
Published in:
2015 International Symposium on VLSI Technology, Systems and Applications, 2015, Page(s) 1-2, ISBN 978-1-4799-7375-0
Publisher:
IEEE
DOI:
10.1109/VLSI-TSA.2015.7117577
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu
Published in:
2015 IEEE International Reliability Physics Symposium, 2015, Page(s) 2F.1.1-2F.1.5, ISBN 978-1-4673-7362-3
Publisher:
IEEE
DOI:
10.1109/IRPS.2015.7112691
Author(s):
W. Schwarzenbach, C. Malaquin, F. Allibert, G. Besnard, B.-Y. Nguyen
Published in:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015, Page(s) 1-3, ISBN 978-1-5090-0259-7
Publisher:
IEEE
DOI:
10.1109/S3S.2015.7333496
Author(s):
A. S. N. Pereira, G. de Streel, N. Planes, M. Haond, R. Giacomini, D. Flandre, V. Kilchytska
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 116-119, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440066
Author(s):
V. Velayudhan, J. Martin-Martinez, M. Porti, C. Couso, R. Rodriguez, M. Nafria, X. Aymerich, C. Marquez, F. Gamiz
Published in:
2015 45th European Solid State Device Research Conference (ESSDERC), 2015, Page(s) 230-233, ISBN 978-1-4673-7135-3
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2015.7324756
Author(s):
Carlos Marquez, Noel Rodriguez, Francisco Gamiz, Akiko Ohata
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 40-43, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440047
Author(s):
C. Medina-Bailon, C. Sampedro, F. Gamiz, A. Godoy, L. Donetti
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 214-217, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292297
Author(s):
Luca Donetti, Carlos Sampedro, Francisco Gamiz, Andres Godoy, Francisco J. Garcia-Ruiz, Ewan Towiez, Vihar P. Georgiev, Salvatore Maria Amoroso, Craig Riddet, Asen Asenov
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 353-356, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292332
Author(s):
C. Medina-Bailon, C. Sampedro, F. Gamiz, A. Godoy, L. Donetti
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 100-103, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440062
Author(s):
Z. Stanojevic, O. Baumgartner, F. Mitterbauer, H. Demel, C. Kernstock, M. Karner, V. Eyert, A. France-Lanord, P. Saxe, C. Freeman, E. Wimmer
Published in:
2015 IEEE International Electron Devices Meeting (IEDM), 2015, Page(s) 5.1.1-5.1.4, ISBN 978-1-4673-9894-7
Publisher:
IEEE
DOI:
10.1109/IEDM.2015.7409631
Author(s):
D. Benoit, J. Mazurier, B. Varadarajan, S. Chhun, S. Lagrasta, C. Gaumer, D. Galpin, C. Fenouillet-Beranger, D. Vo-Thanh, D. Barge, R. Duru, R. Beneyton, B. Gong, N. Sun, N. Chauvet, P. Ruault, D. Winandy, B. van Schravendijk, P. Meijer, O. Hinsinger
Published in:
2015 IEEE International Electron Devices Meeting (IEDM), 2015, Page(s) 8.6.1-8.6.4, ISBN 978-1-4673-9894-7
Publisher:
IEEE
DOI:
10.1109/IEDM.2015.7409656
Author(s):
C.Maleville
Published in:
2017
Publisher:
Annual SOI Silicon Valley Symposium
Author(s):
P.Gupta
Published in:
2016
Publisher:
IRPS Conference
Author(s):
Christophe Maleville
Published in:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015, Page(s) 1-5, ISBN 978-1-5090-0259-7
Publisher:
IEEE
DOI:
10.1109/S3S.2015.7333494
Author(s):
V. Joshi, H. Ramamurthy, S. Balasubramanian, S. Seo, H. Yoon, X. Zou, N. Chan, J. Yun, T. Klick, E. Smith, J. Schmid, R. vanBentum, J. Faul, C. Weintraub
Published in:
2017 Symposium on VLSI Technology, 2017, Page(s) T222-T223, ISBN 978-4-86348-605-8
Publisher:
IEEE
DOI:
10.23919/VLSIT.2017.7998179
Author(s):
P.Flatresse
Published in:
2017
Publisher:
IPSOC
Author(s):
C.Mazure
Published in:
2017
Publisher:
Minalogic
Author(s):
N.Daval
Published in:
2017
Publisher:
Semicon Europea
Author(s):
Fred Buchali, Laurent Schmalen, Qian Hu, Di Che
Published in:
2015 European Conference on Optical Communication (ECOC), 2015, Page(s) 1-3, ISBN 978-8-4608-1741-3
Publisher:
IEEE
DOI:
10.1109/ECOC.2015.7341622
Author(s):
F.Buchali
Published in:
2016
Publisher:
Pro OFC
Author(s):
Dajana Danilovic, Vladimir Milovanovic, Andreia Cathelin, Andrei Vladimirescu, Borivoje Nikolic
Published in:
2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2016, Page(s) 87-90, ISBN 978-1-4673-8651-7
Publisher:
IEEE
DOI:
10.1109/RFIC.2016.7508257
Author(s):
Ilias Sourikopoulos, Antoine Frappe, Andreia Cathelin, Laurent Clavier, Andreas Kaiser
Published in:
ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 2016, Page(s) 145-148, ISBN 978-1-5090-2972-3
Publisher:
IEEE
DOI:
10.1109/ESSCIRC.2016.7598263
Author(s):
Abhirup Lahiri, Nitin Gupta
Published in:
ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 2016, Page(s) 339-342, ISBN 978-1-5090-2972-3
Publisher:
IEEE
DOI:
10.1109/ESSCIRC.2016.7598311
Author(s):
Reda Kasri, Eric Klumperink, Philippe Cathelin, Eric Toumier, Bram Nauta
Published in:
2017 IEEE Custom Integrated Circuits Conference (CICC), 2017, Page(s) 1-4, ISBN 978-1-5090-5191-5
Publisher:
IEEE
DOI:
10.1109/CICC.2017.7993644
Author(s):
Andreia Cathelin
Published in:
2017 IEEE Custom Integrated Circuits Conference (CICC), 2017, Page(s) 1-53, ISBN 978-1-5090-5191-5
Publisher:
IEEE
DOI:
10.1109/CICC.2017.7993721
Author(s):
Mirjana Videnovic-Misic
Published in:
2017
Publisher:
IEEE
Author(s):
N. Ben Salem, R.K. Gupta
Published in:
2017
Publisher:
MUGM 2017 (MunEDA Users Group Meeting)
Author(s):
K. Kühnel, S. Riedel, W. Weinreich, X. Thrun, M. Czernohorsky, B. Pätzold, M. Rudolph
Published in:
2016
Publisher:
16th International Conference on Atomic Layer Deposition
Author(s):
W. Lerch, N. Sacher, W. Kegel, J. Niess, M. Czernohorsky
Published in:
2016
Publisher:
19th Workshop on Dielectrics in Microelectronic (WoDiM)
Author(s):
L. Gerlich, M. Wislicenus, B. Uhlig, S. Riedel, R. Liske
Published in:
2016
Publisher:
Proc. Of Functional Integrated nanoSystems (nanoFIS 2016)
Author(s):
M. Wislicenus, T. Martin, L. Gerlich, B. Uhlig
Published in:
2016
Publisher:
Proc. Of Area Selective Deposition Workshop (ASD 2016)
Author(s):
A.S.N. Pereira, G. de Streel, N. Planes, M. Haond, R. Giacomini, D. Flandre, V. Kilchytska
Published in:
Solid-State Electronics, Issue 128, 2017, Page(s) 67-71, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2016.10.017
Author(s):
M. Czernohorsky, K. Seidel, K. Kühnel, J. Niess, N. Sacher, W. Kegel, W. Lerch
Published in:
Microelectronic Engineering, Issue 178, 2017, Page(s) 262-265, ISSN 0167-9317
Publisher:
Elsevier BV
DOI:
10.1016/j.mee.2017.05.041
Author(s):
Aurèle Durand, Melissa Kaufling, Delphine Le-Cunff, Denis Rouchon, Patrice Gergaud
Published in:
Materials Science in Semiconductor Processing, Issue 70, 2017, Page(s) 99-104, ISSN 1369-8001
Publisher:
Pergamon Press
DOI:
10.1016/j.mssp.2016.12.003
Author(s):
L. Fauquier, B. Pelissier, D. Jalabert, F. Pierre, J.M. Hartmann, F. Rozé, D. Doloy, D. Le Cunff, C. Beitia, T. Baron
Published in:
Materials Science in Semiconductor Processing, Issue 70, 2017, Page(s) 105-110, ISSN 1369-8001
Publisher:
Pergamon Press
DOI:
10.1016/j.mssp.2016.10.028
Author(s):
David Cooper, Thibaud Denneulin, Nicolas Bernier, Armand Béché, Jean-Luc Rouvière
Published in:
Micron, Issue 80, 2016, Page(s) 145-165, ISSN 0968-4328
Publisher:
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Nano Letters, Issue 15/8, 2015, Page(s) 5289-5294, ISSN 1530-6984
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American Chemical Society
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Applied Physics Letters, Issue 105/19, 2014, Page(s) 191906, ISSN 0003-6951
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Solid-State Electronics, Issue 128, 2017, Page(s) 72-79, ISSN 0038-1101
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IEEE Transactions on Electron Devices, Issue 64/12, 2017, Page(s) 5093-5098, ISSN 0018-9383
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IEEE Journal of Solid-State Circuits, Issue 52/4, 2017, Page(s) 1163-1177, ISSN 0018-9200
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IEEE Solid-State Circuits Magazine, Issue 9/4, 2017, Page(s) 18-26, ISSN 1943-0582
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IEEE Transactions on Electron Devices, Issue 64/5, 2017, Page(s) 2080-2085, ISSN 0018-9383
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