CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Publications
Author(s):
B. Kazemi Esfeh, V. Kilchytska, B. Parvais, N. Planes, M. Haond, D. Flandre, J.-P. Raskin
Published in:
2017 47th European Solid-State Device Research Conference (ESSDERC), 2017, Page(s) 148-151, ISBN 978-1-5090-5978-2
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2017.8066613
Author(s):
V. Kilchytska, B. Kazemi Esfeh, C. Gimeno, B. Parvais, N. Planes, M. Haond, J.-P. Raskin, D. Flandre
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 128-131, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962581
Author(s):
B. Kazemi Esfeh, V. Kilchytska, B. Parvais, N. Planes, M. Haond, D. Flandre, J.-P. Raskin
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 228-230, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962569
Author(s):
A. Idrissi-El Oudrhiri, S. Martinie, J-C. Barbe, O. Rozeau, C. Le Royer, M-A. Jaud, J. Lacord, N. Bernier, L. Grenouillet, P. Rivallin, J. Pelloux-Prayer, M. Casse, M. Mouis
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 206-209, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292295
Author(s):
Yoann Blancquaert, Nivea Figueiro, Thibault Labbaye, Francisco Sanchez, Stephane Heraud, Roy Koret, Matthew Sendelbach, Ralf Michel, Shay Wolfling, Stephane Rey, Laurent Pain
Published in:
Metrology, Inspection, and Process Control for Microlithography XXXI, 2017, Page(s) 101451F
Publisher:
SPIE
DOI:
10.1117/12.2261389
Author(s):
A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, C. Plantier, N. Rambal, J.-P. Pedini, S. Kerdiles, P. Besson, J.-M. Hartmann, D. Marseilhan, B. Mathieu, R. Berthelon, M. Casse, F. Andrieu, D. Rouchon, O. Weber, F. Boeuf, M. Haond, A. Claverie, M. Vinet
Published in:
2016 IEEE Symposium on VLSI Technology, 2016, Page(s) 1-2, ISBN 978-1-5090-0638-0
Publisher:
IEEE
DOI:
10.1109/VLSIT.2016.7573406
Author(s):
David Cooper, Nicolas Bernier, Jean-Luc Rouviere
Published in:
2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), 2015, Page(s) 777-780, ISBN 978-1-4673-8156-7
Publisher:
IEEE
DOI:
10.1109/NANO.2015.7388725
Author(s):
S. Barraud, V. Lapras, M.P. Samson, L. Gaben, L. Grenouillet, V. Maffini-Alvaro, Y. Morand, J. Daranlot, N. Rambal, B. Previtalli, S. Reboh, C. Tabone, R. Coquand, E. Augendre, O. Rozeau, J. M. Hartmann, C. Vizioz, C. Arvet, P. Pimenta-Barros, N. Posseme, V. Loup, C. Comboroure, C. Euvrard, V. Balan, I. Tinti, G. Audoit, N. Bernier, D. Cooper, Z. Saghi, F. Allain, A. Toffoli, O. Faynot, M. Vinet
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 17.6.1-17.6.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838441
Author(s):
R. Berthelon, F. Andrieu, P. Perreau, E. Baylac, A. Pofelski, E. Josse, D. Dutartre, A. Claverie, M. Haond
Published in:
2016 46th European Solid-State Device Research Conference (ESSDERC), 2016, Page(s) 127-130, ISBN 978-1-5090-2969-3
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2016.7599604
Author(s):
R. Berthelon, F. Andrieu, E. Josse, R. Bingert, O. Weber, E. Serret, A. Aurand, S. Delmedico, V. Farys, C. Bernicot, E. Bechet, E. Bernard, T. Poiroux, D. Rideau, P. Scheer, E. Baylac, P. Perreau, M.A. Jaud, J. Lacord, E. Petitprez, A. Pofelski, S. Ortolland, P. Sardin, D. Dutartre, A. Claverie, M. Vinet, J.C. Marin, M. Haond
Published in:
2016 IEEE Symposium on VLSI Technology, 2016, Page(s) 1-2, ISBN 978-1-5090-0638-0
Publisher:
IEEE
DOI:
10.1109/VLSIT.2016.7573425
Author(s):
R. Berthelon, F. Andrieu, P. Perreau, D. Cooper, F. Roze, O. Gourhant, P. Rivallin, N. Bernier, A. Cros, C. Ndiaye, E. Baylac, E. Souchier, D. Dutartre, A. Claverie, O. Weber, E. Josse, M. Vinet, M. Haond
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 17.7.1-17.7.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838442
Author(s):
R. Berthelon, F. Andrieu, S. Ortolland, R. Nicolas, T. Poiroux, E. Baylac, D. Dutartre, E. Josse, A. Claverie, M. Haond
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 88-91, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440059
Author(s):
R. Berthelon, F. Andrieu, B. Mathieu, D. Dutartre, C. Le Royer, M. Vinet, A. Claverie
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 91-94, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962609
Author(s):
R. Berthelon, F. Andneu, F. Triozon, M. Casse, L. Bourdet, G. Ghibaudo, D. Rideau, Y. M. Niquet, S. Barraud, P. Nguyen, C. Le Royer, J. Lacord, C. Tabone, O. Rozeau, D. Dutartre, A. Claverie, E. Josse, F. Arnaud, M. Vinet
Published in:
2017 Symposium on VLSI Technology, 2017, Page(s) T224-T225, ISBN 978-4-86348-605-8
Publisher:
IEEE
DOI:
10.23919/VLSIT.2017.7998180
Author(s):
M. Karner, Z. Stanojevic, O. Baumgartner, HW. Karner, C. Kernstock, H. Demel, F. Mitterbauer
Published in:
2016 IEEE Silicon Nanoelectronics Workshop (SNW), 2016, Page(s) 208-209, ISBN 978-1-5090-0726-4
Publisher:
IEEE
DOI:
10.1109/SNW.2016.7578054
Author(s):
Z. Stanojevic, M. Karner, O. Baumgartner, H. W. Karner, C. Kernstock, H. Demel, F. Mitterbauer
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 65-67, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605149
Author(s):
M. Karner, O. Baumgartner, Z. Stanojevic, F. Schanovsky, G. Strof, C. Kernstock, H. W. Karner, G. Rzepa, T. Grasset
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 30.7.1-30.7.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838516
Author(s):
Z. Stanojevic, O. Baumgartner, M. Karner, C. Kernstock, H. W. Karner, H. Demel, G. Strof, F. Mitterbauer
Published in:
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2017, Page(s) 245-248, ISBN 978-4-86348-610-2
Publisher:
IEEE
DOI:
10.23919/SISPAD.2017.8085310
Author(s):
HW. Karner, C. Kernstock, Z. Stanojevic, O. Baumgartner, F. Schanovsky, M. Karner, D. Helms, R. Eilers, M. Metzdorf
Published in:
2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2017, Page(s) 1-2, ISBN 978-1-5090-5805-1
Publisher:
IEEE
DOI:
10.1109/VLSI-TSA.2017.7942453
Author(s):
R. Carter, J. Mazurier, L. Pirro, J-U. Sachse, P. Baars, J. Faul, C. Grass, G. Grasshoff, P. Javorka, T. Kammler, A. Preusse, S. Nielsen, T. Heller, J. Schmidt, H. Niebojewski, P-Y. Chou, E. Smith, E. Erben, C. Metze, C. Bao, Y. Andee, I. Aydin, S. Morvan, J. Bernard, E. Bourjot, T. Feudel, D. Harame, R. Nelluri, H.-J. Thees, L. M-Meskamp, J. Kluth, R. Mulfinger, M. Rashed, R. Taylor, C. Weintraub
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 2.2.1-2.2.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838029
Author(s):
Licinius Benea, Maryline Bawedin, Cecile Delacour, Sorin Cristoloveanu, Irina Ionica
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 19-22, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962590
Author(s):
F. Cacho, A. Cros, X. Federspiel, V. Huard, C. Roma
Published in:
2016 IEEE International Reliability Physics Symposium (IRPS), 2016, Page(s) 7C-1-1-7C-1-6, ISBN 978-1-4673-9137-5
Publisher:
IEEE
DOI:
10.1109/IRPS.2016.7574581
Author(s):
A. Bonnevialle, S. Reboh, C. Le Royer, Y. Morand, J.-M. Hartmann, D. Rouchon, J.-M. Pedini, C. Tabone, N. Rambal, A. Payet, C. Plantier, F. Boeuf, M. Haond, A. Claverie, M. Vinet
Published in:
2016
Publisher:
E-MRS 2016 (European Material Research Society)
Author(s):
A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, J.-M. Pédini, A. Roule, D. Marseilhan, P. Besson, D. Rouchon, N. Bernier, C. Tabone, C. Plantier, M. Vinet,
Published in:
2015
Publisher:
2015 International Conference on Solid State Devices and Materials (SSDM)
Author(s):
L. Gaben, S. Barraud, P. Pimenta-Barros, Y. Morand, J. Pradelles, M.-P. Samson, B. Previtali, P. Besson, F. Allain, S. Monfray, F. Boeuf, T. Skotnicki, F. Balestra3 and M. Vine
Published in:
2015
Publisher:
2015 International Conference on Solid State Devices and Materials (SSDM)
Author(s):
A DURAND, M KAUFLING, D LE-CUNFF, D ROUCHON, P GERGAUD
Published in:
2016
Publisher:
XTOP 2016 - 13th Biennial Conference on High-Resolution X-Ray Diffraction and Imaging
Author(s):
F. Andrieu, R. Berthelon, R. Boumchedda, G. Tricaud, L. Brunet, P. Batude, B. Mathieu, E. Avelar, A. Ayres de Sousa, G. Cibrario, O. Rozeau, J. Lacord, O. Billoint, C. Fenouillet-Béranger, S. Guissi, D. Fried, P. Morin, J.P. Noel, B. Giraud, S. Thuries, F. Arnaud, M. Vinet
Published in:
2017
Publisher:
Electron Devices Meeting (IEDM), 2017 IEEE International
Author(s):
W. Schwarzenbach, F. Allibert, C. Figuet, C. Girard and C. Maleville
Published in:
2016
Publisher:
ETCMOS Conference, 2016 (Emerging Technologies Communications Microsystems Optoelectronics)
Author(s):
B.-Y. Nguyen, M.Sadaka, G.Gaudin, W. Schwarzenbach, K.Boudelle,C.Figuet and C.Maleville
Published in:
2016
Publisher:
CS ManTech Conference, 2016 (Compound Semiconductor Manufacturing Technology)
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu and C. Mazure
Published in:
2015
Publisher:
VLSI-TSA Conference 2015 - International Symposium on VL Technology, Systems and Applications
Author(s):
Nguyen, S. Barraud, L. Hutin, C. Tabone, F. Glowacki, J.-M. Hartmann, M.-P. Samson†, L. Ecarnot, B.-Y. Nguyen¤, C. Maleville, C. Mazuré, O. Faynot, M. Vinet
Published in:
2015
Publisher:
IWNA Conference 2015
Author(s):
J. Widieza, F. Mazena, J-M. Hartmanna, Y. Bogumilowicza, E. Augendrea, C. Veytizoub, S. Solliera, M. Martinc, M-C. Rourea, V. Loupa, C. Euvrada, A. Seignarda, T. Baronc, R. Ciproc, F. Bassanic, A-M. Papona, C. Guedja, I. Huyetb, M. Rivoirea, P. Bessona, C. Figuetb, W. Schwarzenbachb, D. Delpratb and T. Signamarcheixa
Published in:
2015
Publisher:
ECS Chicago 2015 (Electrochemical Society Chicago Meeting)
Author(s):
J. Kunkel
Published in:
2015
Publisher:
SOITEC
Author(s):
C.Maleville
Published in:
2016
Publisher:
The annual SOI Silicon Valle
Author(s):
C.Maleville
Published in:
2017
Publisher:
FD-SOI ForumShanghai 2017, FD-SOI Design Tutorial, SOI Workshop & Tutorial
Author(s):
N. Kernevez
Published in:
2015
Publisher:
Semicon Europa
Author(s):
T. Piliszczuk
Published in:
2015
Publisher:
Semicon Europa
Author(s):
C. Landesberger et al.
Published in:
2018
Publisher:
12th Smart Systems Integration Conference, 2018
Author(s):
T. Lim et al.
Published in:
2017
Publisher:
Proc. of 2017 Asia Pacific Microwave Conference (APMC)
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu, C. Mazure
Published in:
2015 International Symposium on VLSI Technology, Systems and Applications, 2015, Page(s) 1-2, ISBN 978-1-4799-7375-0
Publisher:
IEEE
DOI:
10.1109/VLSI-TSA.2015.7117577
Author(s):
G. Besnard, X. Garros, A. Subirats, F. Andrieu, X. Federspiel, M. Rafik, W. Schwarzenbach, G. Reimbold, O. Faynot, S. Cristoloveanu
Published in:
2015 IEEE International Reliability Physics Symposium, 2015, Page(s) 2F.1.1-2F.1.5, ISBN 978-1-4673-7362-3
Publisher:
IEEE
DOI:
10.1109/IRPS.2015.7112691
Author(s):
W. Schwarzenbach, C. Malaquin, F. Allibert, G. Besnard, B.-Y. Nguyen
Published in:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015, Page(s) 1-3, ISBN 978-1-5090-0259-7
Publisher:
IEEE
DOI:
10.1109/S3S.2015.7333496
Author(s):
A. S. N. Pereira, G. de Streel, N. Planes, M. Haond, R. Giacomini, D. Flandre, V. Kilchytska
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 116-119, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440066
Author(s):
V. Velayudhan, J. Martin-Martinez, M. Porti, C. Couso, R. Rodriguez, M. Nafria, X. Aymerich, C. Marquez, F. Gamiz
Published in:
2015 45th European Solid State Device Research Conference (ESSDERC), 2015, Page(s) 230-233, ISBN 978-1-4673-7135-3
Publisher:
IEEE
DOI:
10.1109/ESSDERC.2015.7324756
Author(s):
Carlos Marquez, Noel Rodriguez, Francisco Gamiz, Akiko Ohata
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 40-43, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440047
Author(s):
C. Medina-Bailon, C. Sampedro, F. Gamiz, A. Godoy, L. Donetti
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 214-217, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292297
Author(s):
Luca Donetti, Carlos Sampedro, Francisco Gamiz, Andres Godoy, Francisco J. Garcia-Ruiz, Ewan Towiez, Vihar P. Georgiev, Salvatore Maria Amoroso, Craig Riddet, Asen Asenov
Published in:
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2015, Page(s) 353-356, ISBN 978-1-4673-7860-4
Publisher:
IEEE
DOI:
10.1109/SISPAD.2015.7292332
Author(s):
C. Medina-Bailon, C. Sampedro, F. Gamiz, A. Godoy, L. Donetti
Published in:
2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016, Page(s) 100-103, ISBN 978-1-4673-8609-8
Publisher:
IEEE
DOI:
10.1109/ULIS.2016.7440062
Author(s):
Z. Stanojevic, O. Baumgartner, F. Mitterbauer, H. Demel, C. Kernstock, M. Karner, V. Eyert, A. France-Lanord, P. Saxe, C. Freeman, E. Wimmer
Published in:
2015 IEEE International Electron Devices Meeting (IEDM), 2015, Page(s) 5.1.1-5.1.4, ISBN 978-1-4673-9894-7
Publisher:
IEEE
DOI:
10.1109/IEDM.2015.7409631
Author(s):
D. Benoit, J. Mazurier, B. Varadarajan, S. Chhun, S. Lagrasta, C. Gaumer, D. Galpin, C. Fenouillet-Beranger, D. Vo-Thanh, D. Barge, R. Duru, R. Beneyton, B. Gong, N. Sun, N. Chauvet, P. Ruault, D. Winandy, B. van Schravendijk, P. Meijer, O. Hinsinger
Published in:
2015 IEEE International Electron Devices Meeting (IEDM), 2015, Page(s) 8.6.1-8.6.4, ISBN 978-1-4673-9894-7
Publisher:
IEEE
DOI:
10.1109/IEDM.2015.7409656
Author(s):
C.Maleville
Published in:
2017
Publisher:
Annual SOI Silicon Valley Symposium
Author(s):
P.Gupta
Published in:
2016
Publisher:
IRPS Conference
Author(s):
Christophe Maleville
Published in:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015, Page(s) 1-5, ISBN 978-1-5090-0259-7
Publisher:
IEEE
DOI:
10.1109/S3S.2015.7333494
Author(s):
V. Joshi, H. Ramamurthy, S. Balasubramanian, S. Seo, H. Yoon, X. Zou, N. Chan, J. Yun, T. Klick, E. Smith, J. Schmid, R. vanBentum, J. Faul, C. Weintraub
Published in:
2017 Symposium on VLSI Technology, 2017, Page(s) T222-T223, ISBN 978-4-86348-605-8
Publisher:
IEEE
DOI:
10.23919/VLSIT.2017.7998179
Author(s):
P.Flatresse
Published in:
2017
Publisher:
IPSOC
Author(s):
C.Mazure
Published in:
2017
Publisher:
Minalogic
Author(s):
N.Daval
Published in:
2017
Publisher:
Semicon Europea
Author(s):
Fred Buchali, Laurent Schmalen, Qian Hu, Di Che
Published in:
2015 European Conference on Optical Communication (ECOC), 2015, Page(s) 1-3, ISBN 978-8-4608-1741-3
Publisher:
IEEE
DOI:
10.1109/ECOC.2015.7341622
Author(s):
F.Buchali
Published in:
2016
Publisher:
Pro OFC
Author(s):
Dajana Danilovic, Vladimir Milovanovic, Andreia Cathelin, Andrei Vladimirescu, Borivoje Nikolic
Published in:
2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2016, Page(s) 87-90, ISBN 978-1-4673-8651-7
Publisher:
IEEE
DOI:
10.1109/RFIC.2016.7508257
Author(s):
Ilias Sourikopoulos, Antoine Frappe, Andreia Cathelin, Laurent Clavier, Andreas Kaiser
Published in:
ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 2016, Page(s) 145-148, ISBN 978-1-5090-2972-3
Publisher:
IEEE
DOI:
10.1109/ESSCIRC.2016.7598263
Author(s):
Abhirup Lahiri, Nitin Gupta
Published in:
ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 2016, Page(s) 339-342, ISBN 978-1-5090-2972-3
Publisher:
IEEE
DOI:
10.1109/ESSCIRC.2016.7598311
Author(s):
Reda Kasri, Eric Klumperink, Philippe Cathelin, Eric Toumier, Bram Nauta
Published in:
2017 IEEE Custom Integrated Circuits Conference (CICC), 2017, Page(s) 1-4, ISBN 978-1-5090-5191-5
Publisher:
IEEE
DOI:
10.1109/CICC.2017.7993644
Author(s):
Andreia Cathelin
Published in:
2017 IEEE Custom Integrated Circuits Conference (CICC), 2017, Page(s) 1-53, ISBN 978-1-5090-5191-5
Publisher:
IEEE
DOI:
10.1109/CICC.2017.7993721
Author(s):
Mirjana Videnovic-Misic
Published in:
2017
Publisher:
IEEE
Author(s):
N. Ben Salem, R.K. Gupta
Published in:
2017
Publisher:
MUGM 2017 (MunEDA Users Group Meeting)
Author(s):
K. Kühnel, S. Riedel, W. Weinreich, X. Thrun, M. Czernohorsky, B. Pätzold, M. Rudolph
Published in:
2016
Publisher:
16th International Conference on Atomic Layer Deposition
Author(s):
W. Lerch, N. Sacher, W. Kegel, J. Niess, M. Czernohorsky
Published in:
2016
Publisher:
19th Workshop on Dielectrics in Microelectronic (WoDiM)
Author(s):
L. Gerlich, M. Wislicenus, B. Uhlig, S. Riedel, R. Liske
Published in:
2016
Publisher:
Proc. Of Functional Integrated nanoSystems (nanoFIS 2016)
Author(s):
M. Wislicenus, T. Martin, L. Gerlich, B. Uhlig
Published in:
2016
Publisher:
Proc. Of Area Selective Deposition Workshop (ASD 2016)
Author(s):
A.S.N. Pereira, G. de Streel, N. Planes, M. Haond, R. Giacomini, D. Flandre, V. Kilchytska
Published in:
Solid-State Electronics, Issue 128, 2017, Page(s) 67-71, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2016.10.017
Author(s):
M. Czernohorsky, K. Seidel, K. Kühnel, J. Niess, N. Sacher, W. Kegel, W. Lerch
Published in:
Microelectronic Engineering, Issue 178, 2017, Page(s) 262-265, ISSN 0167-9317
Publisher:
Elsevier BV
DOI:
10.1016/j.mee.2017.05.041
Author(s):
Aurèle Durand, Melissa Kaufling, Delphine Le-Cunff, Denis Rouchon, Patrice Gergaud
Published in:
Materials Science in Semiconductor Processing, Issue 70, 2017, Page(s) 99-104, ISSN 1369-8001
Publisher:
Pergamon Press
DOI:
10.1016/j.mssp.2016.12.003
Author(s):
L. Fauquier, B. Pelissier, D. Jalabert, F. Pierre, J.M. Hartmann, F. Rozé, D. Doloy, D. Le Cunff, C. Beitia, T. Baron
Published in:
Materials Science in Semiconductor Processing, Issue 70, 2017, Page(s) 105-110, ISSN 1369-8001
Publisher:
Pergamon Press
DOI:
10.1016/j.mssp.2016.10.028
Author(s):
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