Transfer of Knowledge from Scientific Research Projects towards Middle School Scholars
Autori:
J. Kovác, jr, R. Szobolovský, A. Kósa, L. Stuchlíková and J. Kovác
Pubblicato in:
ICETA, 2015
Editore:
IEEEE
Thermal Management of multifinger Power HEMTs Supported by 3-D Simulation
Autori:
A. Chvála, J. Marek, P. Príbytný, J. Kováč, S. Delage, J.-C. Jacquet and D. Donoval
Pubblicato in:
Advances in Electrical and Electronic Engineering, Numero Proceedings of the 4th international conference on Advances in Electronic and Photonic Technologies ADEPT, June 20 - 23, 2016, 2016
Editore:
Advances in Electrical and Electronic Engineering
2/3-D Device Simulations as an Effective Tool in Microelectronics Education
Autori:
Aleš Chvála, Juraj Marek, Arpád Kósa, Patrik Príbytný, Ľubica Stuchlíková and Daniel Donoval
Pubblicato in:
Proceeding EWME, Numero 11th European Workshop on Microelectronics Education 2016, Southampton, 11-13 May, 2016, 2016
Editore:
IEEE Xplore
Results on specific backside opening process dedicated to engineering package for SiC component
Autori:
G. Bascoul, F. Infante
Pubblicato in:
Association d'analyse de défaillance Française (ANADEF), Numero June 7-10 2016 Seignosse-Hossegor France, 2016
Editore:
ANADEF
Surface properties of AlInN/GaN heterostructures
Autori:
A. Minj, D. Skuridina, D. Cavalcoli, A. Cros, P. Vogt, M. Kneissl, H. Ben Ammar and P. Ruterana
Pubblicato in:
E-MRS, Numero Spring meeting, 2-6 May 2016 Lille France, 2016
Editore:
MRS