Heterogeneous 3D integration technologies are part of the More-than-Moore paradigm depicted in the International Technology Roadmap for Semiconductors (ITRS) and they allow the combination of standard CMOS-based integrated circuits (ICs) with micro and nanoelectromechanical system (MEMS & NEMS) devices consisting of high-performance NEMS materials (e.g. mono-crystalline silicon) to form complex and highly integrated systems that are not possible to manufacture with other micro-manufacturing approaches. In the ERC Starting Grant No.277879 we have been developing an advanced heterogeneous 3D integration platform for integrating ICs and NEMS. Within the present proof-of-concept project we have explored the commercial potential of the new heterogeneous 3D NEMS integration platform. We have successfully established a collaboration with industry to utilize our technology platform. Furthermore we have demonstrated the feasibility of the integration platform for realizing IC-integrated NEM relays. These results are important steps towards the commercialization of next generation NEMS devices that are integrated on CMOS-based ICs.
