Periodic Reporting for period 3 - HIPERDIAS (HIgh throughPut LasER processing of DIamond and Silicon)
Berichtszeitraum: 2018-08-01 bis 2019-10-31
HIPERDIAS is strongly user-driven in order to demonstrate industrial relevance of laser micromachining at two major reference sites targeting the displacement of the current state of the art mechanical processes with 3D laser ablation of silicon, laser polishing of diamond and fine cutting of metals respectively.
The following primary objectives were targeted:
• Highly flexible high-power and high-efficiency femtosecond laser source with average output power of up to 1000 W at the megahertz (MHz) including flexible fiber beam delivery
• Cost-efficient solutions (power scaling, pulse compression & fiber transport) for a broad range of applications
• Optimization of demanding high-volume applications regarding efficiency as well as quality
In the 2nd period, the project achieved good progress in all work packages. In WP2, the development of processing strategies for all three applications proceeded very satisfactorily. Indications from the work undertaken using low power laser sources suggested that the achievement of the targeted application results would be attainable as power scaling was implemented. In the first application to proceed to high powers, namely Si ablation tests, the early results showed real promise with respect to the combined achievement of material removal rates and surface finish quality. In WP3, the development of the 200W seed laser to drive the Multi-Pass Amplifier experienced some challenges. Although able to demonstrate the required power output, further development work was required to sustain long-term stability of operation. In WP4, the technology of the high PER (Polarization Extinction Ratio) fibre now featured in the BDS for testing with end-users. Similarly, the manufacturing process for large-area compressor gratings was optimised with samples tested in high power set-ups. In WP5, the Multi-Pass Amplifier was commissioned and made available for application tests. In addition, the SHG and THG generation has been completed satisfactorily but with some unavoidable limitations due to the availability of suitable crystals. In WP6, the system build-up reached a high level of maturity and in WP7 tests were underway to evaluate the processing strategies at higher powers for applications in diamond polishing and fine cutting of metals.
In the final period of the project all components necessary for the successful process development with a high-power femtosecond laser for end-users E6 and BOSCH have been integrated into a stable, flexible and versatile machine base . Furthemore a 500 W/1 kW demonstrator system has been tested and validated by the end-users BOSCH and E6 in collaboration with partner USTUTT. The desired ablation rate for the processing of silicon has been largely achieved, with the majority of the key performance indicators for the fine cutting of metals and diamond polishing also being achieved.
The consortium have estimated in the 6 years following the project HIPERDIAS will generate additional turnover of €138.3M and create 59 new jobs within the project partners' organisations.