Deliverables
Hierarchical set of presentation foils and leaflets for use by SUPERAID7 partners and eventually by the EC services – to be updated until the end of the project
Publishable version of the Technology Implementation Plan
The Technology Implementatiion Plan will be prepared in two versions: A more detailed confidential one and a document with infomation selected for publication (this document)
Demonstration of correlation-aware simulation of impacts of statistical and systematic variabilityFinal version of SUPERAID7 WWW including restricted section (to be maintained at least three years beyond the project) and including material from the SUPERAID7 Workshop
Set-up of SUPERAID7 WWW including preliminary version of restricted sectionProject Presentation
Public Project Presentation which will be made available especially at the public WWW page of SUPERAID7. Deliverable report to be also provided.
Public workshop on variabilityA workshop on variability and its simulation will be organized towards the end of the project, in order to achieve best visibility of the overall project results.
This document summarizes and links to research data generated within the SUPERAID7 project which could be disseminated without compromising confidentiality issues or commercial interest of partners. Experimental data used in SUPERAID7 could only be included to a limited extent, because it mainly resulted from background or sideground work of project or cooperation partners. Therefore, data included mainly refers to physical models developed, their comparison with literature or other models, generic benchmark studies or variability studies. The dissemination of these data is based on a hierarchical access principle. Here, this document serves as the entry point and guide in which an inventory of the data generated and disseminated is given, together with a link to the detailed data, which were in most cases published in journals or conference proceedings, and made available Open Access.
Publications
Author(s):
Talib Al-Ameri, Vihar P. Georgiev, Fikru Adamu-Lema, Asen Asenov
Published in:
IEEE Journal of the Electron Devices Society, Issue 5/6, 2017, Page(s) 466-472, ISSN 2168-6734
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2017.2752465
Author(s):
Paul Ellinghaus, Josef Weinbub, Mihail Nedjalkov, Siegfried Selberherr
Published in:
physica status solidi (RRL) - Rapid Research Letters, Issue 11/7, 2017, Page(s) 1700102, ISSN 1862-6254
Publisher:
Wiley - VCH Verlag GmbH & CO. KGaA
DOI:
10.1002/pssr.201700102
Author(s):
Vihar P. Georgiev, Muhammad M. Mirza, Alexandru-Iustin Dochioiu, Fikru Adamu-Lema, Salvatore M. Amoroso, Ewan Towie, Craig Riddet, Donald A. MacLaren, Asen Asenov, Douglas J. Paul
Published in:
IEEE Transactions on Nanotechnology, Issue 16/5, 2017, Page(s) 727-735, ISSN 1536-125X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tnano.2017.2665691
Author(s):
Zaiping Zeng, Francois Triozon, Sylvain Barraud, Yann-Michel Niquet
Published in:
IEEE Transactions on Electron Devices, Issue 64/6, 2017, Page(s) 2485-2491, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2017.2691406
Author(s):
Talib Al-Ameri
Published in:
Applied Sciences, Issue 8/1, 2018, Page(s) 54, ISSN 2076-3417
Publisher:
MDPI
DOI:
10.3390/app8010054
Author(s):
Bruna Cardoso Paz, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello
Published in:
Solid-State Electronics, Issue 149, 2018, Page(s) 62-70, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2018.08.012
Author(s):
Bruna Cardoso Paz, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello
Published in:
Solid-State Electronics, Issue 141, 2018, Page(s) 84-91, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2017.12.011
Author(s):
Jaehyun Lee, Oves Badami, Hamilton Carrillo-Nuñez, Salim Berrada, Cristina Medina-Bailon, Tapas Dutta, Fikru Adamu-Lema, Vihar Georgiev, Asen Asenov
Published in:
Micromachines, Issue 9/12, 2018, Page(s) 643, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi9120643
Author(s):
J. K. Lorenz, A. Asenov, E. Baer, S. Barraud, F. Kluepfel, C. Millar, M. Nedjalkov
Published in:
ECS Journal of Solid State Science and Technology, Issue 7/11, 2018, Page(s) P595-P601, ISSN 2162-8769
Publisher:
Electrochemical Society, Inc.
DOI:
10.1149/2.0051811jss
Author(s):
Juergen Klaus Lorenz, Asen Asenov, Eberhard Baer, Sylvain Barraud, Campbell Millar, Mihail Nedjalkov
Published in:
ECS Transactions, Issue 85/8, 2018, Page(s) 113-124, ISSN 1938-5862
Publisher:
Electrochemical Society, Inc.
DOI:
10.1149/08508.0113ecst
Author(s):
Xaver Klemenschits, Siegfried Selberherr, Lado Filipovic
Published in:
Micromachines, Issue 9/12, 2018, Page(s) 631, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi9120631
Author(s):
Mihail Nedjalkov, Paul Ellinghaus, Josef Weinbub, Toufik Sadi, Asen Asenov, Ivan Dimov, Siegfried Selberherr
Published in:
Computer Physics Communications, Issue 228, 2018, Page(s) 30-37, ISSN 0010-4655
Publisher:
Elsevier BV
DOI:
10.1016/j.cpc.2018.03.010
Author(s):
Toufik Sadi, Cristina Medina-Bailon, Mihail Nedjalkov, Jaehyun Lee, Oves Badami, Salim Berrada, Hamilton Carrillo-Nunez, Vihar Georgiev, Siegfried Selberherr, Asen Asenov
Published in:
Materials, Issue 12/1, 2019, Page(s) 124, ISSN 1996-1944
Publisher:
MDPI Open Access Publishing
DOI:
10.3390/ma12010124
Author(s):
Jürgen Lorenz, Eberhard Bär, Sylvain Barraud, Andrew Brown, Peter Evanschitzky, Fabian Klüpfel, Liping Wang
Published in:
Micromachines, Issue 10/1, 2019, Page(s) 6, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi10010006
Author(s):
Talib Al-Ameri, V. P. Georgiev, Fikru Adamu-Lema, Asen Asenov
Published in:
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2017, Page(s) 57-60, ISBN 978-4-86348-610-2
Publisher:
IEEE
DOI:
10.23919/sispad.2017.8085263
Author(s):
J.-Ch. Barbe, S. Barraud, O. Rozeau, S. Martinia, J. Lacord, P. Blaise, Z. Zeng, L. Bourdet, F. Triozon, Y. Niquet
Published in:
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2017, Page(s) 5-8, ISBN 978-4-86348-610-2
Publisher:
IEEE
DOI:
10.23919/sispad.2017.8085250
Author(s):
S. Barraud, V. Lapras, B. Previtali, M. P. Samson, J. Lacord, S. Martinie, M.-A. Jaud, S. Athanasiou, F. Triozon, O. Rozeau, J. M. Hartmann, C. Vizioz, C. Comboroure, F. Andrieu, J. C. Barbe, M. Vinet, T. Ernst
Published in:
2017 IEEE International Electron Devices Meeting (IEDM), 2017, Page(s) 29.2.1-29.2.4, ISBN 978-1-5386-3559-9
Publisher:
IEEE
DOI:
10.1109/iedm.2017.8268473
Author(s):
S. Barraud, V. Lapras, M. Samson, B. Previtali, J. Hartmann, N. Rambal, C. Vizioz, V. Loup, C. Comboroure, F. Triozon, N. Bernier, D. Cooper, M. Vinet
Published in:
Proceedings 2017 International Conference on Solid State Devices and Materials (SSDM 2017), 2017, Page(s) 1
Publisher:
1
Author(s):
Paul Ellinghaus, Mihail Nedjalkov, Josef Weinbub, Siegfried Selberherr
Published in:
International Wigner Workshop (IW2), Book of Abstracts, 2017, Page(s) 40-41, ISBN 978-3-200-05129-4
Publisher:
Institute for Microelectronics, TU Wien, Austria
Author(s):
Bruna Cardoso Paz, Mikael Casse, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello
Published in:
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017, Page(s) 1-3, ISBN 978-1-5386-3766-1
Publisher:
IEEE
DOI:
10.1109/s3s.2017.8309237
Author(s):
Bruna Cardoso Paz, Marcelo Antonio Pavanello, Mikael Casse, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 79-82, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ulis.2017.7962606
Author(s):
L. Filipovic, R.L. de Orio, W.H. Zisser, S. Selberherr
Published in:
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2017, Page(s) 161-164, ISBN 978-4-86348-610-2
Publisher:
IEEE
DOI:
10.23919/sispad.2017.8085289
Author(s):
Josef Weinbub, Mihail Nedjalkov, Ivan Dimov, Siegfried Selberherr
Published in:
International Wigner Workshop (IW2), Book of Abstracts, 2017, Page(s) 50-51, ISBN 978-3-200-05129-4
Publisher:
Institute for Microelectronics, TU Wien, Austria
Author(s):
Eberhard Baer, Juergen Lorenz
Published in:
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2018, Page(s) 236-239, ISBN 978-1-5386-6790-3
Publisher:
IEEE
DOI:
10.1109/sispad.2018.8551649
Author(s):
Salim Berrada, Jaehyun Lee, Hamilton Carrillo-Nunez, Cristina Medina-Bailon, Fikru Adamu-Lema, Vihar Georgiev, Pr Asen Asenov
Published in:
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2018, Page(s) 244-247, ISBN 978-1-5386-6790-3
Publisher:
IEEE
DOI:
10.1109/sispad.2018.8551638
Author(s):
Zelalem Tamrate Belete, Eberhard Baer, Andreas Erdmann
Published in:
Advanced Etch Technology for Nanopatterning VII, 2018, Page(s) 28, ISBN 9781-510616714
Publisher:
SPIE
DOI:
10.1117/12.2299977
Author(s):
Xaver Klemenschits, Siegfried Selberherr, Lado Filipovic
Published in:
2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2018, Page(s) 1-4, ISBN 978-1-5386-4811-7
Publisher:
IEEE
DOI:
10.1109/ulis.2018.8354763
Author(s):
Lado Filipovic, Roberto Lacerda de Orio
Published in:
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2018, Page(s) 83-87, ISBN 978-1-5386-6790-3
Publisher:
IEEE
DOI:
10.1109/sispad.2018.8551746
Author(s):
Jaehyun Lee, Salim Berrada, Hamilton Carrillo-Nunez, Cristina Medina-Bailon, Fikru Adamu-Lema, Vihar P. Georgiev, Asen Asenov
Published in:
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2018, Page(s) 280-283, ISBN 978-1-5386-6790-3
Publisher:
IEEE
DOI:
10.1109/sispad.2018.8551697
Author(s):
C. Medina-Bailon, T. Sadi, M. Nedjalkov, J. Lee, S. Berrada, H. Carrillo-Nunez, V. Georgiev, S. Selberherr, A. Asenov
Published in:
2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2018, Page(s) 1-4, ISBN 978-1-5386-4811-7
Publisher:
IEEE
DOI:
10.1109/ulis.2018.8354723
Author(s):
Cristina Medina-Bailon, Toufik Sadi, Mihail Nedjalkov, Jaehyun Lee, Salim Berrada, Hamilton Carrillo-Nunez, Vihar P. Georgiev, Siegfried Selberherr, Asen Asenov
Published in:
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2018, Page(s) 297-300, ISBN 978-1-5386-6790-3
Publisher:
IEEE
DOI:
10.1109/sispad.2018.8551630
Author(s):
Leo Bourdet, Jing Li, Johan Pelloux-Prayer, Francois Triozon, Mikael Casse, Sylvain Barraud, Sebastien Martinie, Denis Rideau, Yann-Michel Niquet
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 291-294, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605204
Author(s):
O. Rozeau, S. Martinie, T. Poiroux, F. Triozon, S. Barraud, J. Lacord, Y. M. Niquet, C. Tabone, R. Coquand, E. Augendre, M. Vinet, O. Faynot, J.-Ch. Barbe
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 7.5.1-7.5.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838369
Author(s):
Talib Al-Ameri, Vihar P. Georgiev, Fikru-Adamu Lema, Toufik Sadi, Xingsheng Wang, Ewan Towie, Craig Riddet, Craig Alexander, Asen Asenov
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 213-216, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605185
Author(s):
Zaiping Zeng, Francois Triozon, Yann-Michel Niquet, Sylvain Barraud
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 257-260, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605196
Author(s):
S. Barraud, V. Lapras, M.P. Samson, L. Gaben, L. Grenouillet, V. Maffini-Alvaro, Y. Morand, J. Daranlot, N. Rambal, B. Previtalli, S. Reboh, C. Tabone, R. Coquand, E. Augendre, O. Rozeau, J. M. Hartmann, C. Vizioz, C. Arvet, P. Pimenta-Barros, N. Posseme, V. Loup, C. Comboroure, C. Euvrard, V. Balan, I. Tinti, G. Audoit, N. Bernier, D. Cooper, Z. Saghi, F. Allain, A. Toffoli, O. Faynot, M. Vinet
Published in:
2016 IEEE International Electron Devices Meeting (IEDM), 2016, Page(s) 17.6.1-17.6.4, ISBN 978-1-5090-3902-9
Publisher:
IEEE
DOI:
10.1109/IEDM.2016.7838441
Author(s):
L. Wang, B. Cheng, P. Asenov, A. Pender, D. Reid, F. Adamu-Lema, C. Millar, A. Asenov
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 157-160, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605171
Author(s):
Zaiping Zeng, Francois Triozon, Yann-Michel Niquet
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 369-372, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605223
Author(s):
Toufik Sadi, Ewan Towie, Mihail Nedjalkov, Craig Riddet, Craig Alexander, Liping Wang, Vihar Georgiev, Andrew Brown, Campbell Millar, Asen Asenov
Published in:
2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2016, Page(s) 23-26, ISBN 978-1-5090-0818-6
Publisher:
IEEE
DOI:
10.1109/SISPAD.2016.7605139
Author(s):
Vihar P. Georgiev, Muhammad M. Mirza, Alexandru-Iustin Dochioiu, Fikru-Adamu Lema, Slavatore M. Amoroso, Ewan Towie, Craig Riddet, Donald A. MacLaren, Asen Asenov, Douglas J. Paul
Published in:
2016 IEEE Nanotechnology Materials and Devices Conference (NMDC), 2016, Page(s) 1-3, ISBN 978-1-5090-4352-1
Publisher:
IEEE
DOI:
10.1109/NMDC.2016.7777084
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