Risultati finali
1st annual meeting (M14) will be held in conjunction with the check meeting 1
MTJ layerstack design for optical switchingDesign of a layerstack, consisting of a fixed layer and a free layer, i.e., forming an MTJ, where the magnetization direction of the free layer can be switched optically (M24);
Kick off meetingKick-off meeting with all involved parties. (M1)
Analysis of nano-oscillator applicationsAnalysis of the possibilities for synchronizing current oscillations appearing in MTJ elements with the incoming optical pulse rate, i.e., optical injection locking, and exploration of the potential application of massively parallel and synchronized nano-oscillators (M36)
MTJ layerstack for optical switching @ 2 mJ/cm2Improving the design of D1.1 to have a target optical switch energy of the free layer of 2 mJ/cm2, e.g., corresponding to an optical switch energy of 200 fJ for an MTJ element scaled to 100 nm × 100 nm (M36)
Final annual meetingFinal annual meeting (M48) will be held in conjunction with the final check meeting
Data Management Plan update 2Final update on the Data Management Plan (M44)
Data Management plan update 1Midterm update on the Data Management Plan (M23)
Roadmap for SPICE aligned with ITRSRoadmap for the SPICE technology, including the identification, definition and quantification of target metrics, and aligned to the ITRS roadmap (M51)
MTJ element design for optical accessDesign of an MTJ element that allows for optical illumination, e.g., having a transparent top contact, optical switching of the free layer, and electrical read-out, i.e., having the potential for electrical contacts and having a conductive layerstack (M24)
2nd Annual meetingSecond annual meeting (M25)
Plan for Quality AssurancePlan for Quality Assurance (M6)
Quantitative analysis of memory applicationQuantitative design study on the potential for using SPICE technology for memory applications, including typical memory architecture considerations, and including CMOS read circuitry (M24)
Dissemination and exploitation plan updateDissemination and exploitation plan update (M30)
3rd Annual meeting3rd Annual meeting (M37)
Dissemination and exploitation planDissemination and exploitation plan (M12)
Realization of an 8-bit photonic-spintronic memory demonstrator, consisting of a combination of a silicon photonic chip and a spintronic chip, i.e., using hybrid integration (M51)
Silicon photonic chip for coupling testingRealization of a silicon photonic chip with test structures for coupling from the silicon photonic chip to the spintronic chip, e.g., using vertical grating coupler structures, and having a controlled polarization of the optical pulses (M36)
Silicon photonic chip for distribution networkRealization of a silicon photonic chip containing a distribution network to switch sub-picosecond optical pulses and optimized for energy efficient operation, i.e., energy consumption per pulse that has to write a bit (M24)
Data Management Plan corresponding to the H2020 pilot action on open access to research data (M6)
Second check meeting (M32)
Final Check MeetingFinal check meeting (M51) will be held in conjunction with the final annual meeting
Check meeting 1First check meeting (M15) wil be held in conjunction with 1st annual meeting
Circuit-level simulation tool based on VerilogCircuit level simulation tool, based, e.g., on Verilog, using, a.o., input from physical-level simulators, experimental results, and silicon photonic PDK parameters (M36)
Course material for a PhD-level course on spintronic and photonic based beyond-CMOS technologies for future processors and memory, consisting of, a.o., a slide deck and a syllabus (M24)
Project website and logoProject website SPICE-Web up and running and finalized logo design (M3)
Pubblicazioni
Autori:
L. Avilés-Félix, L. Álvaro-Gómez, G. Li, C. S. Davies, A. Olivier, M. Rubio-Roy, S. Auffret, A. Kirilyuk, A. V. Kimel, Th. Rasing, L. D. Buda-Prejbeanu, R. C. Sousa, B. Dieny, I. L. Prejbeanu
Pubblicato in:
AIP Advances, Numero 9/12, 2019, Pagina/e 125328, ISSN 2158-3226
Editore:
American Institute of Physics Inc.
DOI:
10.1063/1.5129821
Autori:
Hanna Becker, Clemens J. Kruckel, Dries Van Thourhout, Martijn J. R. Heck
Pubblicato in:
IEEE Journal of Selected Topics in Quantum Electronics, Numero 26/2, 2020, Pagina/e 1-8, ISSN 1077-260X
Editore:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/jstqe.2019.2933805
Autori:
R. Medapalli, G. Li, Sheena K. K. Patel, R. V. Mikhaylovskiy, Th. Rasing, A. V. Kimel, E. E. Fullerton
Pubblicato in:
Applied Physics Letters, Numero 117/14, 2020, Pagina/e 142406, ISSN 0003-6951
Editore:
American Institute of Physics
DOI:
10.1063/5.0026252
Autori:
L. Avilés-Félix, A. Olivier, G. Li, C. S. Davies, L. Álvaro-Gómez, M. Rubio-Roy, S. Auffret, A. Kirilyuk, A. V. Kimel, Th. Rasing, L. D. Buda-Prejbeanu, R. C. Sousa, B. Dieny, I. L. Prejbeanu
Pubblicato in:
Scientific Reports, Numero 10/1, 2020, ISSN 2045-2322
Editore:
Nature Publishing Group
DOI:
10.1038/s41598-020-62104-w
Autori:
A. Gatilova, E. A. Mashkovich, K. A. Grishunin, A. Pogrebna, R. V. Mikhaylovskiy, Th. Rasing, P. M. Christianen, N. Nishizawa, H. Munekata, A. V. Kimel
Pubblicato in:
Physical Review B, Numero 101/2, 2020, Pagina/e 020413, ISSN 2469-9950
Editore:
American Physical Society
DOI:
10.1103/physrevb.101.020413
Autori:
G. Li, R. Medapalli, R. V. Mikhaylovskiy, F. E. Spada, Th. Rasing, E. E. Fullerton, A. V. Kimel
Pubblicato in:
Physical Review Materials, Numero 3/8, 2019, Pagina/e 084415, ISSN 2475-9953
Editore:
American Physical Society
DOI:
10.1103/physrevmaterials.3.084415
Autori:
C.S. Davies, T. Janssen, J.H. Mentink, A. Tsukamoto, A.V. Kimel, A.F.G. van der Meer, A. Stupakiewicz, A. Kirilyuk
Pubblicato in:
Physical Review Applied, Numero 13/2, 2020, Pagina/e 024064, ISSN 2331-7019
Editore:
American Physical Society
DOI:
10.1103/physrevapplied.13.024064
Autori:
A Olivier, L Avilés-Félix, A Chavent, L Álvaro-Goémez, M Rubio-Roy, S Auffret, L Vila, B Dieny, R C Sousa, I L Prejbeanu
Pubblicato in:
Nanotechnology, Numero 31/42, 2020, Pagina/e 425302, ISSN 0957-4484
Editore:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/ab9c56
Autori:
Søren Smidstrup, Troels Markussen, Pieter Vancraeyveld, Jess Wellendorff, Julian Schneider, Tue Gunst, Brecht Verstichel, Daniele Stradi, Petr A Khomyakov, Ulrik G Vej-Hansen, Maeng-Eun Lee, Samuel T Chill, Filip Rasmussen, Gabriele Penazzi, Fabiano Corsetti, Ari Ojanperä, Kristian Jensen, Mattias L N Palsgaard, Umberto Martinez, Anders Blom, Mads Brandbyge, Kurt Stokbro
Pubblicato in:
Journal of Physics: Condensed Matter, Numero 32/1, 2020, Pagina/e 015901, ISSN 0953-8984
Editore:
Institute of Physics Publishing
DOI:
10.1088/1361-648x/ab4007
Autori:
Hanna Becker, Clemens J. Kruckel, Dries Van Thourhout, Martijn J. R. Heck
Pubblicato in:
2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2019, Pagina/e 1-1, ISBN 978-1-7281-0469-0
Editore:
IEEE
DOI:
10.1109/cleoe-eqec.2019.8871732
Autori:
Clemens J. Kruckel, Hanna Becker, Yoojin Ban, Martijn J. R. Heck, Joris Van Campenhout, Dries Van Thourhout
Pubblicato in:
2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2019, Pagina/e 1-1, ISBN 978-1-7281-0469-0
Editore:
IEEE
DOI:
10.1109/cleoe-eqec.2019.8871631
Autori:
Clemens J. Kriickel, Joris Van Campenhout, Dries van Thourhout
Pubblicato in:
Conference on Lasers and Electro-Optics, 2020, Pagina/e SM2J.3, ISBN 978-1-943580-76-7
Editore:
OSA
DOI:
10.1364/cleo_si.2020.sm2j.3
Autori:
Elzbieta K. Sobolewska, Johan Pelloux-Prayer, Hanna Becker, Guanqiao Li, Carl S. Davies, Clemens J. Krückel, Luis Avilés Félix, Aurélien Olivier, Ricardo Sousa, Ioan-Lucian Prejbeanu, Andrei I. Kiriliouk, Dries Van Thourhout, Theo Rasing, Farshad Moradi, Martijn J. R. Heck
Pubblicato in:
Active Photonic Platforms XII, 2020, Pagina/e 78, ISBN 9781510637290
Editore:
SPIE
DOI:
10.1117/12.2567662
Autori:
Hanna Becker, Clemens Krückel, Dries Van Thourhout, Martijn J.R. Heck
Pubblicato in:
2019 Proceedings ECIO Conference in Ghent, 2019
Editore:
https://www.ecio-conference.org
Autori:
C.J. Krückel, H. Becker, M.J.R. Heck, J. Van Campenhout, D. van Thourhout
Pubblicato in:
45th European Conference on Optical Communication (ECOC 2019), 2019, Pagina/e 334 (4 pp.)-334 (4 pp.), ISBN 978-1-83953-185-9
Editore:
Institution of Engineering and Technology
DOI:
10.1049/cp.2019.1068
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