Photonic Integrated Circuits Assembly and Packaging Pilot Line

Informazioni relative al progetto

PIXAPP

ID dell’accordo di sovvenzione: 731954

DOI

10.3030/731954

Progetto chiuso

Data della firma CE 3 Novembre 2016

Data di avvio 1 Gennaio 2017

Data di completamento 30 Settembre 2021

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale

€ 15 690 921,43

Contributo UE

€ 13 407 812,76

Coordinato da

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Documents, reports (9)

Press release announcing Pilot Line project
Training activity report

Training activity report Mid interim Training activity report due on M24 and final report due M48.

Communication & dissemination yearly report 3

Communication & dissemination yearly report year 3

Communication & dissemination yearly report 4

Communication dissemination yearly report year 4

Large Scale Manufacturing of SiN Reference PICs for Industrial Packaging

This deliverable will report on the fabrication of 1000 SiN standardised reference PICs which will be used for large scale development and optimisation of fibre attachment processes The report will detail the yield quantity and initial testing results of the devices The report will also describe how these reference PICs will be used to support photonics assembly and equipment companies in Europe by acting as a universal gold standard reference

Communication & dissemination yearly report 1

Communication & dissemination yearly report Year 1

Pilot Line infrastructure inventory

Pilot Line infrastructure inventory (FIC)

Thermal management processes

Thermal management processes (TBS)

Communication & dissemination yearly report 2

Communication & dissemination yearly report year 2

Websites, patent fillings, videos etc. (5)

Project website, twitter account & social media profile
Final Communication Kit

Final communication kit to be sent to the commission as per WP4

Mid-termCommunication Kit

Communication kit to be sent to commission, as per WP4 Communication Requirements

Communication & dissemination plan

Communication & dissemination plan. Preparation of the PIXAPP data management plan (DMP), describing the data management life cycle for all datasets to be collected, processed and generated.

Project start communication kit

Communication kit to be sent to commission, as per WP4 Communication Requirements

Pubblicazioni

Conference proceedings (5)

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting

Autori: T. Hoose, M. Blaicher, J. N. Kemal, H. Zwickel, M. R. Billah, P.-I. Dietrich, A. Hofmann, W. Freude, S. Randel, C. Koos
Pubblicato in: 2018 European Conference on Optical Communication (ECOC), Numero 23-27 Sept. 2018, 2018, Pagina/e 1-3, ISBN 978-1-5386-4862-9
Editore: IEEE
DOI: 10.1109/ecoc.2018.8535258

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

Autori: C. Koos, W. Freude, S. Randel, M. R. Billah, M. Blaicher, P.-I. Dietrich, T. Hoose, Y. Xu, J. N. Kemal, A. Nesic, A. Hofmann
Pubblicato in: 2018 European Conference on Optical Communication (ECOC), Numero 23-27 Sept. 2018, 2018, Pagina/e 1-2, ISBN 978-1-5386-4862-9
Editore: IEEE
DOI: 10.1109/ecoc.2018.8535426

Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Autori: C. Koos, S. Randel, W. Freude, T. Zwick, J.C. Scheytt, J. Witzens, M. Walther, T. Harter, S. Ummethala, C. Kieninger, H. Zwickel, P. Marin-Palomo, S. Muehlbrandt, C. Fullner, J. Schaefer, S. Gudyriev, A. Zazzi, J. Muller, A. Tessmann
Pubblicato in: 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), Numero 16-19 Nov. 2020, 2020, Pagina/e 1-3, ISBN 978-1-7281-9749-4
Editore: IEEE
DOI: 10.1109/bcicts48439.2020.9392969

3D-Printed Optics for Wafer-Scale Probing

Autori: Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos
Pubblicato in: 2018 European Conference on Optical Communication (ECOC), Numero 23-27 Sept. 2018, 2018, Pagina/e 1-3, ISBN 978-1-5386-4862-9
Editore: IEEE
DOI: 10.1109/ecoc.2018.8535123

Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics

Autori: C. Koos, W. Freude, S. Randel, P.-I. Dietrich, M. Blaicher, Y. Xu, M. R. Billah, T. Hoose, M. Trappen, A. Hofmann
Pubblicato in: 2018 20th International Conference on Transparent Optical Networks (ICTON), Numero 1-5 July 2018, 2018, Pagina/e 1-2, ISBN 978-1-5386-6605-0
Editore: IEEE
DOI: 10.1109/icton.2018.8473851

Peer reviewed articles (8)

Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems

Autori: Philipp-Immanuel Dietrich, Robert J. Harris, Matthias Blaicher, Mark K. Corrigan, Tim J. Morris, Wolfgang Freude, Andreas Quirrenbach, Christian Koos
Pubblicato in: Optics Express, Numero 25/15, 2017, Pagina/e 18288, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.25.018288

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Autori: Muhammad Rodlin Billah, Matthias Blaicher, Tobias Hoose, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Nicole Lindenmann, Aleksandar Nesic, Andreas Hofmann, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Pubblicato in: Optica, Numero 5/7, 2018, Pagina/e 876, ISSN 2334-2536
Editore: Optica Publishing Group (formerly OSA)
DOI: 10.1364/optica.5.000876

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

Autori: P.-I. Dietrich, M. Blaicher, I. Reuter, M. Billah, T. Hoose, A. Hofmann, C. Caer, R. Dangel, B. Offrein, U. Troppenz, M. Moehrle, W. Freude, C. Koos
Pubblicato in: Nature Photonics, Numero 12/4, 2018, Pagina/e 241-247, ISSN 1749-4885
Editore: Nature Pub. Group
DOI: 10.1038/s41566-018-0133-4

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Autori: Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Yiyang Bao, Huanfa Peng, Muhammad Rodlin Billah, Stefan Singer, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Pubblicato in: Scientific Reports, Numero 11/1, 2021, Pagina/e 16426, ISSN 2045-2322
Editore: Nature Publishing Group
DOI: 10.1038/s41598-021-95981-w

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Autori: Matthias Blaicher, Muhammad Rodlin Billah, Juned Kemal, Tobias Hoose, Pablo Marin-Palomo, Andreas Hofmann, Yasar Kutuvantavida, Clemens Kieninger, Philipp-Immanuel Dietrich, Matthias Lauermann, Stefan Wolf, Ute Troppenz, Martin Moehrle, Florian Merget, Sebastian Skacel, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos
Pubblicato in: Light: Science & Applications, Numero 9/1, 2020, ISSN 2047-7538
Editore: Nature
DOI: 10.1038/s41377-020-0272-5

3D-printed optical probes for wafer-level testing of photonic integrated circuits

Autori: Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Colin Dankwart, Yilin Xu, Tobias Hoose, Muhammad Rodlin Billah, Amin Abbasi, Roel Baets, Ute Troppenz, Michael Theurer, Kerstin Wörhoff, Moritz Seyfried, Wolfgang Freude, Christian Koos
Pubblicato in: Optics Express, Numero 28/25, 2020, Pagina/e 37996, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.405139

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Autori: Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos
Pubblicato in: Optics Express, Numero 27/12, 2019, Pagina/e 17402, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.27.017402

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses

Autori: Yilin Xu, Artem Kuzmin, Emanuel Knehr, Matthias Blaicher, Konstantin Ilin, Philipp-Immanuel Dietrich, Wolfgang Freude, Michael Siegel, and Christian Koos
Pubblicato in: Optics Express, Numero Vol. 29, Numero 17, 2021, Pagina/e 27708-27731, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.427639

Diritti di proprietà intellettuale

Patent (1)

Fiber-less Photonic Package

Numero candidatura/pubblicazione: US 62/682,034
Data: 2018-06-07
Candidato/i: UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK