Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

Projektinformationen

WAKeMeUP

ID Finanzhilfevereinbarung: 783176

DOI

10.3030/783176

Projekt abgeschlossen

EK-Unterschriftsdatum 22 Mai 2018

Startdatum 1 Mai 2018

Enddatum 31 August 2021

Finanziert unter

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Gesamtkosten

€ 95 048 222,00

EU-Beitrag

€ 24 112 728,03

Koordiniert durch

STMICROELECTRONICS CROLLES 2 SAS
France

Periodic Reporting for period 3 - WAKeMeUP (Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors)

Berichtszeitraum: 2020-05-01 bis 2021-08-31

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

The WAKeMeUP project objective was to set up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains. The project target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM has be driven by the final application requirements as well as decreasing the power consumption.
The alternative memory solutions will also be studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.
Here under the (non exhaustive) list of the main key achievements obtained at the end of the project:
• The qualification of the pilot line 40nm eNVM which is now ready for production
• The release of a critical Tape-Out in 28nm ePCM with the Centauri1.1 and Centauri2.0
• The silicon out of Centauri1.1 and Centauri2.0
• The ePCM 28FDSOI silicon line ready for prototyping
• Many results on ePCM enhancements with RTOs and Academics
• Fisrt iteration of SVRAM test chip silicon (even if many issues has to be takkled for the second run) and second run ready
• Final selection of Librairies/ Ips (availability & maturity assessment) for the nvLP-MCU platform and simulation job fully performed
• Secure and General purpose MCU applications fully in line with requirements and demonstration ready
• RF MCU silicon out of key building blocks (after hold and re-alignment period) and final product integration done.
Globally, the project and involved researchers have demonstrated very good resilience and allow partners to reach all the project objectives.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

The first period of the WAKeMeUP project was the set-up and start-up phase. Intensive activities were conducted to set up the communication plan, the quality plan, the data management plan, several meetings and calls were necessary to adjust the project management procedure as well as the detailed discussions concerning the partners’ technical activities and collaborations. The WAKeMeUP project very quickly took its cruising speed by capitalizing on the technical collaboration network already used and reinforced by the previous project PANACHE.
During the second year of the project, activities concerning the silicon processes were focused on 2 aspects:
• Qualification of the different perimeters of the 40nm eNVM extensions (security, RF,…)
• Development of ePCM 28nm and update of the Technology Qualification Plan taking into account the first evaluation of test chips silicon.
Concerning the second activity, a full test chip was designed and manufacturing with very advances features for the PCM memory.
In parallel to the process development, several work and studies were conducted to enhance the PCM with the help of academics and research institutes and also work has been started on the equipment side. Concerning the FeRAM path, the German partners already defined the development plan and started material and architecture studies on the first samples. All these activities were supported by the work done within WP4, definition, IP design and validation as well as the test chip planning. On the application side, partners started the specification work (requirements) and the preliminary integration work as well as using first samples for system level qualification.
During the last period, the project face many challenges. On one hand to continue intensive activities of testing and characterization for final project results validation and qualification. On the other hand many activities were delayed due to the COVID-19 epidemic. The containment periods have highly reduced access to some manufacturing fabs and laboratories and delay some critical results achievements.
During the execution phase, several amendments have been released and accepted and help to re-align the initial WAKeMeUP technical program with the real progress and difficulties.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

The WakeMeUP project addresses the foreseen challenges for advanced MCUs by developing key enablers technologies. WAKeMeUP intends to provide demonstrators, in small volume, based on Advanced Non-volatile memory technologies for automotive microcontrollers, high security applications and general electronics demonstrators. Different test chip will be developed to test the technological capabilities and applicability. This implies that the project target at high Technology Readiness Level TRL (3 to 8) for the pilot line of 40nm MCU and 28nm FDSOI with ePCM. Some specific actions will be developped to push the e PCM performances and to benchmark them with others e NVM memory technologies. The TRL of such development will be between 2 and 5. Most of the WAKeMeUP enabling technologies and demonstrators are foreseen to reach the TRL 7-8 level by the end of the project.

The economic impact of strengthening the Nano electronics manufacturing capabilities in Europe includes more than the direct effect in skilled wages. When the demand for Nano electronics increases, the demand for materials, services, labor, machinery and equipment required in producing silicon devices increases, setting off a ripple effect throughout the European economy. This indirect impact is effective in all other industries, particularly in the SMEs sector which is playing a key role in delivering services and equipment depending on Nano electronic devices. Moreover, the field of applications enabled by the WAKeMeUP project encompasses all aspects of the electronics industry, and the widest range of applications, from automotive, to secure payments, and all kinds of smart objects, appliances…

The project will generate benefits for the involved member states, either in production facilities and or in academic know-how and it is expected to have a positive effect on the labor market. It will also benefit to the other ECSEL member states as supplier of the Pilot Line equipment or design of the devices or IP or users of the Pilot Line outputs. By establishing a new Non-Volatile Memory technology suitable for embedded and low-power applications in System-on-Chip (SoC), WAKeMeUP will positively impact many European segments of activity. Indeed, SoC applications are at the center of the European efforts towards building an added value technology platform for “More than Moore” technologies and maintain European research organizations in leading position. With appropriate technology transfers (in terms of processes, procedures and standard or even prototypes), the industries working in the following fields will find potential interest of the outreached activities from WAKeMeUP:
-Green technology thanks to precise industry processes, smart agriculture and farming.
-Health and biomedical applications (telemedicine or biomolecule sensing).
-Infrastructure control with tool surveillance, data security and environmental monitoring.

LOGO WAKEMEUP