Manufacturing process for ultimate performance inertial MEMS Gyroscope (MUPIA)

Leistungen

Plan for Communication, Dissemination and Exploitation of project results

This report will outline a plan for how the project will handle results obtained in the project. These results might be of public interest and thus disseminated in journals etc, while other results might be of confidential manner, in which a commercial exploitation is foreseen. The report will also make a suggestion to the project partners on how information is handled in the project.

Report on Communication, Dissemination, Exploitation actions and Business plan

Webpage

Internal and external web pages for project use.

Veröffentlichungen

Wafer bonding process for zero level vacuum packaging of MEMS

Autoren: Guido Sordo, Cristian Collini, Sigurd Moe, Erik Poppe, Daniel Nilsen Wright
Veröffentlicht in: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Seite(n) 1-4, ISBN 978-1-7281-6293-5
Herausgeber: IEEE
DOI: 10.1109/estc48849.2020.9229871

Through Silicon Vias in MEMS packaging, a review

Autoren: Guido Sordo, Cristian Collini, Sigurd Moe and Daniel Nilsen Wright
Veröffentlicht in: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2019, ISBN 978-91-519-2089-4
Herausgeber: IMAPS Nordic

Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Autoren: Daniel Nilsen Wright; Branson D. Belle; Joachim S. Graff
Veröffentlicht in: 2020, ISBN 978-0-9568086-6-0
Herausgeber: IEEE
DOI: 10.5281/zenodo.3605912

Leistungen

Veröffentlichungen

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