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A touchless microcomponent gripper for precision handling and microassembly

Project description

Levitation solution for the smallest components

Microcomponents may be very small, but they have enormous potential for large-scale applications. They are also extremely sensitive to scratching or other damage; this is why protecting them is important. The root cause of the damage is the manipulation steps using mechanical grippers or suction tools to handle the components. In this context, the EU-funded Touchless Automation project will develop a contactless solution to handle microcomponents of any shape and material to ensure they are not damaged or contaminated. Targeting the semiconductor manufacturing equipment and watchmaking industries, the project has developed the smallest solution of its kind on the market: a novel microgripper, which combines ultrasound and vacuum to make the microcomponents levitate underneath it at a distance of <50 µm.

Objective

Touchless Automation is a contactless solution to handle microcomponents of any shape & material.
It addresses the acute problem of microcomponents frequently getting damaged, contaminated, and as a result, discarded during the precision assembly processes. Our novel microgripper combines ultrasound & vacuum to make the microcomponents levitate underneath it at the distance of <50 µm. It is the smallest solution of this kind on the market.
We are targeting semiconductor manufacturing equipment & watchmaking industries for commercialization of Touchless Automation (with total addressable markets of €91.8m+ & €33.6m+ respectively). In 2017 we have generated strong market interest from other markets as well—pharmaceuticals, optoelectronics, metrology & others.
In semiconductor equipment manufacturers & watchmakers, we have already defined technological feasibility studies with our prospects (Rolex, Ciposa, Comadur) to validate characteristics of the microgripper. In the implemented studies we have seen a 18-24% reduction in microparts damage & contamination. Finally, our partner Sabato Microtec—one of the leading global high-precision micromechanics manufacturers—will back us up with expertise, a wide network of contacts & equipment to develop & scale.
In Oct 2017 we have received a PCT report that confirmed innovation over prior art, which removed the final obstacle (from a competitive patent) and gave us freedom to operate and to commercialize Touchless Automation.
With Touchless Automation we are conservatively estimating €15m+ revenues by 2021 & €26m+ by 2023. In this Phase 1 project we will produce detailed market analysis for key & adjacent market segments, validate price ranges, determine sources of additional revenue streams & define a strong IP protection strategy.

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Topic(s)

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Funding Scheme

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SME-1 - SME instrument phase 1

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-EIC-SMEInst-2018-2020

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Coordinator

TOUCHLESS AUTOMATION GMBH
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 50 000,00
Address
DAVID-MORNING-STRASSE 8
2504 BIEL/BIENNE
Switzerland

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Schweiz/Suisse/Svizzera Espace Mittelland Bern / Berne
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 71 429,00
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