Skip to main content
European Commission logo print header

GaN mm-wave Radar Components Embedded

Project description

Cost-effective radar components to mitigate the aviation’s environmental impact

More efficient air traffic management systems are key to reducing the carbon footprint of the aviation sector. Millimetre-wave radars operating in the frequency range between 93 and 100 GHz are important building blocks of enhanced flight vision systems – systems that facilitate lifting and landing in poor visibility conditions. Cost-effective surface-mounted components for building these radar systems are highly necessary. The EU-funded GRACE project will cover both circuit design and packaging of such radar components. For the circuit design, the project will use the so-called GaN HEMT monolithic microwave circuit (MMIC) technology, a type of semiconductor technology particularly suitable for generating high power at higher frequencies. A fan-out wafer-level approach will be used for MMIC packaging.

Objective

The GRACE project aims at development of surface mount technology (SMT) components for mm-wave (mmW) frequencies, with particular focus on radar systems in the W-band.

Low-cost high-performance radars are critical for future Enhanced Flight Vison System (EFVS) combining IR sensors and a mmW radar.

Key radar components are Power Amplifier (PAs) and Signal Sources (SSs), two functionalities that require high power. The most promising technology to deliver the required power levels in an area-effective package with potential to be cost-effective in volume production is a short-gate length GaN HEMT monolithic microwave integrated circuit (MMIC) technology. The GRACE project aims at utilizing the D01GH and the D006GHG processes from OMMIC, which are two only commercially open European MMIC processes with capability of delivering sufficient gain in the W frequency band.

The GRACE project also aims at packaging the designed MMICs using a fan-out wafer level (FOWL) packaging approach offered by Fraunhofer IZM. FOWL packaging (FOWLP) is one of the latest packaging trends in microelectronics with advantages such as significant package miniaturization, substrate-less package, lower thermal resistance, and higher performance with lower loss and low parasitic coupling

The specific objectives of the GRACE project are:

*Design of a 93-100 GHz Power Amplifier (PA) MMIC with an output power in the range of 500mW to 1W
*Design of a signal-source MMIC covering 93-100 GHz with state-of-the art far-carrier phase noise performance
*Development of a FOWL packaging flow for the PA MMIC
*Development of a FOWL packaging flow for the signal source MMIC

æ

Coordinator

CHALMERS TEKNISKA HOGSKOLA AB
Net EU contribution
€ 614 577,50
Address
-
412 96 Goteborg
Sweden

See on map

Region
Södra Sverige Västsverige Västra Götalands län
Activity type
Higher or Secondary Education Establishments
Links
Other funding
€ 0,00

Participants (3)