Descrizione del progetto
Componenti radar economici per mitigare l’impatto ambientale dell’aviazione
Sistemi di gestione del traffico aereo più efficienti sono fondamentali per ridurre l’impronta di carbonio del settore dell’aviazione. I radar a onde millimetriche che operano nella gamma di frequenza tra 93 e 100 GHz sono elementi costitutivi importanti dei sistemi di visione di volo avanzati, sistemi che facilitano il sollevamento e l’atterraggio in condizioni di scarsa visibilità. Componenti economici a montaggio superficiale per la costruzione di questi sistemi radar sono estremamente necessari. Il progetto GRACE, finanziato dall’UE, coprirà sia la progettazione dei circuiti che il confezionamento di tali componenti radar. Per la progettazione del circuito, il progetto utilizzerà la cosiddetta tecnologia del circuito integrato monolitico a microonde (MMIC) GaN HEMT, un tipo di tecnologia dei semiconduttori particolarmente adatta per generare alta potenza a frequenze più elevate. Per il confezionamento del MMIC verrà utilizzato un approccio fan-out a livello di wafer.
Obiettivo
The GRACE project aims at development of surface mount technology (SMT) components for mm-wave (mmW) frequencies, with particular focus on radar systems in the W-band.
Low-cost high-performance radars are critical for future Enhanced Flight Vison System (EFVS) combining IR sensors and a mmW radar.
Key radar components are Power Amplifier (PAs) and Signal Sources (SSs), two functionalities that require high power. The most promising technology to deliver the required power levels in an area-effective package with potential to be cost-effective in volume production is a short-gate length GaN HEMT monolithic microwave integrated circuit (MMIC) technology. The GRACE project aims at utilizing the D01GH and the D006GHG processes from OMMIC, which are two only commercially open European MMIC processes with capability of delivering sufficient gain in the W frequency band.
The GRACE project also aims at packaging the designed MMICs using a fan-out wafer level (FOWL) packaging approach offered by Fraunhofer IZM. FOWL packaging (FOWLP) is one of the latest packaging trends in microelectronics with advantages such as significant package miniaturization, substrate-less package, lower thermal resistance, and higher performance with lower loss and low parasitic coupling
The specific objectives of the GRACE project are:
*Design of a 93-100 GHz Power Amplifier (PA) MMIC with an output power in the range of 500mW to 1W
*Design of a signal-source MMIC covering 93-100 GHz with state-of-the art far-carrier phase noise performance
*Development of a FOWL packaging flow for the PA MMIC
*Development of a FOWL packaging flow for the signal source MMIC
Campo scientifico
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensors
- engineering and technologymechanical engineeringvehicle engineeringaerospace engineeringaircraft
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradar
- natural sciencesearth and related environmental sciencesatmospheric sciencesclimatologyclimatic changes
- social sciencessocial geographytransporttransport planningair traffic management
Programma(i)
Meccanismo di finanziamento
CS2-RIA - Research and Innovation actionCoordinatore
412 96 GOTEBORG
Svezia