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new generation of High thErmAl efficiency componenTs PACKages for space

Risultati finali

First active cooler available

First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available


A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices

Autori: Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Pubblicato in: CS MANTECH, 2022

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Autori: Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Pubblicato in: 45th International Spring Seminar on Electronics Technology (ISSE), 2022
Editore: IEEE

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging

Autori: Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Pubblicato in: ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Editore: American Chemical Society

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

Autori: Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Pubblicato in: 44th International Spring Seminar on Electronics Technology (ISSE), 2021
Editore: IEEE

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Autori: Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Pubblicato in: Microelectronics International, 2022
Editore: Emerald Publishing Limited

Multifunctional adhesives through nano-enabling for use in space

Autori: Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis
Pubblicato in: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022
Editore: ESA

High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices

Autori: Guido Spinola Durante
Pubblicato in: SWISS IEEE EPS Webinar Event, 2021
Editore: IEEE Electronics Packaging Society

Active cooling: a solution for low TCE, high thermal conductivity packages

Autori: A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James
Pubblicato in: IEEE EPS Switzerland Chapter Webinar, 2021
Editore: IEEE Electronics Packaging Society

Taking the heat out of space applications

Autori: HEATPACK consortium
Pubblicato in: EU Research, 2021
Editore: EU Research

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