new generation of High thErmAl efficiency componenTs PACKages for space

Informations projet

HEATPACK

N° de convention de subvention: 821963

DOI 10.3030/821963

Projet clôturé

Date de signature de la CE 24 Octobre 2018

Date de début 1 Janvier 2019

Date de fin 31 Mars 2023

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Coût total € 2 941 298,75

Contribution de l’UE € 2 941 298,75

Coordonné par

THALES ALENIA SPACE FRANCE SAS
France

Livrables

Documents, reports (1)

Thermally Conductive Adhesive film datasheet

Availability of a data sheet describing all the properties of the optimized products whose maturity level is sufficiently high to be marketed

Demonstrators, pilots, prototypes (1)

First active cooler available

First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available

Publications

Conference proceedings (5)

A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices

Auteurs: Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Publié dans: CS MANTECH, 2022
Éditeur: CS MANTECH

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Auteurs: Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Publié dans: 45th International Spring Seminar on Electronics Technology (ISSE), 2022
Éditeur: IEEE

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging

Auteurs: Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Publié dans: ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Éditeur: American Chemical Society

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

Auteurs: Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Publié dans: 44th International Spring Seminar on Electronics Technology (ISSE), 2021
Éditeur: IEEE

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Auteurs: Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Publié dans: Microelectronics International, 2022
Éditeur: Emerald Publishing Limited

Other (4)

Multifunctional adhesives through nano-enabling for use in space

Auteurs: Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis
Publié dans: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022
Éditeur: ESA

High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices

Auteurs: Guido Spinola Durante
Publié dans: SWISS IEEE EPS Webinar Event, 2021
Éditeur: IEEE Electronics Packaging Society

Active cooling: a solution for low TCE, high thermal conductivity packages

Auteurs: A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James
Publié dans: IEEE EPS Switzerland Chapter Webinar, 2021
Éditeur: IEEE Electronics Packaging Society

Taking the heat out of space applications

Auteurs: HEATPACK consortium
Publié dans: EU Research, 2021
Éditeur: EU Research