new generation of High thErmAl efficiency componenTs PACKages for space

Información del proyecto

HEATPACK

Identificador del acuerdo de subvención: 821963

DOI 10.3030/821963

Proyecto cerrado

Fecha de la firma de la CE 24 Octubre 2018

Fecha de inicio 1 Enero 2019

Fecha de finalización 31 Marzo 2023

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Coste total € 2 941 298,75

Aportación de la UE € 2 941 298,75

Coordinado por

THALES ALENIA SPACE FRANCE SAS
France

Resultado final

Documents, reports (1)

Thermally Conductive Adhesive film datasheet

Availability of a data sheet describing all the properties of the optimized products whose maturity level is sufficiently high to be marketed

Demonstrators, pilots, prototypes (1)

First active cooler available

First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available

Publicaciones

Conference proceedings (5)

A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices

Autores: Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Publicado en: CS MANTECH, 2022
Editor: CS MANTECH

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Autores: Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Publicado en: 45th International Spring Seminar on Electronics Technology (ISSE), 2022
Editor: IEEE

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging

Autores: Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Publicado en: ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Editor: American Chemical Society

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

Autores: Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Publicado en: 44th International Spring Seminar on Electronics Technology (ISSE), 2021
Editor: IEEE

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Autores: Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Publicado en: Microelectronics International, 2022
Editor: Emerald Publishing Limited

Other (4)

Multifunctional adhesives through nano-enabling for use in space

Autores: Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis
Publicado en: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022
Editor: ESA

High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices

Autores: Guido Spinola Durante
Publicado en: SWISS IEEE EPS Webinar Event, 2021
Editor: IEEE Electronics Packaging Society

Active cooling: a solution for low TCE, high thermal conductivity packages

Autores: A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James
Publicado en: IEEE EPS Switzerland Chapter Webinar, 2021
Editor: IEEE Electronics Packaging Society

Taking the heat out of space applications

Autores: HEATPACK consortium
Publicado en: EU Research, 2021
Editor: EU Research