A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices
Autores:
Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Publicado en:
CS MANTECH, 2022
Editor:
CS MANTECH
Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles
Autores:
Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Publicado en:
45th International Spring Seminar on Electronics Technology (ISSE), 2022
Editor:
IEEE
In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging
Autores:
Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Publicado en:
ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Editor:
American Chemical Society
Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications
Autores:
Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Publicado en:
44th International Spring Seminar on Electronics Technology (ISSE), 2021
Editor:
IEEE
Influence of Ag particle shape on mechanical and thermal properties of TIM joints
Autores:
Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Publicado en:
Microelectronics International, 2022
Editor:
Emerald Publishing Limited