Description du projet
Piloter les nouvelles technologies des systèmes électroniques
Avec la demande croissante de systèmes intelligents dans les secteurs industriel et privé, il est évident que la technologie intelligente a trouvé sa place dans l’industrie automobile. La promesse des systèmes avancés d’aide à la conduite (ADAS) et des véhicules entièrement automatisés a créé une opportunité d’avancées et de profits pour les innovateurs en matière de systèmes intelligents et de capteurs radar pour voitures intelligentes. Le projet Car2TERA, financé par l’UE, tirant parti de cette demande, fera encore davantage progresser la technologie des systèmes électroniques automobiles intelligents. Pour y parvenir, il développera de nouveaux systèmes électroniques intelligents sub‑THz en utilisant la technologie du silicium‑germanium, du silicium micro‑usiné et des technologies nanoélectroniques. Car2TERA renforcera la position de l’Europe dans le domaine des systèmes de capteurs électroniques intelligents avancés.
Objectif
The objective of Car2TERA is to develop emerging sub-THz (150-330 GHz) smart electronic systems based on latest semiconductor, microsystem and nanoelectronics technologies, and to implement TRL-4 demonstrators in two high-potential application scenarios: (1) a new class of compact, high-resolution, electronic-beam-steering short-range car radar sensors, with the primary application being in-cabin passenger monitoring (currently fastest growing car sensor market) for individually and real-time adjusted crash mitigation measures; (2) short-distance, high data-rate THz-over-plastic data links for telecommunication radio-access and backbone networks facilitating the data growth demanded by 5G and IoT.
Car2TERA combines, for the first time, the results of recent achievements in semiconductor, micro- and nanoelectronics scientific projects, including the Graphene Flagship, an ERC and several EU collaboration projects, with the following emerging THz technologies: (1) 600-GHz-fmax SiGe monolithic-microwave integrated circuits (MMICs); (2) silicon micromachining for system integration, packaging and phased-array antenna front-end; (3) integrated MEMS reconfigurability; and (4) large-bandwidth, high-linearity graphene MMICs; (4) advanced signal processing including OFDM radar signals and AI sensor fusion.
The consortium: Veoneer, world’s largest car safety equipment manufacturer; Ericsson, world leading in telecommunication systems; Infineon, world’s largest manufacturer of SiGe radar chip sets; the academic partners Chalmers and KTH, leading in MMIC design and micromachining/THz MEMS; and three SMEs leading in sub-THz technologies and 2D-materials.
With European car module manufacturers holding a market share of 79% on car radars, and European semiconductor manufacturers 90% on SiGe car-radar chip sets, this project aims at extending Europe’s success story on advanced, smart electronic sensor systems into the sub-THz frequency spectrum and into new emerging applications.
Champ scientifique
- engineering and technologynanotechnologynano-materialstwo-dimensional nanostructuresgraphene
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationstelecommunications networksdata networks
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradar
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
Mots‑clés
Programme(s)
Régime de financement
RIA - Research and Innovation actionCoordinateur
9500 Villach
Autriche
L’entreprise s’est définie comme une PME (petite et moyenne entreprise) au moment de la signature de la convention de subvention.